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Embedded(157935)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Mounting Type | Package / Case | Type | Base Product Number | SIC Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Total RAM Bits | Number of I/O | Number of Gates | Number of LABs/CLBs | Number of Logic Elements/Cells | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface | Flash Size | Primary Attributes | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Programmable Type | Number of Macrocells | Module/Board Type | Co-Processor | Connector Type | Delay Time tpd(1) Max | Voltage Supply - Internal | Number of Logic Elements/Blocks | Clock Rate | Non-Volatile Memory | On-Chip RAM | Voltage - Core |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
MB89193APF-G-198-BND-RE1 | - |  |
3700 | 0.00000000 | Infineon Technologies | F²MC-8L MB89190A | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 28-SOIC (0.342", 8.69mm Width) | MB89193 | 28-SOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 1 | 16 | F²MC-8L | 8-Bit | 4.2MHz | Serial I/O | POR, WDT | 8KB (8K x 8) | Mask ROM | - | 256 x 8 | 2.2V ~ 6V | A/D 8x8b | External | |||||||||||||||||||||||||||||||||||||
|
MB89935BPFV-G-357E1 | - | |
8426 | 0.00000000 | Infineon Technologies | F²MC-8L MB89930A | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 30-LSSOP (0.220", 5.60mm Width) | MB89935 | 30-SSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 1 | 21 | F²MC-8L | 8-Bit | 10MHz | Serial I/O, UART/USART | POR, PWM, WDT | 16KB (16K x 8) | Mask ROM | - | 512 x 8 | 2.2V ~ 5.5V | A/D 8x10b | External | |||||||||||||||||||||||||||||||||||||
 |
AX500-1FGG484M | - | |
4501 | 0.00000000 | Microchip Technology | Axcelerator | Tray | Active | -55°C ~ 125°C (TA) | Surface Mount | 484-BGA | AX500 | Not Verified | 1.425V ~ 1.575V | 484-FPBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A001A2C | 8542.39.0001 | 60 | 73728 | 317 | 500000 | 8064 | ||||||||||||||||||||||||||||||||||||||||||||
|
LFSC3GA25E-6FFA1020C | - | |
4411 | 0.00000000 | Lattice Semiconductor Corporation | SC | Tray | Obsolete | 0°C ~ 85°C (TJ) | Surface Mount | 1020-BBGA, FCBGA | LFSC3GA25 | Not Verified | 0.95V ~ 1.26V | 1020-OFcBGA Rev 2 (33x33) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 24 | 1966080 | 476 | 6250 | 25000 | ||||||||||||||||||||||||||||||||||||||||||||
 |
5CSXFC6D6F31I7 | 543.5668 | |
8979 | 0.00000000 | Intel | Cyclone® V SX | Tray | Active | -40°C ~ 100°C (TJ) | 896-BGA | 896-FBGA (31x31) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 965732 | 3A991D | 8542.39.0001 | 27 | MCU, FPGA | MCU - 181, FPGA - 288 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 800MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 110K Logic Elements | ||||||||||||||||||||||||||||||||||||||||||
 |
MC9S12DT512CPVE | 37.8254 | |
5671 | 0.00000000 | NXP USA Inc. | HCS12 | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 112-LQFP | MC9S12 | 112-LQFP (20x20) | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321072557 | 3A991A2 | 8542.31.0001 | 300 | 91 | HCS12 | 16-Bit | 25MHz | CANbus, I²C, SCI, SPI | PWM, WDT | 512KB (512K x 8) | FLASH | 4K x 8 | 14K x 8 | 2.35V ~ 5.25V | A/D 8x10b | Internal | ||||||||||||||||||||||||||||||||||||
 |
PIC16LF1779-I/P | 3.6410 | |
7880 | 0.00000000 | Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 85°C (TA) | Through Hole | 40-DIP (0.600", 15.24mm) | PIC16LF1779 | 40-PDIP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 10 | 36 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 28KB (16K x 14) | FLASH | 128 x 8 | 2K x 8 | 1.8V ~ 3.6V | A/D 28x10b; D/A 4x5b, 4x10b | Internal | |||||||||||||||||||||||||||||||||||||
|
FC32K144HRT0MLHT | 15.7500 | |
8093 | 0.00000000 | NXP USA Inc. | * | Tray | Active | - | ROHS3 Compliant | 568-FC32K144HRT0MLHT | 800 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
96MPXE-3.5-8M10T | - | |
7105 | 0.00000000 | Advantech Corp | Haswell | Tray | Discontinued at SIC | - | Surface Mount | 1150-LGA Module | 1151-FCLGA | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | 0000.00.0000 | 1 | Xeon E3-1275 v3 | 3.5GHz | 4 Core, 64-Bit | - | - | Yes | - | - | - | - | - | - | ||||||||||||||||||||||||||||||||||||||||
