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System On Chip (SoC)(4664)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
M2S090-1FCS325 | 191.7227 |  |
3790 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 325-TFBGA, FCBGA | M2S090 | 325-FCBGA (11x13.5) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 176 | MCU, FPGA | 180 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 90K Logic Modules | ||
 |
AGFD019R31C2I3E | 70.0000 | |
3399 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGFD019R31C2I3E | 3 | |||||||||||||||||||
|
AGFD023R25A1E1V | 64.0000 | |
9676 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFD023R25A1E1V | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | ||||||
|
AGFA014R24C2E3VAA | 37.0000 | |
9108 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFA014R24C2E3VAA | 1 | MPU, FPGA | 744 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.4M Logic Elements | ||||||
 |
M2S060TS-1FCSG325 | 148.4219 | |
1419 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 325-TFBGA, FCBGA | M2S060 | 325-FCBGA (11x11) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 176 | MCU, FPGA | 200 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 60K Logic Modules | ||
 |
XCZU5EG-3FBVB900E | 4.0000 | |
2685 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | 0°C ~ 100°C (TJ) | 900-BBGA, FCBGA | XCZU5 | 900-FCBGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 204 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 600MHz, 1.5GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | ||
 |
10AS032E3F27I2SG | 1.0000 | |
6876 | 0.00000000 | Intel | Arria 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 672-BBGA, FCBGA | 672-FBGA, FC (27x27) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 965290 | 5A002A1 | 8542.39.0001 | 1 | MCU, FPGA | 240 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 320K Logic Elements | ||
|
AGFC019R31C2I3V | 60.0000 | |
3412 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGFC019R31C2I3V | 3 | |||||||||||||||||||
 |
1SX065HH3F35I3XG | 8.0000 | |
8247 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | download | 3 (168 Hours) | 544-1SX065HH3F35I3XG | 1 | MCU, FPGA | 392 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 650K Logic Elements | ||||||
 |
M2S010T-FG484 | 58.1625 | |
4258 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 484-BGA | M2S010 | 484-FPBGA (23x23) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | 233 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 10K Logic Modules | ||
 |
10AS048E3F29I2LG | 3.0000 | |
8411 | 0.00000000 | Intel | Arria 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 780-BBGA, FCBGA | 780-FBGA, FC (29x29) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 965034 | 5A002A1 | 8542.39.0001 | 1 | MCU, FPGA | 360 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 480K Logic Elements | ||
 |
XAZU2EG-1SFVC784Q | 770.9000 | |
7925 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 125°C (TJ) | 784-BFBGA, FCBGA | XAZU2 | 784-FCBGA (23x23) | download | ROHS3 Compliant | 4 (72 Hours) | 5A002A4 XIL | 8542.39.0001 | 1 | MPU, FPGA | 128 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 1.2GHz | CANbus, I²C, SPI, UART/USART, USB | DMA, WDT | 1.2MB | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | |||
|
AGFA023R31C2I1V | 83.0000 | |
4517 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGFA023R31C2I1V | 3 | |||||||||||||||||||
|
XCZU4EV-1SFVC784I | 1.0000 | |
3305 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EV | Tray | Active | -40°C ~ 100°C (TJ) | 784-BFBGA, FCBGA | XCZU4 | 784-FCBGA (23x23) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 252 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 600MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ||
|
AGFB006R16A2I3V | 21.0000 | |
3519 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFB006R16A2I3V | 1 | MPU, FPGA | 384 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 573K Logic Elements | ||||||
|
AGIB023R31B1I2V | 90.0000 | |
