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System On Chip (SoC)(4664)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
AGFB006R16A2I3E | 25.0000 |  |
2364 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFB006R16A2I3E | 1 | MPU, FPGA | 384 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 573K Logic Elements | ||||||
|
AGFB008R24C2I2V | 33.0000 | |
1292 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFB008R24C2I2V | 1 | MPU, FPGA | 576 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 764K Logic Elements | ||||||
 |
XCZU6CG-2FFVB1156I | 4.0000 | |
3688 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC CG | Bulk | Active | -40°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | XCZU6 | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 328 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 533MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | ||
|
AGIB023R18A2I2VB | 27.0000 | |
5801 | 0.00000000 | Intel | Agilex I | Tray | Active | -40°C ~ 100°C (TJ) | 1805-BBGA Exposed Pad | 1805-BGA (42.5x42.5) | - | 544-AGIB023R18A2I2VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | |||||||
 |
M2S090T-FCSG325I | 207.0711 | |
7439 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 325-TFBGA, FCBGA | M2S090 | 325-FCBGA (11x13.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 176 | MCU, FPGA | 180 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 90K Logic Modules | ||
 |
A2F060M3E-TQG144I | - | |
2268 | 0.00000000 | Microsemi Corporation | SmartFusion® | Tray | Obsolete | -40°C ~ 100°C (TJ) | 144-LQFP | A2F060M3E | 144-TQFP (20x20) | download | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | MCU - 21, FPGA - 33 | ARM® Cortex®-M3 | 80MHz | EBI/EMI, I²C, SPI, UART/USART | DMA, POR, WDT | 16KB | 128KB | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | |||
 |
M2S010TS-VFG400I | 62.9852 | |
9652 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 400-LFBGA | M2S010 | 400-VFBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | 195 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 10K Logic Modules | ||
 |
10AS048H3F34E2LG | 3.0000 | |
5062 | 0.00000000 | Intel | Arria 10 SX | Tray | Active | 0°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA, FC (35x35) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 973518 | 5A002A1 | 8542.39.0001 | 1 | MCU, FPGA | 492 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 480K Logic Elements | ||
 |
M2S025TS-1FGG484I | 141.7335 | |
6218 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 484-BGA | M2S025 | 484-FPBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.39.0001 | 60 | MCU, FPGA | 267 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 25K Logic Modules | ||
|
M2S060T-VFG400I | 169.1874 | |
2877 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 400-LFBGA | M2S060 | 400-VFBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | 207 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 60K Logic Modules | ||
|
A2F060M3E-CSG288I | - | |
3756 | 0.00000000 | Microsemi Corporation | SmartFusion® | Tray | Obsolete | -40°C ~ 100°C (TJ) | 288-TFBGA, CSPBGA | A2F060M3E | 288-CSP (11x11) | download | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 176 | MCU, FPGA | MCU - 28, FPGA - 68 | ARM® Cortex®-M3 | 80MHz | EBI/EMI, I²C, SPI, UART/USART | DMA, POR, WDT | 16KB | 128KB | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | |||
|
AGFA019R31C2E3E | 53.0000 | |
3706 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGFA019R31C2E3E | 3 | |||||||||||||||||||
|
AGFA008R16A2I2VB | 10.0000 | |
2683 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | 1546-BFBGA Exposed Pad | 1546-BGA (37.5x34) | - | 544-AGFA008R16A2I2VB | 1 | MPU, FPGA | 384 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 764K Logic Elements | |||||||
|
AGFB023R24C2E2VB | 19.0000 | |
7449 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | - | 544-AGFB023R24C2E2VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | |||||||
 |
MPFS095T-1FCVG484E | 236.5600 | |
7703 | 0.00000000 | Microchip Technology | PolarFire® | Tray | Active | 0°C ~ 100°C | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | download | REACH Unaffected | 150-MPFS095T-1FCVG484E | 1 | MPU, FPGA | MCU - 136, FPGA - 276 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 857.6kB | 128kB | FPGA - 93K Logic Modules | ||||||
