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Microcontrollers(102136)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
S912XET256J2CALR | 13.6637 |  |
7842 | 0.00000000 | NXP USA Inc. | HCS12X | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315505528 | 3A991A2 | 8542.31.0001 | 500 | 91 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 16K x 8 | 1.72V ~ 5.5V | A/D 16x12b | External | |
 |
R5F566TEAGFH#10 | 5.4059 | |
8924 | 0.00000000 | Renesas Electronics America Inc | RX | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 112-LQFP | 112-LQFP (20x20) | - | ROHS3 Compliant | 559-R5F566TEAGFH#10 | 480 | 84 | RXv3 | 32-Bit | 160MHz | CANbus, EBI/EMI, Ethernet, I²C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART | DMA, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 32K x 8 | 64K x 8 | 2.7V ~ 5.5V | A/D 22x12b; D/A 2x12b | Internal | ||||||
 |
CY90349CASPFV-GS-828E1 | - | |
9281 | 0.00000000 | Infineon Technologies | - | Tray | Obsolete | CY90349 | - | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 90 | |||||||||||||||||||||
|
S32K314NHT1MMMST | 14.6205 | |
6736 | 0.00000000 | NXP USA Inc. | * | Tray | Active | - | ROHS3 Compliant | 568-S32K314NHT1MMMST | 760 | |||||||||||||||||||||||
 |
S9S12HY48J0CLH | 6.7101 | |
3017 | 0.00000000 | NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | S9S12 | 64-LQFP (10x10) | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310848557 | 3A991A2 | 8542.31.0001 | 160 | 50 | HCS12 | 16-Bit | 32MHz | CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI | LCD, Motor control PWM, POR, PWM, WDT | 48KB (48K x 8) | FLASH | 4K x 8 | 4K x 8 | 4.5V ~ 5.5V | A/D 6x10b | Internal | |
 |
C8051F330 | - | |
9587 | 0.00000000 | Silicon Labs | C8051F33x | Tube | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 20-VFQFN Exposed Pad | C8051F330 | 20-MLP (4x4) | download | RoHS non-compliant | 1 (Unlimited) | EAR99 | 8542.31.0001 | 91 | 17 | 8051 | 8-Bit | 25MHz | SMBus (2-Wire/I²C), SPI, UART/USART | POR, PWM, Temp Sensor, WDT | 8KB (8K x 8) | FLASH | - | 768 x 8 | 2.7V ~ 3.6V | A/D 16x10b; D/A 1x10b | Internal | |||
 |
PIC32MZ2064DAL169T-V/HF | 19.0191 | |
1186 | 0.00000000 | Microchip Technology | PIC® 32MZ DAL | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 169-LFBGA | PIC32MZ2064DAL169 | 169-LFBGA (11x11) | download | ROHS3 Compliant | REACH Unaffected | 150-PIC32MZ2064DAL169T-V/HFTR | 1,500 | 120 | MIPS32® microAptiv™ | 32-Bit Single-Core | 200MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT | 2MB (2M x 8) | FLASH | - | 640K x 8 | 1.7V ~ 1.9V | A/D 45x12b | Internal | ||||
 |
LPC1759FBD80,551 | 11.1344 | |
3308 | 0.00000000 | NXP USA Inc. | LPC17xx | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 80-LQFP | LPC1759 | 80-LQFP (12x12) | download | ROHS3 Compliant | 2 (1 Year) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 119 | 52 | ARM® Cortex®-M3 | 32-Bit Single-Core | 120MHz | CANbus, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 2.4V ~ 3.6V | A/D 6x12b; D/A 1x10b | Internal | ||
|
S9S12B128J3MPVER | - | |
3778 | 0.00000000 | NXP USA Inc. | * | Tape & Reel (TR) | Obsolete | S9S12 | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 568-S9S12B128J3MPVERTR | OBSOLETE | 500 | |||||||||||||||||||
 |
PIC16F1825-I/P | 2.1200 | |
515 | 0.00000000 | Microchip Technology | PIC® XLP™ mTouch™ 16F | Tube | Active | -40°C ~ 85°C (TA) | Through Hole | 14-DIP (0.300", 7.62mm) | PIC16F1825 | 14-PDIP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | PIC16F1825IP | 3A991A2 | 8542.31.0001 | 30 | 11 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 14KB (8K x 14) | FLASH | 256 x 8 | 1K x 8 | 1.8V ~ 5.5V | A/D 8x10b | Internal | |
 |
MB89P945PF-GE1 | - | |
