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Embedded(157935)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Mounting Type | Package / Case | Base Product Number | SIC Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Total RAM Bits | Number of I/O | Number of Gates | Number of LABs/CLBs | Number of Logic Elements/Cells | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Flash Size | Primary Attributes | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Programmable Type | Number of Macrocells | Module/Board Type | Co-Processor | Connector Type | Delay Time tpd(1) Max | Voltage Supply - Internal | Number of Logic Elements/Blocks |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
CY8C6245LQI-S3D62 | 7.1225 |  |
7485 | 0.00000000 | Infineon Technologies | PSoC® 6 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 68-VFQFN Exposed Pad | CY8C6245 | 68-QFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1,300 | 53 | ARM® Cortex®-M0+, ARM® Cortex®-M4F | 32-Bit Dual-Core | 100MHz, 150MHz | CANbus, FIFO, I²C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SmartCard, SPI, UART/USART, USB | Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, LCD, LVD, POR, PWM, SmartSense, WDT | 512KB (512K x 8) | FLASH | - | 256 x 8 | 1.7V ~ 3.6V | A/D 16x12b SAR, 10b Sigma-Delta; D/A 2x7/8b | External, Internal | |||||||||||||||||||||||||||||||||
 |
MK11DN512AVMC5 | 14.3100 | |
1 | 0.00000000 | NXP USA Inc. | Kinetis K10 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK11DN512 | 121-MAPBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318159557 | 5A002A1 | 8542.31.0001 | 348 | 64 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, IrDA, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 24x16b; D/A 1x12b | Internal | ||||||||||||||||||||||||||||||
 |
AT90CAN128-16AJ | - | |
3511 | 0.00000000 | Microchip Technology | AVR® 90CAN | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 64-TQFP | AT90CAN128 | 64-TQFP (14x14) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 90 | 53 | AVR | 8-Bit | 16MHz | CANbus, EBI/EMI, I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | |||||||||||||||||||||||||||||||
|
D32612D03FAV | - | |
2093 | 0.00000000 | Renesas Electronics America Inc | * | Bulk | Obsolete | D32612 | - | ROHS3 Compliant | 1 (Unlimited) | OBSOLETE | 0000.00.0000 | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||
 |
MAX32660GTGBL+ | 4.6100 | |
9801 | 0.00000000 | Analog Devices Inc./Maxim Integrated | DARWIN | Tube | Active | -40°C ~ 105°C (TA) | Surface Mount | 24-WFQFN Exposed Pad | MAX32660 | 24-TQFN (3x3) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 8542.31.0001 | 490 | 14 | ARM® Cortex®-M4F | 32-Bit Single-Core | 96MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 96K x 8 | 1.71V ~ 3.63V | - | Internal | ||||||||||||||||||||||||||||||||
 |
PIC12F1501-I/MS | 0.9600 | |
1 | 0.00000000 | Microchip Technology | PIC® 12F | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | PIC12F1501 | 8-MSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | PIC12F1501IMS | EAR99 | 8542.31.0001 | 100 | 5 | PIC | 8-Bit | 20MHz | - | Brown-out Detect/Reset, POR, PWM, WDT | 1.75KB (1K x 14) | FLASH | - | 64 x 8 | 2.3V ~ 5.5V | A/D 4x10b | Internal | ||||||||||||||||||||||||||||||
 |
MC908AP64CBE | 8.1100 | |
4 | 0.00000000 | Freescale Semiconductor | HC08 | Bulk | Active | -40°C ~ 85°C (TA) | Through Hole | 42-SDIP (0.600", 15.24mm) | MC908 | 42-PDIP | download | ROHS3 Compliant | 3 (168 Hours) | Vendor Undefined | EAR99 | 8542.31.0001 | 1 | 30 | HC08 | 8-Bit | 8MHz | I²C, IRSCI, SCI, SPI | LED, LVD, POR, PWM | 64KB (64K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | |||||||||||||||||||||||||||||||
|
DRA733BHGABCRQ1 | - | |
4311 | 0.00000000 | Texas Instruments | - | Bulk | Active | - | ROHS3 Compliant | 3 (168 Hours) | 296-DRA733BHGABCRQ1 | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
Z8F082APB020EG | 4.4600 | |