 |
5SGXEA5N1F40C2LN | - | |
2537 | 0.00000000 | Intel | Stratix® V GX | Tray | Obsolete | 0°C ~ 85°C (TJ) | Surface Mount | 1517-BBGA, FCBGA | 5SGXEA5 | Not Verified | 0.82V ~ 0.88V | 1517-FBGA (40x40) | download | RoHS Compliant | 3 (168 Hours) | 968581 | 3A001A2C | 8542.39.0001 | 21 | 46080000 | 600 | 185000 | 490000 | ||||||||||||||||||||||||||||||||||||||||||||
|
SAF7754HV/N205W/SK | - | |
5715 | 0.00000000 | NXP USA Inc. | - | Bulk | Active | - | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
EFM8LB12F32ES1-C-QFN24 | 1.5508 | |
2867 | 0.00000000 | Silicon Labs | Laser Bee | Tube | Active | -40°C ~ 105°C (TA) | Surface Mount | 24-VFQFN Exposed Pad | EFM8LB12 | 24-QFN (3x3) | download | RoHS Compliant | 2 (1 Year) | 3A991A2 | 8542.31.0001 | 120 | 20 | CIP-51 8051 | 8-Bit | 72MHz | I²C, SMBus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2.25K x 8 | 2.2V ~ 3.6V | A/D 12x14b; D/A 4x12b | Internal | ||||||||||||||||||||||||||||||||||||||
 |
10AX066K2F35I2LG | 7.0000 | |
3080 | 0.00000000 | Intel | Arria 10 GX | Tray | Active | -40°C ~ 100°C (TJ) | Surface Mount | 1152-BBGA, FCBGA | Not Verified | 0.87V ~ 0.98V | 1152-FCBGA (35x35) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 966295 | 3A001A7B | 8542.39.0001 | 1 | 49610752 | 396 | 250540 | 660000 | ||||||||||||||||||||||||||||||||||||||||||||
 |
TMS320C5420GGUA200 | - | |
1363 | 0.00000000 | Texas Instruments | TMS320C54x | Tray | Obsolete | -40°C ~ 100°C (TC) | Surface Mount | 144-LFBGA | Fixed Point | TMS320 | 144-BGA MICROSTAR (12x12) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | Host Interface, McBSP | 3.30V | 100MHz | External | 384kB | 1.80V | |||||||||||||||||||||||||||||||||||||||||||
|
SAF-XE164FM72F80LAAFXUMA1 | - | |
5434 | 0.00000000 | Infineon Technologies | * | Bulk | Active | SAF-XE164 | download | Not applicable | 3 (168 Hours) | Vendor Undefined | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
R7FS3A37A3A01CFB#AA0 | - | |
6111 | 0.00000000 | Renesas | S3A3 | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | 144-LFQFP (20x20) | - | 2156-R7FS3A37A3A01CFB#AA0 | 1 | 126 | ARM® Cortex®-M4F | 32-Bit | 48MHz | CANbus, EBI/EMI, I²C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB | DMA, LCD, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 8K x 8 | 96K x 8 | 1.6V ~ 5.5V | A/D 28x14b SAR; D/A 2x8b, 1x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||
 |
R5F10MPGDFB#10 | 3.7981 | |
2752 | 0.00000000 | Renesas Electronics America Inc | RL78/I1B | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | R5F10 | 144-LFQFP (20x20) | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 559-R5F10MPGDFB#10 | EAR99 | 8542.31.0001 | 720 | 69 | RL78 | 16-Bit | 24MHz | CSI, I²C, IrDA, LINbus, UART/USART | Brown-out Detect/Reset, LCD, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 8K x 8 | 1.9V ~ 5.5V | A/D 6x10b, 4x10b | Internal | ||||||||||||||||||||||||||||||||||||
 |
A40MX04-2PL44I | - | |
8376 | 0.00000000 | Microchip Technology | MX | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 44-LCC (J-Lead) | A40MX04 | Not Verified | 3V ~ 3.6V, 4.5V ~ 5.5V | 44-PLCC (16.59x16.59) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 54 | 34 | 6000 | ||||||||||||||||||||||||||||||||||||||||||||||
 |
DF2362VTE34V | - | |
1224 | 0.00000000 | Renesas Electronics America Inc | H8® H8S/2300 | Tray | Active | -20°C ~ 75°C (TA) | Surface Mount | 120-TQFP | DF2362 | 120-TQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1 | 83 | H8S/2000 | 16-Bit | 34MHz | I²C, IrDA, SCI, SmartCard | DMA, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 32K x 8 | 3V ~ 3.6V | A/D 10x10b; D/A 2x8b | Internal | |||||||||||||||||||||||||||||||||||||
 |
10CL010YU256I7G | 18.1600 | |
8164 | 0.00000000 | Intel | Cyclone® 10 LP | Tray | Active | -40°C ~ 100°C (TJ) | Surface Mount | 256-LFBGA | Not Verified | 1.2V | 256-UBGA (14x14) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 119 | 423936 | 176 | 645 | 10320 | |||||||||||||||||||||||||||||||||||||||||||||
