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Embedded(157935)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Size / Dimension | Mounting Type | Package / Case | Type | Base Product Number | SIC Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Total RAM Bits | Number of I/O | Number of Gates | Number of LABs/CLBs | Number of Logic Elements/Cells | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface | Flash Size | Primary Attributes | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Programmable Type | Number of Macrocells | Module/Board Type | Co-Processor | Connector Type | Delay Time tpd(1) Max | Voltage Supply - Internal | Number of Logic Elements/Blocks | Clock Rate | Non-Volatile Memory | On-Chip RAM | Voltage - Core | Controller Series | SIC Programmable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
R5F571MLGDLJ#20 | 16.6837 |  |
3482 | 0.00000000 | Renesas Electronics America Inc | RX71M | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-TFLGA | R5F571 | 100-TFLGA (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 416 | 78 | RXv2 | 32-Bit Single-Core | 240MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG | DMA, LVD, POR, PWM, WDT | 4MB (4M x 8) | FLASH | 64K x 8 | 512K x 8 | 2.7V ~ 3.6V | A/D 8x12b, 14x12b; D/A 1x12 | Internal | ||||||||||||||||||||||||||||||||||||||||
 |
AT97SC3205T-X3A1C10B | 4.0000 | |
2919 | 0.00000000 | Microchip Technology | - | Tube | Active | 0°C ~ 70°C | Trusted Platform Module (TPM) | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) | AT97SC3205 | Not Verified | 3.3V | 28-TSSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 5A992C | 8542.39.0001 | 50 | 4 | AVR | EEPROM | - | I²C | - | ||||||||||||||||||||||||||||||||||||||||||||
 |
R5F61665D50FPV | 26.5012 | |
5614 | 0.00000000 | Renesas Electronics America Inc | H8® H8SX/1600 | Tray | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | R5F61665 | 144-LFQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 60 | 92 | H8SX | 32-Bit Single-Core | 50MHz | EBI/EMI, I²C, IrDA, SCI, SmartCard, USB | DMA, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 40K x 8 | 3V ~ 3.6V | A/D 8x10b; D/A 2x10b | External | ||||||||||||||||||||||||||||||||||||||||
 |
EPF10K130EFC672-2X | - | |
7742 | 0.00000000 | Intel | FLEX-10KE® | Tray | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 672-BBGA | EPF10K130 | Not Verified | 2.375V ~ 2.625V | 672-FBGA (27x27) | download | 3 (168 Hours) | REACH Unaffected | 973308 | 3A001A2A | 8542.39.0001 | 40 | 65536 | 413 | 342000 | 832 | 6656 | ||||||||||||||||||||||||||||||||||||||||||||||
 |
S912ZVC96AMLF | 4.3513 | |
3334 | 0.00000000 | NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | 48-LQFP (7x7) | - | ROHS3 Compliant | 568-S912ZVC96AMLF | 1,250 | 28 | S12Z | 16-Bit | 32MHz | CANbus, I²C, SCI, SPI | DMA, LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 2K x 8 | 8K x 8 | 5.5V ~ 18V | A/D 10x10b SAR | External, Internal | ||||||||||||||||||||||||||||||||||||||||||||
 |
LPC1113FHN33/301,5 | 3.1042 | |
8979 | 0.00000000 | NXP USA Inc. | LPC1100 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-VQFN Exposed Pad | LPC1113 | 32-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 260 | 28 | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 24KB (24K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | ||||||||||||||||||||||||||||||||||||||||
