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Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
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TE0820-04-2BI21FL | - | 2017 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-2BI21FL | OBSOLETE | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784I | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | |||||
TE0841-02-41I21-A | 2.0000 | 3256 | 0.00000000 | Trenz Electronic GmbH | TE0841 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0841 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0841-02-41I21-A | 3A991D | 8471.50.0150 | 1 | Kintex UltraScale KU40 | - | 2GB | 64MB | MCU, FPGA | - | B2B | ||||
TE0712-02-35-2I | - | 1677 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0712 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Artix-7 A35T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | ||||
TE0820-05-3BE21ML | 534.4500 | 8388 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-3BE21ML | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E | Pin(s) | |||||||||
TE0720-03-14S-1C | - | 5617 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0720 | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 1686-1093 | EAR99 | 8471.50.0150 | 1 | ARM Cortex-A9 | 766MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7014S) | Samtec LSHM | |||
TE0803-02-03CG-1EA | - | 4624 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | - | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | Not Applicable | 1686-TE0803-02-03CG-1EA | OBSOLETE | 1 | - | - | - | - | MPU Core | - | B2B | |||||||
TE0820-05-2AI21MA | 455.7000 | 7712 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | Not Applicable | 1686-TE0820-05-2AI21MA | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784I | Pin(s) | ||||||||
TE0712-03-82C36-AW | - | 3778 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | Not Applicable | 1686-TE0712-03-82C36-AW | 1 | Artix-7 XC7A200T-2FBG484C | - | 1GB | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | ||||||||
TE0712-02-200-2C | - | 8271 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0712 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Artix-7 A200T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | ||||
TE0803-04-5DI21-A | 1.0000 | 7358 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-5DI21-A | 1 | Zynq UltraScale+ XCZU5EV-1SFVC784I | - | 4GB | 128MB | MPU Core | - | B2B | |||||||
TE0818-01-9GI21-A | 1.0000 | 5039 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | -40°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0818-01-9GI21-A | 1 | Zynq UltraScale+ XCZU9EG-2FFVC900I | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||||
TE0715-04-15-1I | - | 6056 | 0.00000000 | Trenz Electronic GmbH | TE0715 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0715 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 1686-1013 | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7015) | Samtec LSHM | |||
TE0782-02-035-2I | - | 8946 | 0.00000000 | Trenz Electronic GmbH | TE0782 | Bulk | Obsolete | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | TE0782 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7035) | Samtec QTH | |||||
TEC0850-03-15EG1E | - | 3881 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Obsolete | - | - | TEC0850 | download | Not Applicable | 1686-1163 | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU15EG-1FFVB1156E | - | 8GB | 128MB | MCU, FPGA | - | CompactPCI Serial Backplane | |||||
TEC0850-03-15EG1EA | - | 5548 | 0.00000000 | Trenz Electronic GmbH | TEC0850 | Bulk | Obsolete | - | - | TEC0850 | - | ROHS3 Compliant | Not Applicable | 1686-TEC0850-03-15EG1EA | OBSOLETE | 1 | Zynq UltraScale+ XCZU15EG-1FFVB1156E | - | 8GB | 128MB | MCU, FPGA | - | CompactPCI Serial Backplane | |||||
TE0745-02-81C31-AK | - | 3037 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-81C31-AK | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7035) | Board-to-Board (BTB) Socket - 480 | |||||||
TE0803-03-4BE21-L | - | 7953 | 0.00000000 | Trenz Electronic GmbH | * | Bulk | Active | TE0803 | - | ROHS3 Compliant | Not Applicable | 1686-TE0803-03-4BE21-L | 1 | |||||||||||||||
TE0710-02-35-2CF | 140.7000 | 4648 | 0.00000000 | Trenz Electronic GmbH | TE0710 | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0710 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Artix-7 A35T | 100MHz | 512MB | 32MB | FPGA Core | - | Samtec LSHM | ||||
S00005-02 | - | 5503 | 0.00000000 | Trenz Electronic GmbH | * | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-S00005-02 | 1 | ||||||||||||||||
TE0722-02I | 114.4500 | 24 | 0.00000000 | Trenz Electronic GmbH | TE0722 | Bulk | Active | -40°C ~ 85°C | 0.710" L x 2.010" W (18.00mm x 51.00mm) | TE0722 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 1686-1018 | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 33MHz | - | 16MB | MCU, FPGA | Zynq-7000 (Z-7010) | 40 Pin | |||
TE0820-05-4DE81MA | 622.0000 | 6570 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-4DE81MA | 1 | ||||||||||||||||
TE0745-02-30-1IA | - | 4168 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | 1 (Unlimited) | 1686-1108 | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec UFPS | |||||||
AM0010-02-4DE21MA | 673.0000 | 8421 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.220" L x 1.575" W (56.40mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-AM0010-02-4DE21MA | 1 | Zynq™ UltraScale+™ ZU4EV | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket | |||||||
TE0741-04-G2C-1-A | 1.0000 | 1197 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-G2C-1-A | 1 | Xilinx Kintex-7 FPGA XC7K410T-2FBG676C | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | |||||||
S00014 | - | 8803 | 0.00000000 | Trenz Electronic GmbH | * | Box | Obsolete | - | ROHS3 Compliant | 1 (Unlimited) | 1686-S00014 | OBSOLETE | 1 | |||||||||||||||
TE0720-04-31C33MA | 303.4500 | 4909 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0720-04-31C33MA | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 766MHz | 1GB | 32MB | Ethernet Core | - | Board-to-Board (BTB) Socket | |||||
TE0720-04-61Q33ML | 340.2000 | 4514 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0720-04-61Q33ML | 1 | ARM® Cortex®-A9 | - | 1GB | 32MB | Ethernet Core | - | Board-to-Board (BTB) Socket | |||||||
TE0720-04-61C530A | 308.7000 | 5270 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0720-04-61C530A | 1 | ARM® Cortex®-A9 | - | 256MB | 32MB | Ethernet Core | - | Board-to-Board (BTB) Socket | |||||||
TE0720-04-62I33MA | 355.9500 | 2065 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0720-04-62I33MA | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | - | 1GB | 32MB | Ethernet Core | - | Board-to-Board (BTB) Socket | |||||
TE0820-05-4DE21MA | 655.2000 | 7365 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-4DE21MA | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E | Pin(s) |
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