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Integrated Circuits (ICs)(572)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TE0720-03-31C33MA | - |  |
2639 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-31C33MA | OBSOLETE | 1 | ARM Cortex-A9 | 766MHz | 1GB | 8GB | MCU, FPGA | Zynq-7000 (Z-7014S) | Samtec LSHM | ||||
 |
TE0823-01-3PIU1MA | 698.0000 | |
2212 | 0.00000000 | Trenz Electronic GmbH | TE0823 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0823-01-3PIU1MA | 1 | ARM Cortex-A53, ARM® Cortex®-R5 | - | 1GB | 128MB | MCU, FPGA | Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I | USB | |||||||
|
TE0823-01-3PIU1FA | - | |
8145 | 0.00000000 | Trenz Electronic GmbH | TE0823 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0823-01-3PIU1FA | OBSOLETE | 1 | ARM Cortex-A53, ARM® Cortex®-R5 | - | 1GB | 128MB | MCU, FPGA | Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I | USB | ||||||
|
TE0782-02-82I33MA | 1.0000 | |
5126 | 0.00000000 | Trenz Electronic GmbH | TE0782 | Bulk | Active | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | download | Not Applicable | 1686-TE0782-02-82I33MA | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7035) | Board-to-Board (BTB) Socket | ||||||
 |
TE0725-03-100-2C | 177.4500 | |
5172 | 0.00000000 | Trenz Electronic GmbH | TE0725 | Bulk | Active | 0°C ~ 70°C | 2.870" L x 1.380" W (73.00mm x 35.00mm) | TE0725 | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Artix-7 A100T | 100MHz | - | 32MB | FPGA Core | - | 50 Pin | ||
 |
TE0841-01-040-1I | - | |
4738 | 0.00000000 | Trenz Electronic GmbH | TE0841 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Kintex UltraScale KU40 | 4GB | 32MB | FPGA Core | - | Samtec LSHM | |||||
 |
TE0741-03-410-2CF | - | |
9940 | 0.00000000 | Trenz Electronic GmbH | TE0741 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0741 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Kintex-7 410T | 200MHz | - | 32MB | FPGA Core | - | Samtec LSHM | ||
 |
TE0728-04-1Q | 567.0000 | |
7792 | 0.00000000 | Trenz Electronic GmbH | TE0728 | Bulk | Active | - | 2.360" L x 2.360" W (60.00mm x 60.00mm) | TE0728 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 1686-1067 | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | - | 512MB | 16MB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec SEM | |
|
TE0808-05-6BE21-AK | 1.0000 | |
5168 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-6BE21-AK | 1 | Zynq™ UltraScale+™ ZU6EG-E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 160 | |||||
|
TE0725-03-100-2CF | 206.5800 | |
5616 | 0.00000000 | Trenz Electronic GmbH | TE0725 | Bulk | Active | 0°C ~ 70°C | - | - | ROHS3 Compliant | Not Applicable | 1686-TE0725-03-100-2CF | 1 | Artix™ 7 XC7A100T-2CSG324C | 100MHz | 8MB | 32MB | FPGA | - | 2 x 50 Pin, RJ-45 | |||||
|
TE0835-02-TXE21-A | 9.0000 | |
5016 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 3.543" L x 2.559" W (90.00mm x 65.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0835-02-TXE21-A | 1 | Zynq™ UltraScale+™ XCZU47DR-1FFVE1156E | 1.3GHz | 4GB | 512MB | MPU Core | ARM® Cortex®-A53 | Board-to-Board (BTB) Socket | |||||
|
TE0807-03-4BE21-AK | 1.0000 | |
2448 | 0.00000000 | Trenz Electronic GmbH | TE0807 | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0807-03-4BE21-AK | 1 | Zynq™ UltraScale+™ XCZU4EG-1FBVB900E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 160 | |||||
|
AM0010-02-4AE21MA | 549.0000 | |
1138 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.205" L x 1.575" W (56.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-AM0010-02-4AE21MA | 1 | Zynq™ UltraScale+™ ZU4CG-1E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket | |||||
|
TE0808-05-BBE21-AK | 1.0000 | |
1082 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-BBE21-AK | 1 | Zynq UltraScale+ XCZU15EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 160 | |||||
|
TE0865-02-ABI21MA | 3.0000 | |