 |
PIC16F877-04E/P | 9.7440 | |
3025 | 0.00000000 | Microchip Technology | PIC® 16F | Tube | Active | -40°C ~ 125°C (TA) | Through Hole | 40-DIP (0.600", 15.24mm) | PIC16F877 | 40-PDIP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.31.0001 | 10 | 33 | PIC | 8-Bit | 4MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 14KB (8K x 14) | FLASH | 256 x 8 | 368 x 8 | 4V ~ 5.5V | A/D 8x10b | External | ||||||||||||||||||||||||||||||||||||||||
 |
OR3T1256PS208I-DB | 138.6000 | |
52 | 0.00000000 | Lattice Semiconductor Corporation | ORCA™3C | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 208-BFQFP Exposed Pad | Not Verified | 3V ~ 3.6V | 208-SQFP2 (28x28) | download | Not applicable | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 1 | 102400 | 171 | 186000 | 6272 | ||||||||||||||||||||||||||||||||||||||||||||||||
 |
MCF5329CVM240557 | - | |
7023 | 0.00000000 | NXP USA Inc. | * | Bulk | Active | download | Not applicable | 3 (168 Hours) | Vendor Undefined | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
ISPLSI 2032E-135LJ44 | - | |
6751 | 0.00000000 | Lattice Semiconductor Corporation | ispLSI® 2000E | Tube | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 44-LCC (J-Lead) | ISPLSI 2032E | Not Verified | 44-PLCC (16.59x16.59) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 26 | 32 | 1000 | In System Programmable | 32 | 7.5 ns | 4.75V ~ 5.25V | 8 | |||||||||||||||||||||||||||||||||||||||||||||
 |
AFS250-2QNG180 | - | |
5781 | 0.00000000 | Microsemi Corporation | Fusion® | Tray | Obsolete | 0°C ~ 85°C (TJ) | Surface Mount | 180-WFQFN Dual Rows, Exposed Pad | AFS250 | Not Verified | 1.425V ~ 1.575V | 180-QFN (10x10) | download | 3 (168 Hours) | 3A991D | 8542.39.0001 | 184 | 36864 | 65 | 250000 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
A3P400-FG144 | - | |
4249 | 0.00000000 | Microchip Technology | ProASIC3 | Tray | Active | 0°C ~ 85°C (TJ) | Surface Mount | 144-LBGA | A3P400 | Not Verified | 1.425V ~ 1.575V | 144-FPBGA (13x13) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 160 | 55296 | 97 | 400000 | ||||||||||||||||||||||||||||||||||||||||||||||||
 |
PIC24EP64MC203-I/TL | - | |
8415 | 0.00000000 | Microchip Technology | PIC® 24EP | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 36-VFTLA Exposed Pad | PIC24EP64MC203 | 36-VTLA (5x5) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 73 | 25 | PIC | 16-Bit | 70 MIPs | I²C, IrDA, LINbus, QEI, SPI, UART/USART | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT | 64KB (22K x 24) | FLASH | - | 4K x 16 | 3V ~ 3.6V | A/D 8x10b/12b | Internal | ||||||||||||||||||||||||||||||||||||||||
 |
MCIMX512CJM6CR2 | 46.8123 | |
8360 | 0.00000000 | NXP USA Inc. | i.MX51 | Tape & Reel (TR) | Active | -40°C ~ 95°C (TC) | Surface Mount | 529-LFBGA | MCIMX512 | 529-BGA (19x19) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324332518 | 5A992C | 8542.31.0001 | 750 | ARM® Cortex®-A8 | 600MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR, DDR2 | No | Keypad, LCD | 10/100Mbps (1) | - | USB 2.0 (3), USB 2.0 + PHY (1) | 1.2V, 1.875V, 2.775V, 3.0V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | 1-Wire, AC'97, I²C, I²S, MMC/SD, SPI, SSI, UART | |||||||||||||||||||||||||||||||||||||||
 |
UPSD3454EB40T6 | - | |
