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Embedded(157935)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | SIC Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | ECCN | HTSUS | Standard Package | Architecture | Total RAM Bits | Number of I/O | Number of Gates | Number of LABs/CLBs | Number of Logic Elements/Cells | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
M2S050-1FG484 | 156.2973 |  |
9683 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 484-BGA | M2S050 | 484-FPBGA (23x23) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | 267 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 50K Logic Modules | ||||||||
 |
M2S050-1FGG896 | 189.6244 | |
1880 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 896-BGA | M2S050 | 896-FBGA (31x31) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 27 | MCU, FPGA | 377 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 50K Logic Modules | ||||||||
|
M2S050-FG896 | 151.7182 | |
2404 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 896-BGA | M2S050 | 896-FBGA (31x31) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 27 | MCU, FPGA | 377 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 50K Logic Modules | ||||||||
 |
M2S050S-1VFG400I | - | |
9221 | 0.00000000 | Microsemi Corporation | SmartFusion®2 | Tray | Obsolete | -40°C ~ 100°C (TJ) | 400-LFBGA | M2S050S | 400-VFBGA (17x17) | download | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.39.0001 | 90 | MCU, FPGA | 207 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 50K Logic Modules | |||||||||
|
M2S050T-1VFG400I | 179.0236 | |
3857 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 400-LFBGA | M2S050 | 400-VFBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | 207 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 50K Logic Modules | ||||||||
 |
M2S090TS-1FG676I | 404.4878 | |
3972 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 676-BGA | M2S090 | 676-FBGA (27x27) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.39.0001 | 40 | MCU, FPGA | 425 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 90K Logic Modules | ||||||||
 |
M2S100-1FC1152 | - | |
6555 | 0.00000000 | Microsemi Corporation | SmartFusion®2 | Tray | Obsolete | 0°C ~ 85°C (TJ) | 1152-BBGA, FCBGA | M2S100 | 1152-FCBGA (35x35) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A001A7A | 8542.39.0001 | 24 | MCU, FPGA | 574 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 100K Logic Modules | ||||||||
|
M2S100T-1FC1152I | - | |
9695 | 0.00000000 | Microsemi Corporation | SmartFusion®2 | Tray | Obsolete | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | M2S100T | 1152-FCBGA (35x35) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A001A7A | 8542.39.0001 | 24 | MCU, FPGA | 574 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 100K Logic Modules | ||||||||
|
M2S150TS-1FC1152I | 635.1642 | |
7425 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | M2S150 | 1152-FCBGA (35x35) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.39.0001 | 24 | MCU, FPGA | 574 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 150K Logic Modules | ||||||||
|
M2S050TS-1VF400I | 196.9383 | |
6148 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 400-LFBGA | M2S050 | 400-VFBGA (17x17) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.39.0001 | 90 | MCU, FPGA | 207 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 50K Logic Modules | ||||||||
|
M2GL100-1FC1152 | - | |
5368 | 0.00000000 | Microsemi Corporation | IGLOO2 | Tray | Obsolete | 0°C ~ 85°C (TJ) | Surface Mount | 1152-BBGA, FCBGA | M2GL100 | Not Verified | 1.14V ~ 2.625V | 1152-FCBGA (35x35) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A001A7A | 8542.39.0001 | 24 | 3637248 | 574 | 99512 | |||||||||||
|
M2S050T-1FG484 | 168.8057 | |
2783 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 484-BGA | M2S050 | 484-FPBGA (23x23) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | 267 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 50K Logic Modules | ||||||||
|
M2GL090-FG484 | 194.4300 | |
9137 | 0.00000000 | Microchip Technology | IGLOO2 | Tray | Active | 0°C ~ 85°C (TJ) | Surface Mount | 484-BGA | M2GL090 | Not Verified | 1.14V ~ 2.625V | 484-FPBGA (23x23) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | 2648064 | 267 | 86316 | |||||||||||
|
M2GL090T-1FG676 | 268.0800 | |
9470 | 0.00000000 | Microchip Technology | IGLOO2 | Tray | Active | 0°C ~ 85°C (TJ) | Surface Mount | 676-BGA | M2GL090 | Not Verified | 1.14V ~ 2.625V | 676-FBGA (27x27) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 40 | 2648064 | 425 | 86316 | |||||||||||
 |
M2GL090T-FGG484 | 213.8850 | |
2308 | 0.00000000 | Microchip Technology | IGLOO2 | Tray | Active | 0°C ~ 85°C (TJ) | Surface Mount | 484-BGA | M2GL090 | Not Verified | 1.14V ~ 2.625V | 484-FPBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | 2648064 | 267 | 86316 | |||||||||||
 |
M7AFS600-1PQG208 | - | |