4677 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 3.937" L x 2.953" W (100.00mm x 75.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0865-02-ABI21MA | 1 | Zynq™ UltraScale+™ XCZU11EG-1FFVC1760I | - | 4GB | 256MB | MPU Core | - | Board-to-Board (BTB) Socket | |||||
|
TE0803-02-02CG-1EA | - | |
7267 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | Not Applicable | 1686-1156 | 5A002A1 | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU2CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||||
|
TE0630-02I | 214.2000 | |
3803 | 0.00000000 | Trenz Electronic GmbH | TE0630 | Bulk | Active | -40°C ~ 85°C | 1.600" L x 1.900" W (40.50mm x 47.50mm) | TE0630 | - | ROHS3 Compliant | Not Applicable | 0000.00.0000 | 1 | Spartan-6 LX-45 | 100MHz | 128MB | 8MB | FPGA, USB Core | Cypress EZ-USB FX2LP | B2B | ||||
|
TE0803-04-2AE11-A | 371.7000 | |
6277 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-2AE11-A | 1 | Zynq UltraScale+ XCZU2CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||
 |
TE0728-03-1Q | 517.6500 | |
6264 | 0.00000000 | Trenz Electronic GmbH | TE0728 | Bulk | Active | - | 2.360" L x 2.360" W (60.00mm x 60.00mm) | TE0728 | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | - | 512MB | 16MB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec SEM | |||
|
TE0715-05-73E33-A | 757.0000 | |
2344 | 0.00000000 | Trenz Electronic GmbH | TE0711 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0715-05-73E33-A | 1 | Zynq™ XC7Z030-3SBG485E | - | 1GB | 32MB | MPU Core | ARM Cortex-A9 | Board-to-Board (BTB) Socket | |||||
|
TE0841-01-035-2I | - | |
9435 | 0.00000000 | Trenz Electronic GmbH | TE0841 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Kintex UltraScale KU35 | 4GB | 32MB | FPGA Core | - | Samtec LSHM | |||||
|
TE0817-01-7AI21-A | 2.0000 | |
6747 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | -40°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0817-01-7AI21-A | 1 | Zynq UltraScale+ XCZU7CG-1FBVB900I | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
|
TE0817-01-4BE21-A | 953.0000 | |
5796 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0817-01-4BE21-A | 1 | Zynq™ UltraScale+™ XCZU4EG-1FBVB900E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
|
TE0720-03-1QC12 | - | |
6211 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-1QC12 | OBSOLETE | 1 | ARM Cortex-A9 | 125MHz | 1GB | 4GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | ||||
 |
TE0745-02-30-1I | - | |
6742 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | 1 (Unlimited) | REACH Unaffected | 1686-1046 | 3A991D | 8537.10.9160 | 1 | ARM® Cortex®-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec UFPS | ||||
 |
TE0320-00-EV02B | 222.0000 | |
1729 | 0.00000000 | Trenz Electronic GmbH | TE0320 | Bulk | Not For New Designs | 0°C ~ 70°C | 2.700" L x 1.900" W (68.00mm x 48.00mm) | TE0320 | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Spartan-3A DSP | 100MHz | 128MB | 4MB | FPGA, USB Core | Cypress EZ-USB FX2LP | B2B | |||
|
TE0712-02-81I36-AC | - | |
9897 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-81I36-AC | 3A991D | 8471.50.0150 | 1 | Artix-7 A200T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
 |
TE0803-01-03CG-1EA | - | |
1917 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Discontinued at SIC | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-1113 | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU3CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||
|
TE0803-04-3BE11-A | 513.4500 | |
9497 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-3BE11-A | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||
|
TE0808-05-9GI21-AK | 1.0000 | |
4888 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | -40°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-9GI21-AK | 1 | Zynq UltraScale+ XCZU9EG-2FFVC900I | - | 4GB | 128MB | MPU Core | - | 4 x 160 Pin |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
Wishlist (0 Items)