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Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes |
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A2F500M3G-FG256I | - | 6812 | 0.00000000 | Microchip Technology | SmartFusion® | Tray | Active | -40°C ~ 100°C (TJ) | 256-LBGA | A2F500 | 256-FPBGA (17x17) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | MCU - 25, FPGA - 66 | ARM® Cortex®-M3 | 80MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 512KB | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | ||||
AGFB022R24C3I3E | 49.0000 | 5805 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFB022R24C3I3E | 1 | MPU, FPGA | 744 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.2M Logic Elements | ||||||||
10AS032E4F27E3SG | 1.0000 | 7698 | 0.00000000 | Intel | Arria 10 SX | Tray | Active | 0°C ~ 100°C (TJ) | 672-BBGA, FCBGA | 672-FBGA, FC (27x27) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 965339 | 5A002A1 | 8542.39.0001 | 1 | MCU, FPGA | 240 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 320K Logic Elements | ||||
XCZU1CG-1UBVA494I | 292.5000 | 58 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC CG | Tray | Active | -40°C ~ 100°C (TJ) | 494-WFBGA, FCBGA | 494-FCBGA (14x14) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU1CG-1UBVA494I | 1 | MPU, FPGA | 82 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | - | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 81K+ Logic Cells | |||||||
M2S150T-1FCS536 | 512.8928 | 4410 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 536-LFBGA, CSPBGA | M2S150 | 536-CSPBGA (16x16) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | 293 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 150K Logic Modules | ||||
XC7Z035-L2FFG900I | 2.0000 | 6405 | 0.00000000 | AMD | Zynq®-7000 | Tray | Active | -40°C ~ 100°C (TJ) | 900-BBGA, FCBGA | XC7Z035 | 900-FCBGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 3A001A7B | 8542.39.0001 | 1 | MCU, FPGA | 130 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 800MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA | 256KB | - | Kintex™-7 FPGA, 275K Logic Cells | ||||
SC-20100S-A | 22.0000 | 5549 | 0.00000000 | GHI Electronics, LLC | - | Box | Active | -40°C ~ 85°C | 100-LQFP | SC-20100 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1711-SC-20100S-A | 3A991A2 | 8473.30.1180 | 90 | MPU | 76 | ARM Cortex-M7 | 480MHz | CANbus, Ethernet, I²C, MMC/SD, SPI, UART/USART, USB | PWM | 1MB | 2MB | - | |||
XCZU6CG-1FFVC900E | 2.0000 | 9102 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC CG | Tray | Active | 0°C ~ 100°C (TJ) | 900-BBGA, FCBGA | XCZU6 | 900-FCBGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 204 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | ||||
A2F500M3G-FG484 | 94.4993 | 9757 | 0.00000000 | Microchip Technology | SmartFusion® | Tray | Active | 0°C ~ 85°C (TJ) | 484-BGA | A2F500 | 484-FPBGA (23x23) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | MCU - 41, FPGA - 128 | ARM® Cortex®-M3 | 80MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 512KB | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | ||||
M2S010TS-1VFG400T2 | - | 4382 | 0.00000000 | Microchip Technology | Automotive, AEC-Q100, SmartFusion®2 | Tray | Active | -40°C ~ 125°C (TJ) | 400-LFBGA | M2S010 | 400-VFBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 0000.00.0000 | 90 | MCU, FPGA | 195 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 10K Logic Modules | |||||
XCZU1EG-1UBVA494I | 352.3000 | 1837 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 100°C (TJ) | 494-WFBGA, FCBGA | 494-FCBGA (14x14) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU1EG-1UBVA494I | 1 | MPU, FPGA | 82 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 600MHz, 1.2GHz | - | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 81K+ Logic Cells | |||||||
AGFB019R31C3E4X | 57.0000 | 1698 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGFB019R31C3E4X | 3 | |||||||||||||||||||||
AGFC023R24C2E2VB | 21.0000 | 4363 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | - | 544-AGFC023R24C2E2VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | |||||||||
XCVM1802-2LLIVSVA2197 | 20.0000 | 4594 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | -40°C ~ 100°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1802-2LLIVSVA2197 | 1 | MPU, FPGA | 648 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ Prime FPGA, 1.9M Logic Cells | |||||||
AGFB006R16A2E1VB | 8.0000 | 1781 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | 1546-BFBGA Exposed Pad | 1546-BGA (37.5x34) | - | 544-AGFB006R16A2E1VB | 1 | MPU, FPGA | 384 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 573K Logic Elements | |||||||||