5161 | 0.00000000 | Zilog | Encore!® XP® | Tube | Active | -40°C ~ 105°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | Z8F082 | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.31.0001 | 50 | 6 | eZ8 | 8-Bit | 20MHz | IrDA, UART/USART | Brown-out Detect/Reset, LED, LVD, POR, PWM, Temp Sensor, WDT | 8KB (8K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 3.6V | A/D 4x10b | Internal | ||||||||||||||||||||||||||||||||
 |
MB90F022CPF-GS-9207 | - | |
6502 | 0.00000000 | Infineon Technologies | - | Tray | Discontinued at SIC | - | - | MB90F022 | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 0000.00.0000 | 66 | - | - | - | - | - | - | - | - | - | - | - | - | |||||||||||||||||||||||||||||||||||
 |
MK51DX256CLL10 | - | |
4372 | 0.00000000 | Freescale Semiconductor | * | Bulk | Active | MK51DX256 | download | 3 (168 Hours) | REACH Unaffected | 2156-MK51DX256CLL10-600055 | 3A991A2 | 8542.31.0001 | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||
 |
PIC16F15354-E/5NVAO | - | |
4810 | 0.00000000 | Microchip Technology | Automotive, AEC-Q100, PIC® XLP™ 16F | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 28-VQFN Exposed Pad | PIC16F15354 | 28-VQFN (6x6) | - | 1 (Unlimited) | REACH Unaffected | 150-PIC16F15354-E/5NVAO | 0000.00.0000 | 61 | 25 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 7KB (4K x 14) | FLASH | - | 512 x 8 | 2.3V ~ 5.5V | A/D 24x10b; D/A 1x5b | Internal | ||||||||||||||||||||||||||||||||
 |
XA6SLX45-3FGG484Q | 167.7000 | |
5390 | 0.00000000 | AMD | Automotive, AEC-Q100, Spartan®-6 LX XA | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 484-BBGA | XA6SLX45 | Not Verified | 1.14V ~ 1.26V | 484-FBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A001A7B | 8542.39.0001 | 1 | 2138112 | 316 | 3411 | 43661 | ||||||||||||||||||||||||||||||||||||||
|
IDT79RV4700-100GH | - | |
5131 | 0.00000000 | Renesas Electronics America Inc | - | Tube | Obsolete | 0°C ~ 85°C (TC) | Through Hole | 179-PGA | IDT79RV4700 | 179-PGA | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 79RV4700-100GH | 3A991A2 | 8542.31.0001 | 10 | MIPS-I | 100MHz | 1 Core, 64-Bit | System Control; CP0 | - | No | - | - | - | - | 3.3V | - | - | ||||||||||||||||||||||||||||||
 |
MC9S12C32MFAE16 | - | |
6631 | 0.00000000 | Freescale Semiconductor | HCS12 | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | MC9S12 | 48-LQFP (7x7) | download | EAR99 | 8542.31.0001 | 1 | 31 | HCS12 | 16-Bit | 16MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 2.35V ~ 5.5V | A/D 8x10b | Internal | ||||||||||||||||||||||||||||||||||
|
AGFB014R24B2I3V | 31.0000 | |
5460 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFB014R24B2I3V | 1 | MPU, FPGA | 768 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.4M Logic Elements | ||||||||||||||||||||||||||||||||||||||||
|
R7F7015453AFP#AA2 | - | |
8352 | 0.00000000 | Renesas Electronics America Inc | - | Tray | Active | R7F7015453 | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 559-R7F7015453AFP#AA2 | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||
 |
5ASXBB3D4F31C4G | 2.0000 | |
7890 | 0.00000000 | Intel | Arria V SX | Tray | Active | 0°C ~ 85°C (TJ) | 896-BBGA, FCBGA | 896-FBGA (31x31) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 544-5ASXBB3D4F31C4G | 27 | MCU, FPGA | MCU - 208, FPGA - 250 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 925MHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 350K Logic Elements | ||||||||||||||||||||||||||||||||||||||
 |
EPF10K100ABC356-3N | - | |
9670 | 0.00000000 | Intel | FLEX-10KA® | Tray | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 356-LBGA | EPF10K100 | Not Verified | 3V ~ 3.6V | 356-BGA (35x35) | download | 3 (168 Hours) | REACH Unaffected | 972763 | 3A001A2A | 8542.39.0001 | 24 | 24576 | 274 | 158000 | 624 | 4992 | |||||||||||||||||||||||||||||||||||||
 |
R5F10366DSP#35 | - | |
1516 | 0.00000000 | Renesas Electronics America Inc | RL78/G12 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-LSSOP (0.173", 4.40mm Width) | R5F10366 | 20-LSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 80 | 14 | RL78 | 16-Bit | 24MHz | CSI, I²C, UART/USART | LVD, POR, PWM, WDT | 2KB (2K x 8) | FLASH | - | 256 x 8 | 1.8V ~ 5.5V | A/D 11x8/10b | Internal | |||||||||||||||||||||||||||||||
