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Memory(69470)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Technology | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Clock Frequency | Memory Type | Memory Size | Access Time | Memory Format | Memory Organization | Memory Interface | Write Cycle Time - Word, Page | SIC Programmable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
MB85RC64TAPNF-G-JNE2 | 1.6595 |  |
2234 | 0.00000000 | Kaga FEI America, Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | MB85RC64 | FRAM (Ferroelectric RAM) | 1.8V ~ 3.6V | 8-SOP | - | ROHS3 Compliant | 3 (168 Hours) | 865-MB85RC64TAPNF-G-JNE2TR | EAR99 | 8542.32.0071 | 95 | 3.4 MHz | Non-Volatile | 64Kbit | 130 ns | FRAM | 8K x 8 | I²C | - | |||
 |
DS2432P-W0A+1T | - | |
9531 | 0.00000000 | Analog Devices Inc./Maxim Integrated | - | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 6-SMD, J-Lead | DS2432 | EEPROM | 2.8V ~ 5.25V | 6-TSOC | - | ROHS3 Compliant | 175-DS2432P-W0A+1TTR | OBSOLETE | 4,000 | Non-Volatile | 1Kbit | 2 µs | EEPROM | 1K x 1 | 1-Wire® | 10ms | ||||||
 |
W66BM6NBUAFJ TR | 5.7600 | |
7715 | 0.00000000 | Winbond Electronics | - | Tape & Reel (TR) | Not For New Designs | -40°C ~ 105°C (TC) | Surface Mount | 200-WFBGA | W66BM6 | SDRAM - Mobile LPDDR4X | 1.06V ~ 1.17V, 1.7V ~ 1.95V | 200-WFBGA (10x14.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 256-W66BM6NBUAFJTR | EAR99 | 8542.32.0036 | 2,500 | 1.6 GHz | Volatile | 2Gbit | 3.5 ns | DRAM | 128M x 16 | LVSTL_11 | 18ns | ||
|
W66CP2NQUAGJ | 7.5262 | |
3125 | 0.00000000 | Winbond Electronics | - | Tray | Active | -40°C ~ 105°C (TC) | Surface Mount | 200-WFBGA | W66CP2 | SDRAM - Mobile LPDDR4 | 1.06V ~ 1.17V, 1.7V ~ 1.95V | 200-WFBGA (10x14.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 256-W66CP2NQUAGJ | EAR99 | 8542.32.0036 | 144 | 2.133 GHz | Volatile | 4Gbit | 3.5 ns | DRAM | 128M x 32 | LVSTL_11 | 18ns | ||
|
W66CQ2NQUAFJ | 9.2800 | |
98 | 0.00000000 | Winbond Electronics | - | Tray | Active | -40°C ~ 105°C (TC) | Surface Mount | 200-WFBGA | W66CQ2 | SDRAM - Mobile LPDDR4X | 1.06V ~ 1.17V, 1.7V ~ 1.95V | 200-WFBGA (10x14.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 256-W66CQ2NQUAFJ | EAR99 | 8542.32.0036 | 144 | 2.133 GHz | Volatile | 4Gbit | 3.5 ns | DRAM | 128M x 32 | LVSTL_11 | - | ||
 |
MTFC32GAZAQDW-AAT | 19.0800 | |
2752 | 0.00000000 | Micron Technology Inc. | - | Bulk | Active | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 557-MTFC32GAZAQDW-AAT | 980 | |||||||||||||||||||
|
MT29F16G08ABECBM72A3WC1L | 26.7100 | |
4582 | 0.00000000 | Micron Technology Inc. | - | Bulk | Active | 0°C ~ 70°C (TA) | Surface Mount | Die | MT29F16G08 | FLASH - NAND (SLC) | 2.7V ~ 3.6V | Wafer | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 557-MT29F16G08ABECBM72A3WC1L | 1 | Non-Volatile | 16Gbit | FLASH | 2G x 8 | - | - | ||||||
|
S29GL512S12DHE010 | 91.3500 | |
720 | 0.00000000 | Cypress Semiconductor Corp | Automotive, AEC-Q100, GL-S | Tray | Active | -55°C ~ 125°C (TA) | Surface Mount | 64-LBGA | S29GL512 | FLASH - NOR | 2.7V ~ 3.6V | 64-FBGA (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 2832-S29GL512S12DHE010 | 3A991B1A | 8542.32.0050 | 6 | Non-Volatile | 512Mbit | 120 ns | FLASH | 64M x 8 | CFI | 60ns | |||
 |
S25FL256SAGMFI003 | 17.1900 | |
