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Integrated Circuits (ICs)(572)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TE0808-05-9GI21-A | 1.0000 |  |
1927 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Box | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 5A002A4 | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU9EG-2FFVC900I | - | 4GB | 128MB | MPU Core | - | B2B | ||||
|
TE0803-03-4DE11-A | - | |
3131 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0803 | download | ROHS3 Compliant | Not Applicable | 1686-1181 | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU4EV-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||
 |
TE0720-03-1CF | - | |
7635 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | REACH Unaffected | 1686-1015 | EAR99 | 8471.50.0150 | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||
 |
TE0745-02-30-1I | - | |
6742 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | 1 (Unlimited) | REACH Unaffected | 1686-1046 | 3A991D | 8537.10.9160 | 1 | ARM® Cortex®-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec UFPS | ||||
|
TE0712-02-72C03-M | - | |
8151 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-72C03-M | 3A991D | 8471.50.0150 | 1 | - | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
|
TE0712-02-200-1I3 | - | |
8485 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-200-1I3 | 3A991D | 8471.50.0150 | 1 | Artix-7 A200T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
|
TE0818-01-BBE21-A | 1.0000 | |
7721 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0818-01-BBE21-A | 1 | Zynq UltraScale+ XCZU15EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
 |
TE0729-02-62I63MA | 313.9500 | |
1000 | 0.00000000 | Trenz Electronic GmbH | TE0729 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0729-02-62I63MA | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | - | 512MB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | B2B | |||
|
TE0745-02-45-3EA | - | |
3087 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Box | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0745-02-45-3EA | OBSOLETE | 1 | ARM® Cortex®-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7045) | Samtec ST5 | ||||
 |
TE0745-01-45-1C | - | |
7141 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Discontinued at SIC | 0°C ~ 70°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | Samtec UFPS | |||||
|
TE0841-02-035-1C | - | |
5472 | 0.00000000 | Trenz Electronic GmbH | TE0841 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 3A991D | 8471.50.0150 | 1 | Kintex UltraScale KU035 | - | 2GB | 64MB | FPGA Core | - | B2B | |||||
|
TE0820-03-02CG-1ED | - | |
2861 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.570" L x 1.970" W (40.00mm x 50.00mm) | download | Not Applicable | 1686-1177 | 5A002A4 | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU2CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||||
 |
TE0820-02-02CG-1EA | - | |
4042 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Discontinued at SIC | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU2CG-1SFVC784E | - | 1GB | 128MB | MPU Core | - | B2B | ||||||
|
TE0803-03-5DE11-A | - | |
2661 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0803 | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-03-5DE11-A | OBSOLETE | 1 | Zynq UltraScale+ XCZU5EV-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||
|
TE0820-05-4AE81MA | 499.0000 | |
2209 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-4AE81MA | 1 | ||||||||||||||
|
TE0835-02-MXE21-A | 5.0000 | |
3460 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 3.543" L x 2.559" W (90.00mm x 65.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0835-02-MXE21-A | 1 | Zynq™ UltraScale+™ XCZU25DR-1FFVE1156E | 1.3GHz | 4GB | 128MB | MPU Core | ARM® Cortex®-A53, ARM® Cortex®-R5 | Board-to-Board (BTB) Socket | |||||
|
TE0712-02-71I06-M | - | |
5976 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-71I06-M | 3A991D | 8471.50.0150 | 1 | - | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
|
TE0820-05-2BI21MA | 497.7000 | |
7568 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-2BI21MA | 1 | ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784I | Pin(s) | |||||||
|
TE0714-04-52I-8-A | - | |
4147 | 0.00000000 | Trenz Electronic GmbH | TE0714 | Bulk | Active | -40°C ~ 85°C | 1.570" L x 1.180" W (40.00mm x 30.00mm) | - | 1686-TE0714-04-52I-8-A | 1 | Artix-7 A50T | - | - | 16MB | FPGA | Artix-7 | - | |||||||
 |
TE0720-03-31C33MA | - | |
2639 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-31C33MA | OBSOLETE | 1 | ARM Cortex-A9 | 766MHz | 1GB | 8GB | MCU, FPGA | Zynq-7000 (Z-7014S) | Samtec LSHM | ||||
 |
TE0723-03-07S-1C | - | |
7521 | 0.00000000 | Trenz Electronic GmbH | TE0723 | Bulk | Obsolete | 0°C ~ 70°C | TE0723 | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 1686-1090 | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 766MHz | 512MB | 16MB | MCU, FPGA | Zynq-7000 (Z-7007S) | B2B | ||
 |
TE0725-02-35-2C | - | |
2776 | 0.00000000 | Trenz Electronic GmbH | TE0725 | Bulk | Discontinued at SIC | 0°C ~ 70°C | 2.870" L x 1.380" W (73.00mm x 35.00mm) | download | ROHS3 Compliant | REACH Unaffected | 1686-1020 | 3A991D | 8471.50.0150 | 1 | Artix-7 A35T | 100MHz | - | 32MB | FPGA Core | - | 50 Pin | |||
|
TE0712-02-100-2CA | - | |
2084 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-100-2CA | 3A991D | 8471.50.0150 | 1 | Artix-7 A100T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
|
TE0823-01-3PIU1FA | - | |
8145 | 0.00000000 | Trenz Electronic GmbH | TE0823 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0823-01-3PIU1FA | OBSOLETE | 1 | ARM Cortex-A53, ARM® Cortex®-R5 | - | 1GB | 128MB | MCU, FPGA | Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I | USB | ||||||
|
TE0803-02-02CG-1EA | - | |
7267 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | Not Applicable | 1686-1156 | 5A002A1 | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU2CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||||
|
TE0865-02-ABI21MA | 3.0000 | |
4677 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 3.937" L x 2.953" W (100.00mm x 75.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0865-02-ABI21MA | 1 | Zynq™ UltraScale+™ XCZU11EG-1FFVC1760I | - | 4GB | 256MB | MPU Core | - | Board-to-Board (BTB) Socket | |||||
|
TE0712-02-72C36-C | - | |
5299 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-72C36-C | 3A991D | 8471.50.0150 | 1 | Artix-7 A100T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
|
TE0808-05-9GI81-A | 1.0000 | |
1856 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-9GI81-A | 1 | ||||||||||||||
|
TE0720-03-61Q43FA | - | |
9206 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-61Q43FA | OBSOLETE | 1 | ARM Cortex-A9 | 125MHz | 1GB | 4GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | ||||
|
TE0890-01-P1C-5-A | 49.3500 | |
1327 | 0.00000000 | Trenz Electronic GmbH | TE0890 | Bulk | Active | 0°C ~ 70°C | 1.060" L x 2.050" W (27.00mm x 52.00mm) | TE0890 | download | ROHS3 Compliant | Not Applicable | 1686-TE0890-01-P1C-5-A | EAR99 | 8473.30.1180 | 1 | Xilinx Spartan-7 XC7S25 | 100MHz | 64Mbit | 64Mbit | FPGA Core | - | Dual-pinout DIP-40 or 50mil 80 pin connector |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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