|
BCM68570SL01 | - | |
4458 | 0.00000000 | Broadcom Limited | * | Tray | Obsolete | BCM68570 | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 1 | ||||||||||||||
|
AGIB023R18A2I3E | 74.0000 | |
8778 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGIB023R18A2I3E | 3 | |||||||||||||||||||
|
M2S025TS-FG484 | 115.9540 | |
3479 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 484-BGA | M2S025 | 484-FPBGA (23x23) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | 267 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 25K Logic Modules | ||
|
10AS066K4F35I3LG | 5.0000 | |
7391 | 0.00000000 | Intel | Arria 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA, FC (35x35) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 965078 | 3A001A7B | 8542.39.0001 | 1 | MCU, FPGA | 396 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 660K Logic Elements | ||
 |
5ASXMB5G4F40C4G | 6.0000 | |
8604 | 0.00000000 | Intel | Arria V SX | Tray | Active | 0°C ~ 85°C (TJ) | 1517-BBGA, FCBGA | 1517-FBGA, FC (40x40) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 544-5ASXMB5G4F40C4G | 21 | MCU, FPGA | MCU - 208, FPGA - 540 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 925MHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 462K Logic Elements | ||||
 |
M2S025-1FCS325 | 79.9457 | |
8937 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 325-TFBGA, FCBGA | M2S025 | 325-FCBGA (11x11) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 176 | MCU, FPGA | 180 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 25K Logic Modules | ||
|
MAX32680GLR+ | 14.9100 | |
969 | 0.00000000 | Analog Devices Inc./Maxim Integrated | - | Tray | Active | -40°C ~ 85°C (TA) | 88-VFLGA Exposed Pad | 88-LGA (10x10) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 5A992C SC | 8542.31.0001 | 168 | MCU | 36 | ARM® Cortex®-M4F | 100MHz | Bluetooth, I²C, SPI, UART | DMA, I²S, PWM, WDT | 128kB | 512kB | - | |||
 |
M2S050-FGG896I | 189.6244 | |
6610 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 896-BGA | M2S050 | 896-FBGA (31x31) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 27 | MCU, FPGA | 377 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 50K Logic Modules | ||
|
AGID019R31B2E2VB | 28.0000 | |
8692 | 0.00000000 | Intel | Agilex I | Tray | Active | 0°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | - | 544-AGID019R31B2E2VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | |||||||
 |
5CSEBA2U19I7N | 131.2520 | |
4849 | 0.00000000 | Intel | Cyclone® V SE | Tray | Active | -40°C ~ 100°C (TJ) | 484-FBGA | 5CSEBA2 | 484-UBGA (19x19) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 84 | MCU, FPGA | MCU - 151, FPGA - 66 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 800MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 25K Logic Elements | ||
|
AGFB014R24D2E2V | 36.0000 | |
8436 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGFB014R24D2E2V | 3 | |||||||||||||||||||
 |
10AS057K2F40E2SG | 5.0000 | |
5675 | 0.00000000 | Intel | Arria 10 SX | Tray | Active | 0°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 973526 | 3A001A7B | 8542.39.0001 | 1 | MCU, FPGA | 696 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 570K Logic Elements | ||
 |
A2F060M3E-FG256M | - | |
9029 | 0.00000000 | Microsemi Corporation | SmartFusion® | Tray | Obsolete | -55°C ~ 125°C (TJ) | 256-LBGA | A2F060M3E | 256-FPBGA (17x17) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A001A2C | 8542.39.0001 | 90 | MCU, FPGA | MCU - 26, FPGA - 66 | ARM® Cortex®-M3 | 80MHz | EBI/EMI, I²C, SPI, UART/USART | DMA, POR, WDT | 16KB | 128KB | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | ||
|
AGFB022R31C2I1VAA | 89.0000 | |
5986 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFB022R31C2I1VAA | 1 | MPU, FPGA | 720 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.2M Logic Elements | ||||||
|
A2F500M3G-FGG484 | 94.5000 | |
779 | 0.00000000 | Microchip Technology | SmartFusion® | Tray | Active | 0°C ~ 85°C (TJ) | 484-BGA | A2F500 | 484-FPBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | MCU - 41, FPGA - 128 | ARM® Cortex®-M3 | 80MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 512KB | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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