3976 | 0.00000000 | STMicroelectronics | µPSD | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 52-LQFP | UPSD34 | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 497-5667 | 3A991A2 | 8542.31.0001 | 160 | 35 | 8032 | 8-Bit | 40MHz | I²C, IrDA, SPI, UART/USART, USB | LVD, POR, PWM, WDT | 288KB (288K x 8) | FLASH | - | 32K x 8 | 3V ~ 5.5V | A/D 8x10b | Internal | ||||||||||||||||||||||||||||||||||||||||
 |
S912XEQ384BCAG | 16.9492 | |
5452 | 0.00000000 | NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | S912 | 144-LQFP (20x20) | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317945557 | 3A991A2 | 8542.31.0001 | 60 | 119 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 384KB (384K x 8) | FLASH | 4K x 8 | 24K x 8 | 1.72V ~ 5.5V | A/D 24x12b | External | |||||||||||||||||||||||||||||||||||||||
 |
MSC8156SVT1000B | 202.0200 | |
1 | 0.00000000 | Freescale Semiconductor | StarCore | Tray | Obsolete | 0°C ~ 105°C (TJ) | Surface Mount | 783-BBGA, FCBGA | SC3850 Six Core | 783-FCPBGA (29x29) | download | ROHS3 Compliant | 3A991A2 | 8542.31.0001 | 1 | Ethernet, I²C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART | 2.50V | 1GHz | ROM (96kB) | 576kB | 1.00V | |||||||||||||||||||||||||||||||||||||||||||||||||
 |
XCZU1EG-L1SFVC784I | 448.5000 | |
5238 | 0.00000000 | AMD | Zynq® UltraScale+™ | Tray | Active | -40°C ~ 100°C (TJ) | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU1EG-L1SFVC784I | 1 | MPU, FPGA | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 600MHz, 1.2GHz | - | DMA, WDT | 256KB | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||
|
XC4025E-4PG223I | - | |
5131 | 0.00000000 | AMD | XC4000E/X | Tray | Obsolete | -40°C ~ 100°C (TJ) | Through Hole | 223-BCPGA | XC4025E | Not Verified | 4.5V ~ 5.5V | 223-CPGA (47.24x47.24) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 12 | 32768 | 192 | 25000 | 1024 | 2432 | ||||||||||||||||||||||||||||||||||||||||||||||
 |
LCMXO2280C-4BN256I | 35.1650 | |
7819 | 0.00000000 | Lattice Semiconductor Corporation | MachXO | Tray | Active | -40°C ~ 100°C (TJ) | Surface Mount | 256-LFBGA, CSPBGA | LCMXO2280 | Not Verified | 1.71V ~ 3.465V | 256-CABGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 119 | 28262 | 211 | 285 | 2280 | |||||||||||||||||||||||||||||||||||||||||||||||
 |
XC6SLX100T-4CSG484C | - | |
6441 | 0.00000000 | AMD | Spartan®-6 LXT | Tray | Obsolete | 0°C ~ 85°C (TJ) | Surface Mount | 484-FBGA, CSPBGA | XC6SLX100 | Not Verified | 1.14V ~ 1.26V | 484-CSPBGA (19x19) | download | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 1 | 4939776 | 296 | 7911 | 101261 | ||||||||||||||||||||||||||||||||||||||||||||||||
 |
C8051F852-C-GUR | 1.3466 | |
7623 | 0.00000000 | Silicon Labs | C8051F85x | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 24-SSOP (0.154", 3.90mm Width) | C8051F852 | 24-QSOP | download | RoHS Compliant | 2 (1 Year) | 3A991A | 8542.31.0001 | 2,500 | 16 | 8051 | 8-Bit | 25MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 2KB (2K x 8) | FLASH | - | 256 x 8 | 2.2V ~ 3.6V | A/D 16x12b | Internal | |||||||||||||||||||||||||||||||||||||||||
 |
S9S12GN16F1CTJ | 2.4185 | |