 |
MPC860DPVR50D4R2 | - | |
7301 | 0.00000000 | NXP USA Inc. | MPC8xx | Tape & Reel (TR) | Obsolete | 0°C ~ 95°C (TA) | Surface Mount | 357-BBGA | MPC86 | 357-PBGA (25x25) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A991B4B | 8542.31.0001 | 180 | MPC8xx | 50MHz | 1 Core, 32-Bit | Communications; CPM | DRAM | No | - | 10Mbps (2), 10/100Mbps (1) | - | - | 3.3V | - | HDLC/SDLC, I²C, IrDA, PCMCIA, SPI, TDM, UART/USART | |||||||||||||||||||||||||||||||||||||
 |
MC56F8355VFGE | 48.0100 | |
2320 | 0.00000000 | NXP USA Inc. | 56F8xxx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 128-LQFP | MC56F83 | 128-LQFP (14x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320991557 | 3A991A2 | 8542.31.0001 | 360 | 49 | 56800E | 16-Bit | 60MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, Temp Sensor, WDT | 256KB (128K x 16) | FLASH | - | 10K x 16 | 2.25V ~ 3.6V | A/D 16x12b | External | ||||||||||||||||||||||||||||||||||||
 |
PIC16LC774-I/PT | 11.3820 | |
3507 | 0.00000000 | Microchip Technology | PIC® 16C | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-TQFP | PIC16LC774 | 44-TQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | PIC16LC774-I/PT-NDR | EAR99 | 8542.31.0001 | 160 | 33 | PIC | 8-Bit | 20MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 7KB (4K x 14) | OTP | - | 256 x 8 | 2.5V ~ 5.5V | A/D 10x12b | External | ||||||||||||||||||||||||||||||||||||
 |
PIC18F44J50-I/ML | 4.9000 | |
216 | 0.00000000 | Microchip Technology | PIC® XLP™ 18J | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-VQFN Exposed Pad | PIC18F44 | 44-QFN (8x8) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 45 | 34 | PIC | 8-Bit | 48MHz | I²C, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 16KB (8K x 16) | FLASH | - | 3.8K x 8 | 2.15V ~ 3.6V | A/D 13x10b | Internal | |||||||||||||||||||||||||||||||||||||
| M5LV-320/120-20YI | - | |
6807 | 0.00000000 | Lattice Semiconductor Corporation | MACH® 5 | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 160-BQFP | M5LV-320 | Not Verified | 160-PQFP (28x28) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 24 | 120 | In System Programmable | 320 | 20 ns | 3V ~ 3.6V | |||||||||||||||||||||||||||||||||||||||||||||
|
P1014NSN5DFB | 35.7600 | |
65 | 0.00000000 | NXP Semiconductors | QorIQ P1 | Bulk | Obsolete | 0°C ~ 105°C (TA) | Surface Mount | 425-FBGA | 425-TEPBGA I (19x19) | - | 2156-P1014NSN5DFB | 9 | PowerPC e500v2 | 533MHz | 1 Core, 32-Bit | - | DDR3, DDR3L | No | - | 10/100/1000Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | - | - | CANbus, DUART, I²C, MMC/SD, SPI | ||||||||||||||||||||||||||||||||||||||||||
 |
XCVM1402-2MLENBVB1024 | 7.0000 | |
3810 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | 0°C ~ 100°C (TJ) | 1024-BFBGA | 1024-BGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1402-2MLENBVB1024 | 1 | MPU, FPGA | 424 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.4GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 1.2M Logic Cells | |||||||||||||||||||||||||||||||||||||||||||||
 |
EPM7192EQC160-12 | - | |
6306 | 0.00000000 | Intel | MAX® 7000 | Tray | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 160-BQFP | EPM7192 | Not Verified | 160-PQFP (28x28) | download | 3 (168 Hours) | REACH Unaffected | 970447 | 3A001A2A | 8542.39.0001 | 24 | 124 | 3750 | EE PLD | 192 | 12 ns | 4.75V ~ 5.25V | 12 | ||||||||||||||||||||||||||||||||||||||||||
|
M2GL025-FCS325 | 56.7750 | |
7203 | 0.00000000 | Microchip Technology | IGLOO2 | Tray | Active | 0°C ~ 85°C (TJ) | Surface Mount | 325-TFBGA, FCBGA | M2GL025 | Not Verified | 1.14V ~ 2.625V | 325-FCBGA (11x11) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991B2 | 8542.39.0001 | 176 | 1130496 | 180 | 27696 | |||||||||||||||||||||||||||||||||||||||||||||
|
TE0720-03-S007C1 | - | |
2532 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | - | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-S007C1 | 1 | ARM Cortex-A9 | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
Wishlist (0 Items)