M2S010-FG484I | 60.5793 | 8312 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 484-BGA | M2S010 | 484-FPBGA (23x23) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | 233 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 10K Logic Modules | ||||
MPFS095TS-FCVG484I | 279.5900 | 4226 | 0.00000000 | Microchip Technology | PolarFire® | Tray | Active | -40°C ~ 100°C | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | download | REACH Unaffected | 150-MPFS095TS-FCVG484I | 1 | MPU, FPGA | MCU - 136, FPGA - 276 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 857.6kB | 128kB | FPGA - 93K Logic Modules | ||||||||
XCVM1302-1LLINSVF1369 | 6.0000 | 8426 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | -40°C ~ 100°C (TJ) | 1369-BFBGA | 1369-BGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1302-1LLINSVF1369 | 1 | MPU, FPGA | 316 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 70k Logic Cells | |||||||
10AS027H2F35E2SG | 1.0000 | 2763 | 0.00000000 | Intel | Arria 10 SX | Tray | Active | 0°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA, FC (35x35) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 965334 | 5A002A1 | 8542.39.0001 | 1 | MCU, FPGA | 384 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 270K Logic Elements | ||||
BCM3384ZUKFSBGB9T | - | 5610 | 0.00000000 | Broadcom Limited | - | Tray | Active | BCM3384 | - | ROHS3 Compliant | 516-BCM3384ZUKFSBGB9T | 60 | |||||||||||||||||||
XCZU1CG-1UBVA494E | 234.0000 | 8974 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC CG | Tray | Active | 0°C ~ 100°C (TJ) | 494-WFBGA, FCBGA | 494-FCBGA (14x14) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU1CG-1UBVA494E | 1 | MPU, FPGA | 82 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | - | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 81K+ Logic Cells | |||||||
5ASXMB5G4F40C4 | - | 7193 | 0.00000000 | Intel | Arria V SX | Tray | Obsolete | 0°C ~ 85°C (TJ) | 1517-BBGA, FCBGA | 1517-FBGA, FC (40x40) | - | RoHS Compliant | 3 (168 Hours) | 544-5ASXMB5G4F40C4 | OBSOLETE | 1 | MCU, FPGA | MCU - 208, FPGA - 540 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 925MHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 462K Logic Elements | ||||||
1SX280LU3F50I2VG | 33.0000 | 8365 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 2397-BBGA, FCBGA | 2397-FBGA, FC (50x50) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.39.0001 | 1 | MCU, FPGA | 704 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2800K Logic Elements | |||||
AGID019R18A2I2V | 77.0000 | 7490 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGID019R18A2I2V | 3 | |||||||||||||||||||||
10AS066H2F34E2LG | 5.0000 | 9254 | 0.00000000 | Intel | Arria 10 SX | Tray | Active | 0°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA, FC (35x35) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 965075 | 3A001A7B | 8542.39.0001 | 1 | MCU, FPGA | 492 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 660K Logic Elements | ||||
M2S060TS-1FGG484M | 433.2757 | 3905 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -55°C ~ 125°C (TJ) | 484-BGA | M2S060 | 484-FPBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 0000.00.0000 | 60 | MCU, FPGA | 267 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 60K Logic Modules | |||||
XC7Z012S-1CLG485I | 147.0000 | 4338 | 0.00000000 | AMD | Zynq®-7000 | Tray | Active | -40°C ~ 100°C (TJ) | 485-LFBGA, CSPBGA | XC7Z012 | 485-CSPBGA (19x19) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 122-2001 | 3A991D | 8542.39.0001 | 84 | MCU, FPGA | 150 | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | 667MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA | 256KB | - | Artix™-7 FPGA, 55K Logic Cells | |||
AGFA019R24C2E1VB | 19.0000 | 1025 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | - | 544-AGFA019R24C2E1VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | |||||||||
XCZU47DR-L1FSVG1517I | 25.0000 | 1545 | 0.00000000 | AMD | Zynq® UltraScale+™ RFSoC | Tray | Active | -40°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU47DR-L1FSVG1517I | 1 | MCU, FPGA | 561 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | |||||||
XCVC1702-1MSEVSVA2197 | 20.0000 | 2050 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | 0°C ~ 100°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | - | 4 (72 Hours) | 122-XCVC1702-1MSEVSVA2197 | 1 | MPU, FPGA | 608 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ AI Core FPGA, 1M Logic Cells |
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