9423 | 0.00000000 | Infineon Technologies | F²MC-8L MB89940 | Tray | Discontinued at SIC | -40°C ~ 85°C (TA) | Surface Mount | 48-BQFP | MB89P945 | 48-QFP (12x12) | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 84 | 24 | F²MC-8L | 8-Bit | 8MHz | - | LVD, LCD, POR, PWM, WDT | 16KB (16K x 8) | OTP | - | 512 x 8 | 3.5V ~ 5.5V | A/D 2x8b | External | ||
 |
MB90467PF-G-254E1 | - | |
4389 | 0.00000000 | Infineon Technologies | F²MC-16LX MB90460 | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 64-BQFP | MB90467 | 64-QFP (14x20) | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 66 | 51 | F²MC-16LX | 16-Bit | 16MHz | UART/USART | POR, PWM, WDT | 64KB (64K x 8) | Mask ROM | - | 2K x 8 | 3V ~ 5.5V | A/D 8x8/10b | External | ||
 |
ATSAMC21G17A-MNT | 3.1200 | |
8426 | 0.00000000 | Microchip Technology | SAM C21, Functional Safety (FuSa) | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | ATSAMC21 | 48-QFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 4,000 | 38 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | CANbus, I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 2.7V ~ 5.5V | A/D 14x12b, 2x16b; D/A 1x10b | Internal | ||
 |
MC9S08DV16MLC | 6.1800 | |
6 | 0.00000000 | Freescale Semiconductor | S08 | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 32-LQFP | MC9S08 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | Vendor Undefined | 3A991A2 | 8542.31.0001 | 1 | 25 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 10x12b | External | ||
|
C8051F855-C-IMR | 1.4993 | |
4845 | 0.00000000 | Silicon Labs | C8051F85x | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 20-VFQFN Exposed Pad | C8051F855 | download | RoHS Compliant | 2 (1 Year) | 3A991A | 8542.31.0001 | 1,500 | 15 | 8051 | 8-Bit | 25MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 2KB (2K x 8) | FLASH | - | 256 x 8 | 2.2V ~ 3.6V | - | Internal | ||||
 |
PIC24FJ48GA002-I/SP | 3.7180 | |
5070 | 0.00000000 | Microchip Technology | PIC® 24F | Tube | Active | -40°C ~ 85°C (TA) | Through Hole | 28-DIP (0.300", 7.62mm) | PIC24FJ48GA002 | 28-SPDIP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 15 | 21 | PIC | 16-Bit | 32MHz | I²C, PMP, SPI, UART/USART | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 48KB (16K x 24) | FLASH | - | 8K x 8 | 2V ~ 3.6V | A/D 10x10b | Internal | ||
 |
R5F51118ADFK#30 | - | |
1922 | 0.00000000 | Renesas Electronics America Inc | RX111 | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | R5F51118 | 64-LQFP (14x14) | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 559-R5F51118ADFK#30 | OBSOLETE | 1 | 46 | RX | 32-Bit Single-Core | 32MHz | I²C, SCI, SPI, USB OTG | DMA, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 8K x 8 | 64K x 8 | 1.8V ~ 3.6V | A/D 14x12b; D/A 2x8b | Internal | ||
 |
ATTINY426-SUR | 0.9790 | |
1 | 0.00000000 | Microchip Technology | tinyAVR® 2 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | ATTINY426 | 20-SOIC | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 150-ATTINY426-SURTR | EAR99 | 8542.31.0001 | 1,500 | 18 | AVR | 8-Bit | 20MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 4KB (4K x 8) | FLASH | 128 x 8 | 512 x 8 | 1.8V ~ 5.5V | A/D 15x12b | Internal | |
|
LPC1225FBD64/301,1 | 3.6200 | |
231 | 0.00000000 | NXP Semiconductors | LPC122x | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | 64-LQFP (10x10) | - | 2156-LPC1225FBD64/301,1 | 83 | 55 | ARM® Cortex®-M0 | 32-Bit | 45MHz | I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART | Brown-out Detect/Reset, DMA, POR, WDT | 80KB (80K x 8) | FLASH | - | 8K x 8 | 3V ~ 3.6V | A/D 8x10b SAR | Internal | |||||||
 |
R5F52206BDFP#30 | 7.7231 | |
6625 | 0.00000000 | Renesas Electronics America Inc | RX200 | Tray | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | R5F52206 | 100-LFQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 84 | RX | 32-Bit Single-Core | 32MHz | I²C, IrDA, SCI, SPI | DMA, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 8K x 8 | 16K x 8 | 1.62V ~ 5.5V | A/D 16x12b | Internal | ||
