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Integrated Circuits (ICs)(15545)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Base Product Number | SIC Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Total RAM Bits | Number of I/O | Number of Gates | Number of LABs/CLBs | Number of Logic Elements/Cells | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes | Programmable Type | Number of Macrocells | Delay Time tpd(1) Max | Voltage Supply - Internal | Number of Logic Elements/Blocks |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
AGFA022R31C2E1VB | 27.0000 |  |
1544 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | - | 544-AGFA022R31C2E1VB | 1 | MPU, FPGA | 720 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.2M Logic Elements | |||||||||||||||||||||
|
AGIB023R31B1E1VB | 34.0000 | |
1371 | 0.00000000 | Intel | Agilex I | Tray | Active | 0°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | - | 544-AGIB023R31B1E1VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | |||||||||||||||||||||
|
AGIB027R29A2I1VB | 46.0000 | |
5215 | 0.00000000 | Intel | Agilex I | Tray | Active | -40°C ~ 100°C (TJ) | 2957-BFBGA Exposed Pad | 2957-BGA (56x45) | - | 544-AGIB027R29A2I1VB | 1 | MPU, FPGA | 720 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.7M Logic Elements | |||||||||||||||||||||
|
AGID023R18A1E2VB | 34.0000 | |
2845 | 0.00000000 | Intel | Agilex I | Tray | Active | 0°C ~ 100°C (TJ) | 1805-BBGA Exposed Pad | 1805-BGA (42.5x42.5) | - | 544-AGID023R18A1E2VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | |||||||||||||||||||||
|
AGIB019R31B1I2VB | 28.0000 | |
1109 | 0.00000000 | Intel | Agilex I | Tray | Active | -40°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | - | 544-AGIB019R31B1I2VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | |||||||||||||||||||||
|
AGFA027R24C2I2VB | 32.0000 | |
6552 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | - | 544-AGFA027R24C2I2VB | 1 | MPU, FPGA | 744 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.7M Logic Elements | |||||||||||||||||||||
|
AGIB023R18A2I1VB | 34.0000 | |
6385 | 0.00000000 | Intel | Agilex I | Tray | Active | -40°C ~ 100°C (TJ) | 1805-BBGA Exposed Pad | 1805-BGA (42.5x42.5) | - | 544-AGIB023R18A2I1VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | |||||||||||||||||||||
|
AGFB022R31C2E1VB | 29.0000 | |
5352 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | - | 544-AGFB022R31C2E1VB | 1 | MPU, FPGA | 720 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.2M Logic Elements | |||||||||||||||||||||
|
AGIB022R31B2I1VB | 35.0000 | |
1184 | 0.00000000 | Intel | Agilex I | Tray | Active | -40°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | - | 544-AGIB022R31B2I1VB | 1 | MPU, FPGA | 720 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.2M Logic Elements | |||||||||||||||||||||
|
AGIC041R29D2E2VR1 | 55.0000 | |
8765 | 0.00000000 | Intel | Agilex I | Tray | Active | 0°C ~ 100°C (TJ) | 2957-BFBGA Exposed Pad | 2957-BGA (56x45) | - | 544-AGIC041R29D2E2VR1 | 1 | MPU, FPGA | 720 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 4M Logic Elements | |||||||||||||||||||||
|
AGIB019R31B1I1VB | 35.0000 | |
9158 | 0.00000000 | Intel | Agilex I | Tray | Active | -40°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | - | 544-AGIB019R31B1I1VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | |||||||||||||||||||||
|
AGIB023R31B1I1VB | 40.0000 | |
8269 | 0.00000000 | Intel | Agilex I | Tray | Active | -40°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | - | 544-AGIB023R31B1I1VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | |||||||||||||||||||||
 |
S82438FX | 6.8500 | |
1 | 0.00000000 | Intel | 82438FX | Bulk | Active | - | Surface Mount | 100-BQFP | Controller | Not Verified | 100-PQFP (20x14) | download | Not applicable | 3 (168 Hours) | Vendor Undefined | EAR99 | 8542.39.0001 | 1 | |||||||||||||||||||||||
|
HCGD16544EF | - | |
9594 | 0.00000000 | Intel | * | Bulk | Active | Not Verified | - | Not applicable | 3 (168 Hours) | 1 | |||||||||||||||||||||||||||||||
|
AGID019R18A2E1V | 73.0000 | |
2755 | 0.00000000 | Intel | Agilex I | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGID019R18A2E1V | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | ||||||||||||||||||||
 |
5CSXFC6D6F31I7 | 543.5668 | |
