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Microcontrollers(102136)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
R5F563TCEDFP#V1 | 10.5787 |  |
4357 | 0.00000000 | Renesas Electronics America Inc | RX600 | Tray | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | R5F563 | 100-LFQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 57 | RX | 32-Bit Single-Core | 100MHz | EBI/EMI, I²C, LINbus, SCI, SPI | DMA, LVD, POR, PWM, WDT | 384KB (384K x 8) | FLASH | 32K x 8 | 32K x 8 | 2.7V ~ 3.6V | A/D 12x10b, 8x12b; D/A 2x10b | Internal | ||
 |
R7S910011CBG#AC0 | 24.2440 | |
8570 | 0.00000000 | Renesas Electronics America Inc | RZ/T1 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 320-FBGA | R7S910011 | 320-FBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 209 | ARM® Cortex®-R4F | 32-Bit Single-Core | 450MHz | CANbus, CSI, EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB | DMA, POR, PWM, WDT | - | ROMless | - | 1.5M x 8 | 1.14V ~ 3.6V | A/D 24x12b | Internal | ||
|
R7S910017CBG#AC0 | 34.6912 | |
4226 | 0.00000000 | Renesas Electronics America Inc | RZ/T1 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 320-FBGA | R7S910017 | 320-FBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 209 | ARM® Cortex®-R4F | 32-Bit Single-Core | 450MHz | CANbus, CSI, EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB | DMA, POR, PWM, WDT | - | ROMless | - | 1.5M x 8 | 1.14V ~ 3.6V | A/D 24x12b | Internal | ||
 |
MCF51AC256BCFGE | 11.0750 | |
5871 | 0.00000000 | NXP USA Inc. | MCF51AC | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-LQFP | MCF51 | 44-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320266557 | 3A991A2 | 8542.31.0001 | 800 | 36 | Coldfire V1 | 32-Bit Single-Core | 50MHz | I²C, SCI, SPI | LVD, PWM, WDT | 256KB (256K x 8) | FLASH | - | 32K x 8 | 2.7V ~ 5.5V | A/D 9x12b | External | |
 |
MKL81Z128CBH7R | 14.2200 | |
3 | 0.00000000 | NXP USA Inc. | Kinetis KL8 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-XFBGA, WLCSP | MKL81Z128 | 64-WLCSP (3.48x3.38) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 5A002A1 | 8542.31.0001 | 5,000 | 41 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 72MHz | I²C, SPI, UART/USART, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 96K x 8 | 1.71V ~ 3.6V | A/D 11x16b; D/A 1x6b, 1x12b | Internal | ||
 |
S912B32E4CFUE8R | 35.1319 | |
3432 | 0.00000000 | NXP USA Inc. | HC12 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 80-QFP | S912 | 80-QFP (14x14) | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935309891528 | EAR99 | 8542.31.0001 | 750 | 63 | CPU12 | 16-Bit | 8MHz | SCI, SPI | POR, PWM, WDT | 32KB (32K x 8) | FLASH | 768 x 8 | 1K x 8 | 4.5V ~ 5.5V | A/D 8x10b | External | |
 |
S912DG12AE0CPVE | 55.4215 | |
1340 | 0.00000000 | NXP USA Inc. | HC12 | Bulk | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324454557 | EAR99 | 8542.31.0001 | 300 | 69 | CPU12 | 16-Bit | 8MHz | CANbus, I²C, SCI, SPI | POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 4.5V ~ 5.5V | A/D 16x8/10b | Internal | |
 |
S912ZVL64F0CLCR | 4.0438 | |
5672 | 0.00000000 | NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | S912 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322524528 | 3A991A2 | 8542.31.0001 | 2,000 | 19 | S12Z | 16-Bit | 32MHz | CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 6x10b | Internal | |
 |
S912ZVL64F0VLFR | 4.4064 | |
4100 | 0.00000000 | NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | S912 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316497528 | 3A991A2 | 8542.31.0001 | 2,000 | 34 | S12Z | 16-Bit | 32MHz | CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 10x10b | Internal | |
|
S912ZVL96F0VLF | 4.9687 | |