14 | 0.00000000 | Cypress Semiconductor Corp | FL-S | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | S25FL256 | FLASH - NOR | 2.7V ~ 3.6V | 16-SOIC | download | 2832-S25FL256SAGMFI003-428 | 30 | 133 MHz | Non-Volatile | 256Mbit | FLASH | 32M x 8 | SPI - Quad I/O | - | Verified | |||||||
 |
S25FL512SAGBHIY10 | 19.5400 | |
262 | 0.00000000 | Cypress Semiconductor Corp | FL-S | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | S25FL512 | FLASH - NOR | 2.7V ~ 3.6V | 24-BGA (8x6) | - | 26 | 133 MHz | Non-Volatile | 512Mbit | FLASH | 64M x 8 | SPI - Quad I/O | - | Not Verified | ||||||||
 |
S25HL512TFANHI010 | 12.1400 | |
10 | 0.00000000 | Cypress Semiconductor Corp | HL-T | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | S25HL512 | FLASH - NOR | 2.7V ~ 3.6V | 8-WSON (6x8) | download | 42 | 166 MHz | Non-Volatile | 512Mbit | FLASH | 64M x 8 | SPI - Quad I/O | - | Not Verified | ||||||||
|
S25FS128SAGMFV100 | 3.7759 | |
481 | 0.00000000 | Cypress Semiconductor Corp | FS-S | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | S25FS128 | FLASH - NOR | 1.7V ~ 2V | 8-SOIC | download | RoHS non-compliant | Vendor Undefined | 1 | 133 MHz | Non-Volatile | 128Mbit | FLASH | 16M x 8 | SPI - Quad I/O, QPI | - | Not Verified | ||||||
|
S25FL127SABBHVC00 | - | |
5816 | 0.00000000 | Cypress Semiconductor Corp | FL-S | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 24-TBGA | S25FL127 | FLASH - NOR | 2.7V ~ 3.6V | 24-BGA (8x6) | download | 2832-S25FL127SABBHVC00-428 | 338 | 108 MHz | Non-Volatile | 128Mbit | FLASH | 16M x 8 | SPI - Quad I/O | - | Not Verified | |||||||
 |
S25FS128SDSMFI1D0 | 5.7400 | |
3 | 0.00000000 | Cypress Semiconductor Corp | FS-S | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | S25FS128 | FLASH - NOR | 1.7V ~ 2V | 8-SOIC | download | 88 | 80 MHz | Non-Volatile | 128Mbit | FLASH | 16M x 8 | SPI - Quad I/O, QPI | - | Not Verified | ||||||||
 |
AS6C1616B-55BIN | 8.9822 | |
4923 | 0.00000000 | Alliance Memory, Inc. | - | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-LFBGA | AS6C1616 | SRAM - Asynchronous | 2.7V ~ 3.6V | 48-TFBGA (6x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1450-AS6C1616B-55BIN | EAR99 | 8542.32.0041 | 480 | Volatile | 16Mbit | 55 ns | SRAM | 1M x 16 | Parallel | 55ns | |||
|
AS6C1616B-55BINTR | 7.9135 | |
1662 | 0.00000000 | Alliance Memory, Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-LFBGA | AS6C1616 | SRAM - Asynchronous | 2.7V ~ 3.6V | 48-TFBGA (6x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1450-AS6C1616B-55BINTR | EAR99 | 8542.32.0041 | 2,000 | Volatile | 16Mbit | 55 ns | SRAM | 1M x 16 | Parallel | 55ns | |||
 |
IS66WVO8M8DBLL-166BLI | 4.5800 | |
49 | 0.00000000 | ISSI, Integrated Silicon Solution Inc | - | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | IS66WVO8M8 | PSRAM (Pseudo SRAM) | 2.7V ~ 3.6V | 24-TFBGA (6x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 706-IS66WVO8M8DBLL-166BLI | 3A991B2A | 8542.32.0041 | 480 | 166 MHz | Volatile | 64Mbit | PSRAM | 8M x 8 | SPI - Octal I/O | 36ns | |||
|
IS66WVQ4M4DALL-200BLI | 3.4400 | |
480 | 0.00000000 | ISSI, Integrated Silicon Solution Inc | - | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | IS66WVQ4M4 | PSRAM (Pseudo SRAM) | 1.7V ~ 1.95V | 24-TFBGA (6x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 706-IS66WVQ4M4DALL-200BLI | 3A991B2A | 8542.32.0041 | 480 | 200 MHz | Volatile | 16Mbit | PSRAM | 4M x 4 | SPI - Quad I/O | 40ns | |||
|
IS66WVS4M8ALL-104NLI | 3.6600 | |