2451 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGIB023R31B1I2V | 3 | |||||||||||||||||||
|
AGIB022R31B1I1V | 109.0000 | |
8534 | 0.00000000 | Intel | Agilex I | Tray | Active | -40°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGIB022R31B1I1V | 1 | MPU, FPGA | 720 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.2M Logic Elements | ||||||
 |
MPFS095T-1FCSG536I | 309.6800 | |
8648 | 0.00000000 | Microchip Technology | PolarFire® | Tray | Active | -40°C ~ 100°C | 536-BGA | 536-LFBGA | download | REACH Unaffected | 150-MPFS095T-1FCSG536I | 1 | MPU, FPGA | MCU - 136, FPGA - 276 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 857.6kB | 128kB | FPGA - 93K Logic Modules | ||||||
|
AGIB041R29D2E2VB | 50.0000 | |
2202 | 0.00000000 | Intel | Agilex I | Tray | Active | 0°C ~ 100°C (TJ) | 2957-BFBGA Exposed Pad | 2957-BGA (56x45) | - | 544-AGIB041R29D2E2VB | 1 | MPU, FPGA | 720 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 4M Logic Elements | |||||||
|
AGFB027R31C2E1V | 87.0000 | |
1914 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFB027R31C2E1V | 1 | MPU, FPGA | 720 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.7M Logic Elements | ||||||
|
BCM3382EKFEBG | - | |
3429 | 0.00000000 | Broadcom Limited | * | Tray | Obsolete | - | 1 (Unlimited) | OBSOLETE | 0000.00.0000 | 84 | |||||||||||||||||
 |
1SX280HH3F55E2VG | 23.0000 | |
1307 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | 0°C ~ 100°C (TJ) | 2912-BBGA, FCBGA | 2912-FBGA, FC (55x55) | download | 3 (168 Hours) | REACH Unaffected | 544-1SX280HH3F55E2VG | 1 | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2800K Logic Elements | ||||||
|
M2S005S-1FG484 | 32.9873 | |
2264 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 484-BGA | M2S005 | 484-FPBGA (23x23) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | 209 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR | 64KB | 128KB | FPGA - 5K Logic Modules | ||
|
AGIB027R31B2E1VB | 37.0000 | |
5906 | 0.00000000 | Intel | Agilex I | Tray | Active | 0°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | - | 544-AGIB027R31B2E1VB | 1 | MPU, FPGA | 720 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.7M Logic Elements | |||||||
|
AGIA035R39A2I2VB | 129.0000 | |
8770 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGIA035R39A2I2VB | 3 | |||||||||||||||||||
|
AGFA006R16A2E2VB | 7.0000 | |
3473 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | 1546-BFBGA Exposed Pad | 1546-BGA (37.5x34) | - | 544-AGFA006R16A2E2VB | 1 | MPU, FPGA | 384 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 573K Logic Elements | |||||||
 |
XCVM1802-2MSEVSVA2197 | 11.0000 | |
1353 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | 0°C ~ 100°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1802-2MSEVSVA2197 | 1 | MPU, FPGA | 770 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.4GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ Prime FPGA, 1.9M Logic Cells | |||||
 |
XCZU57DR-1FFVE1156I | 16.0000 | |
3629 | 0.00000000 | AMD | Zynq® UltraScale+™ RFSoC DR | Tray | Active | -40°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU57DR-1FFVE1156I | 1 | MPU, FPGA | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe, WDT | - | - | Zynq® UltraScale+™ RFSoC | |||||
 |
AMA4B2KP-KBR | 13.6400 | |
4 | 0.00000000 | Ambiq Micro, Inc. | - | Tape & Reel (TR) | Active | -20°C ~ 60°C | 131-VFBGA | 131-BGA (4.7x4.7) | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 8542.31.0001 | 5,000 | MCU | 81 | ARM® Cortex®-M0, ARM® Cortex®-M4F | 192MHz | GPIO, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | AES, DMA, WDT | 2.75MB | 2MB | - | ||||
 |
5CSXFC5C6U23I7N | 342.6400 | |
3391 | 0.00000000 | Intel | Cyclone® V SX | Tray | Active | -40°C ~ 100°C (TJ) | 672-FBGA | 5CSXFC5 | 672-UBGA (23x23) | - | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | MCU - 181, FPGA - 145 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 800MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 85K Logic Elements |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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