2924 | 0.00000000 | NXP USA Inc. | S12 MagniV | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | S912 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318888557 | 3A991A2 | 8542.31.0001 | 1,250 | 34 | S12Z | 16-Bit | 32MHz | CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 512 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 10x10b | Internal | |
 |
S9KEAZN64AVLH | 3.2842 | |
5250 | 0.00000000 | NXP USA Inc. | Kinetis KEA | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | S9KEAZN64 | 64-LQFP (10x10) | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322484557 | 3A991A2 | 8542.31.0001 | 800 | 57 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | |
|
S9S12DP51J4VPVE | 42.7505 | |
7376 | 0.00000000 | NXP USA Inc. | HCS12 | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 112-LQFP | S9S12 | 112-LQFP (20x20) | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316206557 | 3A991A2 | 8542.31.0001 | 300 | 20 | HCS12 | 16-Bit | 25MHz | CANbus, I²C, SCI, SPI | PWM, WDT | 512KB (512K x 8) | FLASH | 4K x 8 | 14K x 8 | 2.35V ~ 5.25V | A/D 8x10b | External | |
 |
SCF5235F4CVM150 | 53.2416 | |
4900 | 0.00000000 | NXP USA Inc. | MCF523x | Bulk | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 256-LBGA | SCF5235 | 256-MAPBGA (17x17) | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319681557 | 5A002A1 | 8542.31.0001 | 450 | 97 | Coldfire V2 | 32-Bit Single-Core | 150MHz | CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, WDT | - | ROMless | - | 64K x 8 | 1.4V ~ 1.6V | - | External | |
 |
SPC5744PFK1AMLQ8 | 19.5933 | |
2089 | 0.00000000 | NXP USA Inc. | MPC57xx | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 144-LQFP | SPC5744 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325067557 | 3A991A2 | 8542.31.0001 | 300 | 79 | e200z4 | 32-Bit Dual-Core | 180MHz | CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART | DMA, LVD, POR, WDT | 2.5MB (2.5M x 8) | FLASH | - | 384K x 8 | 3.15V ~ 5.5V | A/D 64x12b | Internal | |
 |
SPC5746BSK1MKU2R | 22.5225 | |
7728 | 0.00000000 | NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5746 | 176-LQFP (24x24) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313241528 | 5A002A1 | 8542.31.0001 | 500 | 129 | e200z4 | 32-Bit Single-Core | 120MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 3MB (3M x 8) | FLASH | 64K x 8 | 384K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | |
 |
SPC5746CK1MMJ6 | 24.4365 | |
3947 | 0.00000000 | NXP USA Inc. | MPC57xx | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 256-LBGA | SPC5746 | 256-MAPPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318931557 | 5A002A1 | 8542.31.0001 | 450 | 178 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |
|
SPC5747CK1VKU6R | 26.6805 | |
6976 | 0.00000000 | NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5747 | 176-LQFP (24x24) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320655528 | 5A002A1 | 8542.31.0001 | 500 | 129 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |
|
SPC5747GK1MMJ6 | 33.6125 | |
7427 | 0.00000000 | NXP USA Inc. | MPC57xx | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 256-LBGA | SPC5747 | 256-MAPPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318778557 | 5A002A1 | 8542.31.0001 | 450 | 178 | e200z2, e200z4, e200z4 | 32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 4MB (4M x 8) | FLASH | - | 768K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |
|
SPC5748GGK1VMJ6 | 38.9664 | |
9494 | 0.00000000 | NXP USA Inc. | MPC57xx | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 256-LBGA | SPC5748 | 256-MAPPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316029557 | 5A002A1 | 8542.31.0001 | 450 | 178 | e200z2, e200z4, e200z4 | 32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |
|
SPC5748GTK1MMJ6 | 41.8651 | |
3008 | 0.00000000 | NXP USA Inc. | MPC57xx | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 256-LBGA | SPC5748 | 256-MAPPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313376557 | 5A002A1 | 8542.31.0001 | 450 | 178 | e200z2, e200z4, e200z4 | 32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |
