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System On Chip (SoC)(4664)

Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Package / Case Base Product Number Supplier Device Package DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Architecture Number of I/O Core Processor Speed Connectivity Peripherals RAM Size Flash Size Primary Attributes
AGFA023R24C2E4X Intel AGFA023R24C2E4X 27.0000
RFQ
 ECAD 3561 0.00000000 Intel Agilex F Tray Active 0°C ~ 100°C (TJ) 2340-BFBGA Exposed Pad 2340-BGA (45x42) - 544-AGFA023R24C2E4X 1 MPU, FPGA 480 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 1.4GHz EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG DMA, WDT 256KB - FPGA - 2.3M Logic Elements
AGFB022R24C2E1VB Intel AGFB022R24C2E1VB 23.0000
RFQ
 ECAD 8051 0.00000000 Intel Agilex F Tray Active 0°C ~ 100°C (TJ) 2340-BFBGA Exposed Pad 2340-BGA (45x42) - 544-AGFB022R24C2E1VB 1 MPU, FPGA 744 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 1.4GHz EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG DMA, WDT 256KB - FPGA - 2.2M Logic Elements
AGFD023R31C2E2VB Intel AGFD023R31C2E2VB 24.0000
RFQ
 ECAD 1602 0.00000000 Intel Agilex F Tray Active 0°C ~ 100°C (TJ) 3184-BFBGA Exposed Pad 3184-BGA (56x45) - 544-AGFD023R31C2E2VB 1 MPU, FPGA 480 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 1.4GHz EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG DMA, WDT 256KB - FPGA - 2.3M Logic Elements
AGFC023R24C2I3V Intel AGFC023R24C2I3V 22.0000
RFQ
 ECAD 6157 0.00000000 Intel Agilex F Tray Active -40°C ~ 100°C (TJ) 2340-BFBGA Exposed Pad 2340-BGA (45x42) - 544-AGFC023R24C2I3V 1 MPU, FPGA 480 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 1.4GHz EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG DMA, WDT 256KB - FPGA - 2.3M Logic Elements
AGFA008R24C2E2VB Intel AGFA008R24C2E2VB 11.0000
RFQ
 ECAD 4025 0.00000000 Intel Agilex F Tray Active 0°C ~ 100°C (TJ) 2340-BFBGA Exposed Pad 2340-BGA (45x42) - 544-AGFA008R24C2E2VB 1 MPU, FPGA 576 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 1.4GHz EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG DMA, WDT 256KB - FPGA - 764K Logic Elements
AGIB027R31B2E1VB Intel AGIB027R31B2E1VB 37.0000
RFQ
 ECAD 5906 0.00000000 Intel Agilex I Tray Active 0°C ~ 100°C (TJ) 3184-BFBGA Exposed Pad 3184-BGA (56x45) - 544-AGIB027R31B2E1VB 1 MPU, FPGA 720 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 1.4GHz EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG DMA, WDT 256KB - FPGA - 2.7M Logic Elements
AGIB027R29A2I3V Intel AGIB027R29A2I3V 37.0000
RFQ
 ECAD 5731 0.00000000 Intel Agilex I Tray Active -40°C ~ 100°C (TJ) 2957-BFBGA Exposed Pad 2957-BGA (56x45) - 544-AGIB027R29A2I3V 1 MPU, FPGA 720 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 1.4GHz EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG DMA, WDT 256KB - FPGA - 2.7M Logic Elements
AGFA019R31C2I2VB Intel AGFA019R31C2I2VB 23.0000
RFQ
 ECAD 3555 0.00000000 Intel Agilex F Tray Active -40°C ~ 100°C (TJ) 3184-BFBGA Exposed Pad 3184-BGA (56x45) - 544-AGFA019R31C2I2VB 1 MPU, FPGA 480 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 1.4GHz EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG DMA, WDT 256KB - FPGA - 1.9M Logic Elements
AGIB022R31B1I2VB Intel AGIB022R31B1I2VB 35.0000
RFQ
 ECAD 7025 0.00000000 Intel Agilex I Tray Active -40°C ~ 100°C (TJ) 3184-BFBGA Exposed Pad 3184-BGA (56x45) - 544-AGIB022R31B1I2VB 1 MPU, FPGA 720 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 1.4GHz EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG DMA, WDT 256KB - FPGA - 2.2M Logic Elements
AGIB022R31B2E2VB Intel AGIB022R31B2E2VB 25.0000
RFQ