 |
CY9AF131LAPMC-G-SNE2 | - | |
6385 | 0.00000000 | Infineon Technologies | - | Tray | Obsolete | CY9AF131 | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 119 | |||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY8C6347BZI-BLD34 | 9.8314 | |
9839 | 0.00000000 | Infineon Technologies | PSoC® 6 BLE | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 124-VFBGA | 124-VFBGA (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | 1,300 | 84 | ARM® Cortex®-M0+, ARM® Cortex®-M4F | 32-Bit Dual-Core | 100MHz, 150MHz | FIFO, I²C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART, USB | Brown-out Detect/Reset, CapSense, DMA, I²S, LCD, LVD, POR, PWM, Temp Sensor, WDT | 1MB (1M x 8) | FLASH | - | 288K x 8 | 1.7V ~ 3.6V | A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1x8/12b | External, Internal | |||||||||||||||||||||||||||||||||||
 |
TE0803-01-02EG-1EA | - | |
1133 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Discontinued at SIC | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | download | Not Applicable | 1686-1112 | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||||||||||||||||||||||||||||||||||||||
 |
MPC8543VUANG | - | |
3091 | 0.00000000 | NXP USA Inc. | MPC85xx | Tray | Obsolete | 0°C ~ 105°C (TA) | Surface Mount | 783-BBGA, FCBGA | MPC85 | 783-FCBGA (29x29) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.31.0001 | 1 | PowerPC e500 | 800MHz | 1 Core, 32-Bit | Signal Processing; SPE | DDR, DDR2, SDRAM | No | - | 10/100/1000Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | - | DUART, I²C, PCI, RapidIO | |||||||||||||||||||||||||||||||
 |
MB90025FPMT-GS-292E1 | - | |
4555 | 0.00000000 | Infineon Technologies | - | Tray | Obsolete | - | Surface Mount | 120-LQFP | MB90025 | 120-LQFP (16x16) | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 84 | - | - | - | - | - | - | - | - | - | - | - | - | ||||||||||||||||||||||||||||||||
 |
10CL080YF484I7G | 137.9700 | |
2121 | 0.00000000 | Intel | Cyclone® 10 LP | Tray | Active | -40°C ~ 100°C (TJ) | Surface Mount | 484-BGA | Not Verified | 1.2V | 484-FBGA (23x23) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | 2810880 | 289 | 5079 | 81264 | |||||||||||||||||||||||||||||||||||||||
 |
10AX090H4F34I3LG | 6.0000 | |
8075 | 0.00000000 | Intel | Arria 10 GX | Tray | Active | -40°C ~ 100°C (TJ) | Surface Mount | 1152-BBGA, FCBGA | Not Verified | 0.87V ~ 0.93V | 1152-FCBGA (35x35) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 973611 | 3A001A7A | 8542.39.0001 | 1 | 59234304 | 504 | 339620 | 900000 | ||||||||||||||||||||||||||||||||||||||
|
TC397XP256F300SBDLXUMA2 | 188.7480 | |
9814 | 0.00000000 | Infineon Technologies | AURIX™ | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | Surface Mount | 292-LFBGA | PG-LFBGA-292-10 | download | ROHS3 Compliant | 448-TC397XP256F300SBDLXUMA2TR | 1,000 | TriCore™ | 32-Bit 10-Core | 300MHz | ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT | DMA, LVDS, PWM, WDT | 16MB (16M x 8) | FLASH | 128K x 8 | 2.52M x 8 | 2.97V ~ 5.5V | - | Internal | ||||||||||||||||||||||||||||||||||||
|
LX2160SC72232B | 721.9100 | |
17 | 0.00000000 | NXP Semiconductors | QorlQ LX2 | Bulk | Active | 0°C ~ 105°C (TJ) | Surface Mount | 1517-BBGA, FCBGA | 1517-FCPBGA (40x40) | - | 2156-LX2160SC72232B | 1 | ARM® Cortex®-A72 | 2.2GHz | 16 Core, 64-Bit | - | DDR4 SDRAM | Yes | - | 100Gbps (2) | SATA 3.0 (4) | USB 3.0 (2) + PHY (2) | 1.2V, 1.8V, 3.3V | Secure Boot, TrustZone® | CANbus, I²C, MMC/SD, SPI, UART | ||||||||||||||||||||||||||||||||||||
|
ISPLSI 5512VA-110LB272 | - | |
5366 | 0.00000000 | Lattice Semiconductor Corporation | ispLSI® 5000VA | Tray | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 272-BBGA | ISPLSI 5512VA | Not Verified | 272-BGA (27x27) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 40 | 192 | 24000 | In System Programmable | 512 | 8.5 ns | 3V ~ 3.6V | 16 |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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