|
FX32K148HAT0MLQR | 16.8900 | |
8955 | 0.00000000 | NXP USA Inc. | * | Tape & Reel (TR) | Active | - | ROHS3 Compliant | 568-FX32K148HAT0MLQRTR | 500 | |||||||||||||||||||||||
 |
PIC16CE625-20I/P | - | |
5441 | 0.00000000 | Microchip Technology | PIC® 16C | Tube | Active | -40°C ~ 85°C (TA) | Through Hole | 18-DIP (0.300", 7.62mm) | PIC16CE625 | 18-PDIP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | PIC16CE625-20I/P-NDR | EAR99 | 8542.31.0001 | 25 | 13 | PIC | 8-Bit | 20MHz | - | Brown-out Detect/Reset, POR, WDT | 3.5KB (2K x 14) | OTP | 128 x 8 | 128 x 8 | 3V ~ 5.5V | - | External | |
 |
S9S08AW16AE0CLD | 4.4800 | |
480 | 0.00000000 | Freescale Semiconductor | S08 | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-LQFP | S9S08 | 44-LQFP (10x10) | download | 3A991A2 | 8542.31.0001 | 1 | 34 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | |||||
 |
AVR32DB32-I/RXB | 2.1000 | |
105 | 0.00000000 | Microchip Technology | AVR® DB | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | AVR32DB32 | 32-VQFN (5x5) | download | ROHS3 Compliant | REACH Unaffected | 150-AVR32DB32-I/RXB | EAR99 | 8542.31.0001 | 490 | 25 | AVR | 8-Bit | 24MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 512 x 8 | 4K x 8 | 1.8V ~ 5.5V | A/D 13x12b; D/A 1x10b | Internal | ||
 |
MC68HC908GR16MFA | - | |
7828 | 0.00000000 | NXP USA Inc. | HC08 | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | MC68HC908 | 48-LQFP (7x7) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 250 | 37 | HC08 | 8-Bit | 8MHz | LINbus, SCI, SPI | LVD, POR, PWM | 16KB (16K x 8) | FLASH | - | 1K x 8 | 3V ~ 5.5V | A/D 8x10b | Internal | ||
 |
DSPIC33EP16GS506-E/PT | 4.5360 | |
7188 | 0.00000000 | Microchip Technology | Automotive, AEC-Q100, dsPIC™ 33EP, Functional Safety (FuSa) | Tray | Active | -40°C ~ 125°C | Surface Mount | 64-TQFP | DSPIC33EP16GS506 | 64-TQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 53 | dsPIC | 16-Bit | 60 MIPs | I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 2K x 8 | 3V ~ 3.6V | A/D 22x12b; D/A 2x12b | Internal | ||
|
MAX32570-QNS+ | - | |
4566 | 0.00000000 | Analog Devices Inc./Maxim Integrated | DeepCover® | Tray | Active | -40°C ~ 105°C | Surface Mount | 169-TFBGA | 169-CTBGA (9x9) | - | 8542.31.0001 | 260 | ARM® Cortex®-M4F | 32-Bit | 150MHz | LCD, WDT | 1MB (512K x 16) | FLASH | - | - | Internal | |||||||||||
 |
PIC16LF1789-I/PT | 3.3000 | |
380 | 0.00000000 | Microchip Technology | PIC® XLP™ 16F | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-TQFP | PIC16LF1789 | 44-TQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | Q13798162 | 3A991A2 | 8542.31.0001 | 160 | 35 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PSMC, PWM, WDT | 28KB (16K x 14) | FLASH | 256 x 8 | 2K x 8 | 1.8V ~ 3.6V | A/D 14x12b; D/A 1x8b, 3x5b | Internal | |
|
CYT3DLABGBQ1AESGS | 29.1025 | |
1311 | 0.00000000 | Infineon Technologies | Traveo™ T2G | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 216-QFP | 216-TQFP | - | ROHS3 Compliant | 400 | 108 | ARM® Cortex®-M0+, ARM® Cortex®-M7F | 32-Bit Dual-Core | 240MHz | CANbus, Ethernet, LINbus, SPI | DMA, I²S, LVD, Temp Sensor, WDT | 4.063MB (4.063M x 8) | FLASH | 128K x 8 | 384K x 8 | 2.7V ~ 5.5V | - | - | |||||||
 |
TMS320F28377SPTPQ | 25.5100 | |
3635 | 0.00000000 | Texas Instruments | Automotive, AEC-Q100, C2000™ C28x Delfino™, Functional Safety (FuSa) | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP Exposed Pad | TMS320 | 176-HLQFP (24x24) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 40 | 97 | C28x | 32-Bit Single-Core | 200MHz | CANbus, EBI/EMI, I²C, McBSP, SCI, SPI, uPP, UART/USART, USB | DMA, POR, PWM, WDT | 1MB (512K x 16) | FLASH | - | 82K x 16 | 1.14V ~ 3.47V | A/D 20x12b, 20x16b; D/A 3x12b | Internal |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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