395 | 0.00000000 | ISSI, Integrated Silicon Solution Inc | - | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | IS66WVS4M8 | PSRAM (Pseudo SRAM) | 1.65V ~ 1.95V | 8-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 706-IS66WVS4M8ALL-104NLI | 3A991B2A | 8542.32.0041 | 100 | 104 MHz | Volatile | 32Mbit | 7 ns | PSRAM | 4M x 8 | SPI, QPI | - | ||
|
28294110 A | - | |
9120 | 0.00000000 | Infineon Technologies | - | Bulk | Discontinued at SIC | - | REACH Unaffected | 1 | ||||||||||||||||||||||
|
28310552 A | - | |
8490 | 0.00000000 | Infineon Technologies | - | Bulk | Discontinued at SIC | - | REACH Unaffected | 1 | ||||||||||||||||||||||
|
CG10167AAT | - | |
3802 | 0.00000000 | Infineon Technologies | - | Bulk | Discontinued at SIC | - | REACH Unaffected | 1 | ||||||||||||||||||||||
|
8 611 200 943 | - | |
4326 | 0.00000000 | Infineon Technologies | - | Bulk | Discontinued at SIC | - | REACH Unaffected | 1 | ||||||||||||||||||||||
|
IS25WJ032F-JTLE-TR | 1.1100 | |
4 | 0.00000000 | ISSI, Integrated Silicon Solution Inc | - | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 8-UDFN Exposed Pad | IS25WJ032F | FLASH - NOR | 1.65V ~ 1.95V | 8-USON (4x3) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991B1A | 8542.32.0071 | 5,000 | 133 MHz | Non-Volatile | 32Mbit | 6 ns | FLASH | 4M x 8 | SPI - Quad I/O, QPI, DTR | 1.6ms | |||
|
EM64VSUKN-BA000-2 | 37.6600 | |
494 | 0.00000000 | Delkin Devices, Inc. | - | Tray | Active | -40°C ~ 85°C | Surface Mount | 153-VFBGA | EM64VSUKN | FLASH - NAND | 3.3V | 153-FBGA (11.5x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3247-EM64VSUKN-BA000-2 | 3A991B1A | 8542.32.0071 | 1,520 | 200 MHz | Non-Volatile | 512Gbit | FLASH | 64G x 8 | eMMC | - | |||
 |
EMMC128-TY29-5B101 | 16.8700 | |
329 | 0.00000000 | Kingston | - | Tray | Active | -25°C ~ 85°C | Surface Mount | 153-BGA | EMMC128 | FLASH - NAND (TLC) | 153-FBGA (11.5x13x0.8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 3217-EMMC128-TY29-5B101 | EAR99 | 8542.31.0001 | 1 | Non-Volatile | 1Tbit | FLASH | 128G x 8 | eMMC | ||||||
 |
EMMC256-TY29-5B101 | 33.7300 | |
15 | 0.00000000 | Kingston | - | Tray | Active | -25°C ~ 85°C | Surface Mount | 153-BGA | EMMC256 | FLASH - NAND (TLC) | 153-FBGA (11.5x13x0.8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 3217-EMMC256-TY29-5B101 | EAR99 | 8542.31.0001 | 1 | Non-Volatile | 2Tbit | FLASH | 256G x 8 | eMMC | ||||||
 |
SM662GBC BFST | 27.9200 | |
5 | 0.00000000 | Silicon Motion, Inc. | Ferri-eMMC® | Tray | Active | -40°C ~ 85°C | Surface Mount | 100-LBGA | SM662 | FLASH - NAND (SLC), FLASH - NAND (TLC) | - | 100-BGA (14x18) | download | ROHS3 Compliant | 3 (168 Hours) | 3A991B1A | 8542.32.0071 | 980 | Non-Volatile | 512Gbit | FLASH | 64G x 8 | eMMC | - | ||||||
|
SM662PAF BFST | 175.4500 | |
5 | 0.00000000 | Silicon Motion, Inc. | Ferri-eMMC® | Tray | Active | -40°C ~ 105°C | Surface Mount | 153-TFBGA | FLASH - NAND (TLC) | - | 153-BGA (11.5x13) | download | ROHS3 Compliant | 3 (168 Hours) | 1984-SM662PAFBFST | 3A991B1A | 8542.32.0071 | 1,520 | Non-Volatile | - | FLASH | eMMC | - | |||||||
|
SM662GXF BFST | 173.8200 | |
5 | 0.00000000 | Silicon Motion, Inc. | Ferri-eMMC® | Tray | Active | -25°C ~ 85°C | Surface Mount | 100-LBGA | FLASH - NAND (SLC), FLASH - NAND (TLC) | - | 100-BGA (14x18) | download | ROHS3 Compliant | 3 (168 Hours) | 1984-SM662GXFBFST | 3A991B1A | 8542.32.0071 | 980 | Non-Volatile | - | FLASH | eMMC | - |
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