 ECAD 5830 0.00000000 Intel Agilex I Tray Active 0°C ~ 100°C (TJ) 3184-BFBGA Exposed Pad 3184-BGA (56x45) - 544-AGIB022R31B2E2VB 1 MPU, FPGA 720 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 1.4GHz EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG DMA, WDT 256KB - FPGA - 2.2M Logic Elements
AGFC019R31C2I2VB Intel AGFC019R31C2I2VB 25.0000
RFQ
 ECAD 5366 0.00000000 Intel Agilex F Tray Active -40°C ~ 100°C (TJ) 3184-BFBGA Exposed Pad 3184-BGA (56x45) - 544-AGFC019R31C2I2VB 1 MPU, FPGA 480 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 1.4GHz EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG DMA, WDT 256KB - FPGA - 1.9M Logic Elements
AGFD019R24C2I2VB Intel AGFD019R24C2I2VB 24.0000
RFQ
 ECAD 3950 0.00000000 Intel Agilex F Tray Active -40°C ~ 100°C (TJ) 2340-BFBGA Exposed Pad 2340-BGA (45x42) - 544-AGFD019R24C2I2VB 1 MPU, FPGA 480 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 1.4GHz EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG DMA, WDT 256KB - FPGA - 1.9M Logic Elements
AGFA008R24C2I2VB Intel AGFA008R24C2I2VB 12.0000
RFQ
 ECAD 6904 0.00000000 Intel Agilex F Tray Active -40°C ~ 100°C (TJ) 2340-BFBGA Exposed Pad 2340-BGA (45x42) - 544-AGFA008R24C2I2VB 1 MPU, FPGA 576 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 1.4GHz EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG DMA, WDT 256KB - FPGA - 764K Logic Elements
AGFC019R24C2E1VB Intel AGFC019R24C2E1VB 23.0000
RFQ
 ECAD 3430 0.00000000 Intel Agilex F Tray Active 0°C ~ 100°C (TJ) 2340-BFBGA Exposed Pad 2340-BGA (45x42) - 544-AGFC019R24C2E1VB 1 MPU, FPGA 480 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 1.4GHz EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG DMA, WDT 256KB - FPGA - 1.9M Logic Elements
AGIB041R29D1E1VB Intel AGIB041R29D1E1VB 59.0000
RFQ
 ECAD 6239 0.00000000 Intel Agilex I Tray Active 0°C ~ 100°C (TJ) 2957-BFBGA Exposed Pad 2957-BGA (56x45) - 544-AGIB041R29D1E1VB 1 MPU, FPGA 720 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 1.4GHz EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG DMA, WDT 256KB - FPGA - 4M Logic Elements
AGID023R18A1E1VB Intel AGID023R18A1E1VB 35.0000
RFQ
 ECAD 4547 0.00000000 Intel Agilex I Tray Active 0°C ~ 100°C (TJ) 1805-BBGA Exposed Pad 1805-BGA (42.5x42.5) - 544-AGID023R18A1E1VB 1 MPU, FPGA 480 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 1.4GHz EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG DMA, WDT 256KB - FPGA - 2.3M Logic Elements
AGID019R31B1I2VB Intel AGID019R31B1I2VB 38.0000
RFQ
 ECAD 3364 0.00000000 Intel Agilex I Tray Active -40°C ~ 100°C (TJ) 3184-BFBGA Exposed Pad 3184-BGA (56x45) - 544-AGID019R31B1I2VB 1 MPU, FPGA 480 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 1.4GHz EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG DMA, WDT 256KB - FPGA - 1.9M Logic Elements
AGFC023R31C2I2VB Intel AGFC023R31C2I2VB 29.0000
RFQ
 ECAD 6597 0.00000000 Intel Agilex F Tray Active -40°C ~ 100°C (TJ) 3184-BFBGA Exposed Pad 3184-BGA (56x45) - 544-AGFC023R31C2I2VB 1 MPU, FPGA 480 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 1.4GHz EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG DMA, WDT 256KB - FPGA - 2.3M Logic Elements
AGFA019R31C2E1VB Intel AGFA019R31C2E1VB 24.0000
RFQ
 ECAD 1524 0.00000000 Intel Agilex F Tray Active 0°C ~ 100°C (TJ) 3184-BFBGA Exposed Pad 3184-BGA (56x45) - 544-AGFA019R31C2E1VB 1 MPU, FPGA 480 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 1.4GHz EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG DMA, WDT 256KB - FPGA - 1.9M Logic Elements
AGFC019R24C3E3E Intel AGFC019R24C3E3E 13.0000
RFQ