|
MKV42F256VLH16 | 12.5200 | |
9782 | 0.00000000 | NXP USA Inc. | Kinetis KV | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MKV42F256 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 48 | ARM® Cortex®-M4 | 32-Bit Single-Core | 168MHz | CANbus, I²C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 32K x 8 | 1.71V ~ 3.6V | A/D 29x12b | Internal | ||
 |
MKV44F128VLL16 | 8.8326 | |
7407 | 0.00000000 | NXP USA Inc. | Kinetis KV | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | MKV44F128 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 74 | ARM® Cortex®-M4 | 32-Bit Single-Core | 168MHz | CANbus, I²C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 24K x 8 | 1.71V ~ 3.6V | A/D 38x12b; D/A 1x12b | Internal | ||
 |
PIC16F18346-I/GZ | 1.6600 | |
2186 | 0.00000000 | Microchip Technology | PIC® XLP™ 16F, Functional Safety (FuSa) | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-UFQFN Exposed Pad | PIC16F18346 | 20-UQFN (4x4) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 91 | 18 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 28KB (16K x 14) | FLASH | 256 x 8 | 2K x 8 | 2.3V ~ 5.5V | A/D 17x10b; D/A 1x5b | Internal | ||
 |
PIC16F18854-I/MV | 1.5200 | |
720 | 0.00000000 | Microchip Technology | PIC® XLP™ 16F, Functional Safety (FuSa) | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 28-UFQFN Exposed Pad | PIC16F18854 | 28-UQFN (4x4) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 91 | 25 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 7KB (4K x 14) | FLASH | 256 x 8 | 512 x 8 | 2.3V ~ 5.5V | A/D 24x10b; D/A 1x5b | Internal | ||
 |
PIC16LF18326-E/SL | 1.6600 | |
1893 | 0.00000000 | Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | PIC16LF18326 | 14-SOIC | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 57 | 12 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 28KB (16K x 14) | FLASH | 256 x 8 | 2K x 8 | 1.8V ~ 3.6V | A/D 11x10b; D/A 1x5b | Internal | ||
 |
PIC16LF18326-E/ST | 1.4190 | |
4259 | 0.00000000 | Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | PIC16LF18326 | 14-TSSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 96 | 12 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 28KB (16K x 14) | FLASH | 256 x 8 | 2K x 8 | 1.8V ~ 3.6V | A/D 11x10b; D/A 1x5b | Internal | ||
 |
PIC16LF18326-I/JQ | 1.4200 | |
21 | 0.00000000 | Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-UQFN Exposed Pad | PIC16LF18326 | 16-UQFN (4x4) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 91 | 12 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 28KB (16K x 14) | FLASH | 256 x 8 | 2K x 8 | 1.8V ~ 3.6V | A/D 11x10b; D/A 1x5b | Internal | ||
 |
PIC16LF18346-I/SO | 1.4850 | |
8934 | 0.00000000 | Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | PIC16LF18346 | 20-SOIC | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 38 | 18 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 28KB (16K x 14) | FLASH | 256 x 8 | 2K x 8 | 1.8V ~ 3.6V | A/D 17x10b; D/A 1x5b | Internal | ||
 |
PIC16LF18854-E/ML | 1.4190 | |
6437 | 0.00000000 | Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 28-VQFN Exposed Pad | PIC16LF18854 | 28-QFN (6x6) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 61 | 25 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 7KB (4K x 14) | FLASH | 256 x 8 | 512 x 8 | 1.8V ~ 3.6V | A/D 24x10b; D/A 1x5b | Internal | ||
 |
PIC16LF18854-I/SS | 1.5200 | |
4674 | 0.00000000 | Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | PIC16LF18854 | 28-SSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 47 | 25 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 7KB (4K x 14) | FLASH | 256 x 8 | 512 x 8 | 1.8V ~ 3.6V | A/D 24x10b; D/A 1x5b | Internal |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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