- RFQ
- BOM
-
Contact Us
Tel: +86-0755-83501315
Email: sales@sic-components.com
- Chinese
- English
- French
- German
- Portuguese
- Spanish
- Russian
- Japanese
- Korean
- Arabic
- Irish
- Greek
- Turkish
- Italian
- Danish
- Romanian
- Indonesian
- Czech
- Afrikaans
- Swedish
- Polish
- Basque
- Catalan
- Esperanto
- Hindi
- Lao
- Albanian
- Amharic
- Armenian
- Azerbaijani
- Belarusian
- Bengali
- Bosnian
- Bulgarian
- Cebuano
- Chichewa
- Corsican
- Croatian
- Dutch
- Estonian
- Filipino
- Finnish
- Frisian
- Galician
- Georgian
- Gujarati
- Haitian
- Hausa
- Hawaiian
- Hebrew
- Hmong
- Hungarian
- Icelandic
- Igbo
- Javanese
- Kannada
- Kazakh
- Khmer
- Kurdish
- Kyrgyz
- Latin
- Latvian
- Lithuanian
- Luxembou..
- Macedonian
- Malagasy
- Malay
- Malayalam
- Maltese
- Maori
- Marathi
- Mongolian
- Burmese
- Nepali
- Norwegian
- Pashto
- Persian
- Punjabi
- Serbian
- Sesotho
- Sinhala
- Slovak
- Slovenian
- Somali
- Samoan
- Scots Gaelic
- Shona
- Sindhi
- Sundanese
- Swahili
- Tajik
- Tamil
- Telugu
- Thai
- Ukrainian
- Urdu
- Uzbek
- Vietnamese
- Welsh
- Xhosa
- Yiddish
- Yoruba
- Zulu
- Kinyarwanda
- Tatar
- Oriya
- Turkmen
- Uyghur
System On Chip (SoC)(4664)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
A2F500M3G-FG256I | - |  |
6812 | 0.00000000 | Microchip Technology | SmartFusion® | Tray | Active | -40°C ~ 100°C (TJ) | 256-LBGA | A2F500 | 256-FPBGA (17x17) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | MCU - 25, FPGA - 66 | ARM® Cortex®-M3 | 80MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 512KB | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | ||
|
A2F060M3E-1FG256I | - | |
9497 | 0.00000000 | Microsemi Corporation | SmartFusion® | Tray | Obsolete | -40°C ~ 100°C (TJ) | 256-LBGA | A2F060M3E | 256-FPBGA (17x17) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | MCU - 26, FPGA - 66 | ARM® Cortex®-M3 | 100MHz | EBI/EMI, I²C, SPI, UART/USART | DMA, POR, WDT | 16KB | 128KB | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | ||
|
A2F060M3E-FG256I | - | |
8364 | 0.00000000 | Microsemi Corporation | SmartFusion® | Tray | Obsolete | -40°C ~ 100°C (TJ) | 256-LBGA | A2F060M3E | 256-FPBGA (17x17) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | MCU - 26, FPGA - 66 | ARM® Cortex®-M3 | 80MHz | EBI/EMI, I²C, SPI, UART/USART | DMA, POR, WDT | 16KB | 128KB | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | ||
 |
A2F500M3G-FG484I | 110.5692 | |
9528 | 0.00000000 | Microchip Technology | SmartFusion® | Tray | Active | -40°C ~ 100°C (TJ) | 484-BGA | A2F500 | 484-FPBGA (23x23) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | MCU - 41, FPGA - 128 | ARM® Cortex®-M3 | 80MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 512KB | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | ||
|
A2F200M3F-1FG484 | 72.3450 | |
4789 | 0.00000000 | Microchip Technology | SmartFusion® | Tray | Active | 0°C ~ 85°C (TJ) | 484-BGA | A2F200 | 484-FPBGA (23x23) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | MCU - 41, FPGA - 94 | ARM® Cortex®-M3 | 100MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 256KB | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | ||
|
A2F500M3G-1FGG484I | 121.1375 | |
2176 | 0.00000000 | Microchip Technology | SmartFusion® | Tray | Active | -40°C ~ 100°C (TJ) | 484-BGA | A2F500 | 484-FPBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | MCU - 41, FPGA - 128 | ARM® Cortex®-M3 | 100MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 512KB | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | ||
 |
A2F500M3G-1PQG208 | - | |
6133 | 0.00000000 | Microchip Technology | SmartFusion® | Tray | Active | 0°C ~ 85°C (TJ) | 208-BFQFP | A2F500 | 208-PQFP (28x28) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 24 | MCU, FPGA | MCU - 22, FPGA - 66 | ARM® Cortex®-M3 | 100MHz | Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 512KB | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | ||
 |
BCM3380EKFSBG | - | |
6500 | 0.00000000 | Broadcom Limited | * | Tray | Obsolete | - | 1 (Unlimited) | 5A992C | 8542.31.0001 | 1 | |||||||||||||||||
|
BCM3380ZKFEBG | - | |
9877 | 0.00000000 | Broadcom Limited | * | Tray | Obsolete | - | 1 (Unlimited) | 5A992C | 8542.31.0001 | 1 | |||||||||||||||||
|
BCM60321SB02 | - | |
5839 | 0.00000000 | Broadcom Limited | * | Tray | Active | BCM60321 | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 0000.00.0000 | 1 | |||||||||||||||
|
BCM55030SF01 | - | |
6907 | 0.00000000 | Broadcom Limited | * | Tray | Obsolete | BCM55030 | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 1 | ||||||||||||||
|
BCM1125HB0K400G | - | |
3293 | 0.00000000 | Broadcom Limited | * | Bulk | Obsolete | download | 1 (Unlimited) | OBSOLETE | 0000.00.0000 | 27 | |||||||||||||||||
|
BCM1125HB0K800G | - | |
1921 | 0.00000000 | Broadcom Limited | * | Bulk | Obsolete | download | 1 (Unlimited) | OBSOLETE | 0000.00.0000 | 27 | |||||||||||||||||
|
BCM3382DKFEBG | - | |
2807 | 0.00000000 | Broadcom Limited | * | Tray | Obsolete | - | 1 (Unlimited) | OBSOLETE | 0000.00.0000 | 84 | |||||||||||||||||
|
BCM33843EKFSBG | - | |
1730 | 0.00000000 | Broadcom Limited | - | Tray | Obsolete | - | 1 (Unlimited) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 60 | ||||||||||||||||