1718 | 0.00000000 | NXP USA Inc. | HCS12 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | S9S12 | 20-TSSOP | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325735574 | 3A991A2 | 8542.31.0001 | 75 | 14 | 12V1 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 512 x 8 | 1K x 8 | 3.13V ~ 5.5V | A/D 8x10b | Internal | |||||||||||||||||||||||||||||||||||||||
 |
R7S921045VCBG#AC0 | - | |
5725 | 0.00000000 | Renesas Electronics America Inc | RZ/A2M | Tray | Discontinued at SIC | -40°C ~ 85°C (TA) | Surface Mount | 176-LFBGA | 176-LFBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 559-R7S921045VCBG#AC0 | 152 | ARM® Cortex®-A9 | 528MHz | 1 Core, 32-Bit | Multimedia; NEON™ MPE | - | Yes | LCD, LVDS, MIPICSI2, Video | - | - | USB 2.0 (1) | - | AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 | CAN, I²C, I²S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | ||||||||||||||||||||||||||||||||||||||||||
 |
S912XD128F2MAL | - | |
9489 | 0.00000000 | NXP USA Inc. | * | Tray | Active | S912 | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MB9BF566NPMC-G-JNE2 | 5.9700 | |
90 | 0.00000000 | Infineon Technologies | FM4 MB9B560R | Bulk | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 100-LQFP | MB9BF566 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 80 | ARM® Cortex®-M4F | 32-Bit Single-Core | 160MHz | CANbus, CSIO, EBI/EMI, I²C, LINbus, SD, UART/USART, USB | DMA, LVD, POR, PWM, WDT | 544KB (544K x 8) | FLASH | - | 64K x 8 | 2.7V ~ 5.5V | A/D 24x12b; D/A 2x12b | Internal | ||||||||||||||||||||||||||||||||||||||||
|
DSPIC30F4013-20E/P | 9.0440 | |
4811 | 0.00000000 | Microchip Technology | dsPIC™ 30F | Tube | Active | -40°C ~ 125°C (TA) | Through Hole | 40-DIP (0.600", 15.24mm) | DSPIC30F4013 | 40-PDIP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | DSPIC30F4013-20EP | 3A991A2 | 8542.31.0001 | 10 | 30 | dsPIC | 16-Bit | 20 MIPS | CANbus, I²C, SPI, UART/USART | AC'97, Brown-out Detect/Reset, I²S, POR, PWM, WDT | 48KB (16K x 24) | FLASH | 1K x 8 | 2K x 8 | 2.5V ~ 5.5V | A/D 13x12b | Internal | |||||||||||||||||||||||||||||||||||||||
 |
CY8C3445LTI-089 | 14.1200 | |
163 | 0.00000000 | Cypress Semiconductor Corp | PSOC® 3 CY8C34xx | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | CY8C3445 | 48-QFN (7x7) | download | ROHS3 Compliant | 3A991A3 | 8542.31.0001 | 22 | 25 | 8051 | 8-Bit | 50MHz | EBI/EMI, I²C, LINbus, SPI, UART/USART, USB | CapSense, DMA, LCD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 1K x 8 | 4K x 8 | 1.71V ~ 5.5V | A/D 16x12b; D/A 2x8b | Internal | Not Verified | |||||||||||||||||||||||||||||||||||||||||
 |
A10S-P9-A5E-RI-SB | 2.0000 | |
5908 | 0.00000000 | Critical Link LLC | MitySOM | Bag | Active | -40°C ~ 85°C | 4.000" L x 4.000" W (101.50mm x 101.50mm) | A10S-P9 | download | 1 (Unlimited) | 1057-A10S-P9-A5E-RI-SB | 3A991A2 | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 1.2GHz | 4GB | - | MPU, FPGA Core | NEON™ SIMD | Board-to-Board (BTB) | |||||||||||||||||||||||||||||||||||||||||||||||||
 |
PIC18LF45J10-I/ML | 2.9810 | |
1407 | 0.00000000 | Microchip Technology | PIC® 18J | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-VQFN Exposed Pad | PIC18LF45 | 44-QFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 45 | 32 | PIC | 8-Bit | 40MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 32KB (16K x 16) | FLASH | - | 1K x 8 | 2V ~ 3.6V | A/D 13x10b | Internal |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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