8979 | 0.00000000 | Intel | Cyclone® V SX | Tray | Active | -40°C ~ 100°C (TJ) | 896-BGA | 896-FBGA (31x31) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 965732 | 3A991D | 8542.39.0001 | 27 | MCU, FPGA | MCU - 181, FPGA - 288 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 800MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 110K Logic Elements | ||||||||||||||||
 |
EPM7128EQC160-20 | - | |
3710 | 0.00000000 | Intel | MAX® 7000 | Tray | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 160-BQFP | EPM7128 | Not Verified | 160-PQFP (28x28) | download | 3 (168 Hours) | REACH Unaffected | 972221 | 3A001A2A | 8542.39.0001 | 24 | 100 | 2500 | EE PLD | 128 | 20 ns | 4.75V ~ 5.25V | 8 | ||||||||||||||||
|
FW82801EB | 24.0000 | |
110 | 0.00000000 | Intel | Intel® E8000 | Bulk | Active | - | Surface Mount | 460-BBGA | Controller | Not Verified | 460-mBGA (31x31) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 4A994 | 8542.31.0001 | 360 | |||||||||||||||||||||||
 |
5SGSMD5H2F35C2N | - | |
1893 | 0.00000000 | Intel | Stratix® V GS | Tray | Obsolete | 0°C ~ 85°C (TJ) | Surface Mount | 1152-BBGA, FCBGA | 5SGSMD5 | Not Verified | 0.87V ~ 0.93V | 1152-FBGA (35x35) | download | RoHS Compliant | 3 (168 Hours) | 968492 | 3A001A2C | 8542.39.0001 | 24 | 39936000 | 552 | 172600 | 457000 | ||||||||||||||||||
 |
1ST250EY1F55E1VG | 78.0000 | |
6035 | 0.00000000 | Intel | Stratix® 10 TX | Tray | Active | 0°C ~ 100°C (TJ) | Surface Mount | 2912-BBGA, FCBGA | Not Verified | 0.77V ~ 0.97V | 2912-FBGA, FC (55x55) | download | 3 (168 Hours) | REACH Unaffected | 544-1ST250EY1F55E1VG | 1 | 296 | 312500 | 2500000 | ||||||||||||||||||||||
|
1SX250LH3F55I2LG | 30.0000 | |
2903 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 2912-BBGA, FCBGA | 2912-FBGA, FC (55x55) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.39.0001 | 1 | MCU, FPGA | 1160 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2500K Logic Elements | |||||||||||||||||
|
PEF55602VV21 | 1.1500 | |
10 | 0.00000000 | Intel | - | Bulk | Obsolete | Not Verified | - | RoHS non-compliant | REACH Unaffected | 2156-PEF55602VV21 | EAR99 | 8542.39.0001 | 1 | ||||||||||||||||||||||||||||
 |
EPF6016ATC100-1 | - | |
5147 | 0.00000000 | Intel | FLEX 6000 | Tray | Obsolete | 0°C ~ 85°C (TJ) | Surface Mount | 100-TQFP | EPF6016 | Not Verified | 3V ~ 3.6V | 100-TQFP (14x14) | download | 3 (168 Hours) | REACH Unaffected | 971312 | 3A001A2A | 8542.39.0001 | 90 | 81 | 16000 | 132 | 1320 | ||||||||||||||||||
|
AGFB014R24B3E3E | 21.0000 | |
1934 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFB014R24B3E3E | 1 | MPU, FPGA | 768 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.4M Logic Elements | ||||||||||||||||||||
 |
EP3SL70F484I4 | - | |
6630 | 0.00000000 | Intel | Stratix® III L | Tray | Obsolete | -40°C ~ 100°C (TJ) | Surface Mount | 484-BBGA, FCBGA | EP3SL70 | Not Verified | 0.86V ~ 1.15V | 484-FBGA (23x23) | download | RoHS Compliant | 3 (168 Hours) | 970199 | 3A001A2C | 8542.39.0001 | 60 | 2699264 | 296 | 2700 | 67500 | ||||||||||||||||||
 |
EP3C40F484C7 | 249.9642 | |
8880 | 0.00000000 | Intel | Cyclone® III | Tray | Active | 0°C ~ 85°C (TJ) | Surface Mount | 484-BGA | EP3C40 | Not Verified | 1.15V ~ 1.25V | 484-FBGA (23x23) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | 1161216 | 331 | 2475 | 39600 | ||||||||||||||||||
|
AGFC019R25A2E3V | 37.0000 | |
3750 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFC019R25A2E3V | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | ||||||||||||||||||||
|
AGFB019R31C2I1VB | 26.0000 | |
1063 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | - | 544-AGFB019R31C2I1VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | |||||||||||||||||||||
|
EPM570F256C5RR | - | |
6767 | 0.00000000 | Intel | MAX® II | Tray | Active | 0°C ~ 85°C (TJ) | Surface Mount | 256-BGA | Not Verified | 256-FBGA (17x17) | - | 3 (168 Hours) | REACH Unaffected | 90 | 160 | In System Programmable | 440 | 8.7 ns | 2.375V ~ 2.625V, 3V ~ 3.6V | 570 | |||||||||||||||||||||
 |
1SX280HN2F43I1VG | 40.0000 | |
5565 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | 1760-FBGA (42.5x42.5) | download | 3 (168 Hours) | REACH Unaffected | 544-1SX280HN2F43I1VG | 1 | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2800K Logic Elements |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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