|
BCM43465SAP01 | - | |
8080 | 0.00000000 | Broadcom Limited | * | Tray | Obsolete | BCM43465 | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 1 | ||||||||||||||
 |
M2S010S-TQ144I | - | |
4531 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Obsolete | -40°C ~ 100°C (TJ) | 144-LQFP | 144-TQFP (20x20) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.39.0001 | 60 | MCU, FPGA | 84 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | 64KB | 256KB | FPGA - 10K Logic Modules | |||
|
M2S010TS-1VFG256T2 | - | |
3912 | 0.00000000 | Microchip Technology | Automotive, AEC-Q100, SmartFusion®2 | Tray | Active | -40°C ~ 125°C (TJ) | 256-LBGA | M2S010 | 256-FPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 0000.00.0000 | 119 | MCU, FPGA | 138 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 10K Logic Modules | |||
 |
M2S010TS-1VFG400T2 | - | |
4382 | 0.00000000 | Microchip Technology | Automotive, AEC-Q100, SmartFusion®2 | Tray | Active | -40°C ~ 125°C (TJ) | 400-LFBGA | M2S010 | 400-VFBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 0000.00.0000 | 90 | MCU, FPGA | 195 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 10K Logic Modules | |||
|
M2S025TS-1VFG400T2 | - | |
8925 | 0.00000000 | Microchip Technology | Automotive, AEC-Q100, SmartFusion®2 | Tray | Active | -40°C ~ 125°C (TJ) | 400-LFBGA | M2S025 | 400-VFBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 0000.00.0000 | 90 | MCU, FPGA | 207 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 25K Logic Modules | |||
|
M2S060T-1FGG484M | 393.8772 | |
9996 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -55°C ~ 125°C (TJ) | 484-BGA | M2S060 | 484-FPBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 0000.00.0000 | 60 | MCU, FPGA | 267 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 60K Logic Modules | |||
|
M2S060TS-1FGG484M | 433.2757 | |
3905 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -55°C ~ 125°C (TJ) | 484-BGA | M2S060 | 484-FPBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 0000.00.0000 | 60 | MCU, FPGA | 267 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 60K Logic Modules | |||
|
M2S005S-1VFG256T2 | - | |
7464 | 0.00000000 | Microchip Technology | Automotive, AEC-Q100, SmartFusion®2 | Tray | Active | -40°C ~ 125°C (TJ) | 256-LBGA | M2S005 | 256-FPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 0000.00.0000 | 119 | MCU, FPGA | 161 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | 64KB | 128KB | FPGA - 5K Logic Modules | |||
 |
XC7Z012S-1CLG485I | 147.0000 | |
4338 | 0.00000000 | AMD | Zynq®-7000 | Tray | Active | -40°C ~ 100°C (TJ) | 485-LFBGA, CSPBGA | XC7Z012 | 485-CSPBGA (19x19) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 122-2001 | 3A991D | 8542.39.0001 | 84 | MCU, FPGA | 150 | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | 667MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA | 256KB | - | Artix™-7 FPGA, 55K Logic Cells | |
 |
XC7Z014S-2CLG400E | 145.6000 | |
4116 | 0.00000000 | AMD | Zynq®-7000 | Tray | Active | 0°C ~ 100°C (TJ) | 400-LFBGA, CSPBGA | XC7Z014 | 400-CSPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 122-2005 | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | 125 | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | 766MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA | 256KB | - | Artix™-7 FPGA, 65K Logic Cells | |
|
XC7Z012S-1CLG485C | 127.8900 | |
84 | 0.00000000 | AMD | Zynq®-7000 | Tray | Active | 0°C ~ 85°C (TJ) | 485-LFBGA, CSPBGA | XC7Z012 | 485-CSPBGA (19x19) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 122-2014 | 3A991D | 8542.39.0001 | 84 | MCU, FPGA | 150 | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | 667MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA | 256KB | - | Artix™-7 FPGA, 55K Logic Cells | |
 |
XCZU9CG-1FFVB1156I | 4.0000 | |
7973 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC CG | Tray | Active | -40°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | XCZU9 | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.31.0001 | 1 | MCU, FPGA | 328 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ||
 |
XCZU9CG-1FFVC900I | 3.0000 | |
5465 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC CG | Tray | Active | -40°C ~ 100°C (TJ) | 900-BBGA, FCBGA | XCZU9 | 900-FCBGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.31.0001 | 1 | MCU, FPGA | 204 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ||
|
XCZU9EG-2FFVB1156E | 4.0000 | |
16 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | 0°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | XCZU9 | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.31.0001 | 1 | MCU, FPGA | 328 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 533MHz, 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ||
|
XCZU9EG-1FFVB1156E | 3.0000 | |
8757 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | 0°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | XCZU9 | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.31.0001 | 1 | MCU, FPGA | 328 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 600MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
Wishlist (0 Items)