 ECAD 6369 0.00000000 Intel Agilex F Tray Active 0°C ~ 100°C (TJ) 2340-BFBGA Exposed Pad 2340-BGA (45x42) - 544-AGFC019R24C3E3E 1 MPU, FPGA 480 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 1.4GHz EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG DMA, WDT 256KB - FPGA - 1.9M Logic Elements
AGIB027R29B1E1VR3 Intel AGIB027R29B1E1VR3 47.0000
RFQ
 ECAD 5164 0.00000000 Intel Agilex I Tray Active 0°C ~ 100°C (TJ) 2957-BFBGA Exposed Pad 2957-BGA (56x45) - 544-AGIB027R29B1E1VR3 1 MPU, FPGA - Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 1.4GHz EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG DMA, WDT 256KB - FPGA - 2.7M Logic Elements
AGIA035R39A2I1VB Intel AGIA035R39A2I1VB 147.0000
RFQ
 ECAD 6781 0.00000000 Intel * Tray Active - 544-AGIA035R39A2I1VB 3
XCZU2CG-1SFVC784I AMD XCZU2CG-1SFVC784I 377.0000
RFQ
 ECAD 9732 0.00000000 AMD Zynq® UltraScale+™ MPSoC CG Tray Active -40°C ~ 100°C (TJ) 784-BFBGA, FCBGA XCZU2 784-FCBGA (23x23) download ROHS3 Compliant 4 (72 Hours) REACH Unaffected 5A002A4 XIL 8542.39.0001 1 MCU, FPGA 252 Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 500MHz, 1.2GHz CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG DMA, WDT 256KB - Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
AGFB008R16A2E1VB Intel AGFB008R16A2E1VB 10.0000
RFQ
 ECAD 3121 0.00000000 Intel Agilex F Tray Active 0°C ~ 100°C (TJ) 1546-BFBGA Exposed Pad 1546-BGA (37.5x34) - 544-AGFB008R16A2E1VB 1 MPU, FPGA 384 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 1.4GHz EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG DMA, WDT 256KB - FPGA - 764K Logic Elements
AGFB023R31C2E1V Intel AGFB023R31C2E1V 69.0000
RFQ
 ECAD 9781 0.00000000 Intel * Tray Active - 544-AGFB023R31C2E1V 3
M2S050-FCS325I Microchip Technology M2S050-FCS325I 123.7133
RFQ
 ECAD 6102 0.00000000 Microchip Technology SmartFusion®2 Tray Active -40°C ~ 100°C (TJ) 325-TFBGA, FCBGA M2S050 325-FCBGA (11x11) download RoHS non-compliant 3 (168 Hours) REACH Unaffected 3A991D 8542.39.0001 176 MCU, FPGA 200 ARM® Cortex®-M3 166MHz CANbus, Ethernet, I²C, SPI, UART/USART, USB DDR, PCIe, SERDES 64KB 256KB FPGA - 50K Logic Modules
AGID041R29D1E2VR0 Intel AGID041R29D1E2VR0 57.0000
RFQ
 ECAD 2015 0.00000000 Intel Agilex I Tray Active 0°C ~ 100°C (TJ) 2957-BFBGA Exposed Pad 2957-BGA (56x45) - 544-AGID041R29D1E2VR0 1 MPU, FPGA 720 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 1.4GHz EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG DMA, WDT 256KB - FPGA - 4M Logic Elements
M2S150T-FCVG484I Microchip Technology M2S150T-FCVG484I 443.0100
RFQ
 ECAD 6641 0.00000000 Microchip Technology SmartFusion®2 Tray Active -40°C ~ 100°C (TJ) 484-BFBGA M2S150 484-FBGA (19x19) download ROHS3 Compliant 3 (168 Hours) REACH Unaffected 3A991D 8542.39.0001 84 MCU, FPGA 273 ARM® Cortex®-M3 166MHz CANbus, Ethernet, I²C, SPI, UART/USART, USB DDR, PCIe, SERDES 64KB 512KB FPGA - 150K Logic Modules
HD64412FIV Renesas Electronics America Inc HD64412FIV 25.5900
RFQ
 ECAD 1 0.00000000 Renesas Electronics America Inc * Bulk Active - Not applicable 3 (168 Hours) Vendor Undefined EAR99 8542.39.0001 1
M2S025T-1FCSG325I Microchip Technology M2S025T-1FCSG325I 95.9301
RFQ
 ECAD 4237 0.00000000 Microchip Technology SmartFusion®2 Tray Active -40°C ~ 100°C (TJ) 325-TFBGA, FCBGA M2S025 325-FCBGA (11x11) download ROHS3 Compliant 3 (168 Hours) REACH Unaffected 3A991D 8542.39.0001 176 MCU, FPGA 180 ARM® Cortex®-M3 166MHz CANbus, Ethernet, I²C, SPI, UART/USART, USB DDR, PCIe, SERDES 64KB 256KB FPGA - 25K Logic Modules
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse

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AD9208BBPZ-3000

196-LFBGA Exposed Pad

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