7711 | 0.00000000 | Microsemi Corporation | Fusion® | Tray | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 208-BFQFP | M7AFS600 | Not Verified | 1.425V ~ 1.575V | 208-PQFP (28x28) | - | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 24 | 110592 | 95 | 600000 | ||||||||||||
|
M7AFS600-2FGG484I | 514.1400 | |
5664 | 0.00000000 | Microchip Technology | Fusion® | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 484-BGA | M7AFS600 | Not Verified | 1.425V ~ 1.575V | 484-FPBGA (23x23) | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | 110592 | 172 | 600000 | |||||||||||
 |
M7AFS600-FGG256 | 266.8200 | |
4522 | 0.00000000 | Microchip Technology | Fusion® | Tray | Active | 0°C ~ 70°C (TA) | Surface Mount | 256-LBGA | M7AFS600 | Not Verified | 1.425V ~ 1.575V | 256-FPBGA (17x17) | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | 110592 | 119 | 600000 | |||||||||||
|
M7AFS600-FGG484 | 294.9150 | |
7178 | 0.00000000 | Microchip Technology | Fusion® | Tray | Active | 0°C ~ 70°C (TA) | Surface Mount | 484-BGA | M7AFS600 | Not Verified | 1.425V ~ 1.575V | 484-FPBGA (23x23) | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | 110592 | 172 | 600000 | |||||||||||
|
M7AFS600-2FG484I | 514.1400 | |
1392 | 0.00000000 | Microchip Technology | Fusion® | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 484-BGA | M7AFS600 | Not Verified | 1.425V ~ 1.575V | 484-FPBGA (23x23) | - | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | 110592 | 172 | 600000 | |||||||||||
|
A54SX72A-1PQG208M | 4.0000 | |
7076 | 0.00000000 | Microchip Technology | SX-A | Tray | Active | -55°C ~ 125°C (TC) | Surface Mount | 208-BFQFP | A54SX72 | Not Verified | 2.25V ~ 5.25V | 208-PQFP (28x28) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A001A2C | 8542.39.0001 | 24 | 171 | 108000 | 6036 | |||||||||||
|
5962-0151801QXC | - | |
7681 | 0.00000000 | Microchip Technology | SX-A | Bulk | Active | -55°C ~ 125°C (TJ) | Surface Mount | 256-BFCQFP with Tie Bar | 5962-0151801 | Not Verified | 2.25V ~ 5.25V | 256-CQFP (75x75) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A001A2C | 8542.39.0001 | 1 | 203 | 48000 | 2880 | |||||||||||
|
5962-9215602MYA | - | |
9097 | 0.00000000 | Microsemi Corporation | ACT™ 2 | Bulk | Obsolete | -55°C ~ 125°C (TJ) | Surface Mount | 172-CQFP with Tie Bar | 5962-92156 | Not Verified | 4.5V ~ 5.5V | 172-CQFP (63.37x63.37) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A001A2C | 8542.39.0001 | 1 | 140 | 8000 | 1232 | |||||||||||
 |
A2F500M3G-1FGG256M | 1.0000 | |
1741 | 0.00000000 | Microchip Technology | SmartFusion® | Tray | Active | -55°C ~ 125°C (TJ) | 256-LBGA | A2F500 | 256-FPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A001A2C | 8542.39.0001 | 90 | MCU, FPGA | MCU - 25, FPGA - 66 | ARM® Cortex®-M3 | 100MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 512KB | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | ||||||||
|
A2F500M3G-1FGG484M | 1.0000 | |
3660 | 0.00000000 | Microchip Technology | SmartFusion® | Tray | Active | -55°C ~ 125°C (TJ) | 484-BGA | A2F500 | 484-FPBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A001A2C | 8542.39.0001 | 60 | MCU, FPGA | MCU - 41, FPGA - 128 | ARM® Cortex®-M3 | 100MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 512KB | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | ||||||||
 |
A3P1000-FG144M | 290.0700 | |
7903 | 0.00000000 | Microchip Technology | ProASIC3 | Tray | Active | -55°C ~ 125°C (TJ) | Surface Mount | 144-LBGA | A3P1000 | Not Verified | 1.425V ~ 1.575V | 144-FPBGA (13x13) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A001A2C | 8542.39.0001 | 160 | 147456 | 97 | 1000000 | |||||||||||
|
A3P1000-PQ208M | - | |
4530 | 0.00000000 | Microchip Technology | ProASIC3 | Tray | Obsolete | -55°C ~ 125°C (TJ) | Surface Mount | 208-BFQFP | A3P1000 | Not Verified | 1.425V ~ 1.575V | 208-PQFP (28x28) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A001A2C | 8542.39.0001 | 24 | 147456 | 154 | 1000000 | |||||||||||
|
A3PE3000L-FGG896M | - | |
6041 | 0.00000000 | Microchip Technology | ProASIC3L | Tray | Active | -55°C ~ 125°C (TJ) | Surface Mount | 896-BGA | A3PE3000 | Not Verified | 1.425V ~ 1.575V | 896-FBGA (31x31) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A001A2C | 8542.39.0001 | 27 | 516096 | 620 | 3000000 | |||||||||||
|
A3PE600L-1FG484M | - | |
1211 | 0.00000000 | Microchip Technology | ProASIC3EL | Tray | Active | -55°C ~ 125°C (TJ) | Surface Mount | 484-BGA | A3PE600 | Not Verified | 1.425V ~ 1.575V | 484-FPBGA (23x23) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A001A2C | 8542.39.0001 | 60 | 110592 | 270 | 600000 | |||||||||||
|
APA300-FGG144M | 638.3700 | |
5450 | 0.00000000 | Microchip Technology | ProASICPLUS | Tray | Active | -55°C ~ 125°C (TC) | Surface Mount | 144-LBGA | APA300 | Not Verified | 2.3V ~ 2.7V | 144-FPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A001A2C | 8542.39.0001 | 160 | 73728 | 100 | 300000 |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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