Tel: +86-0755-83501315
Email: sales@sic-components.com
Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TE0720-03-1CF | - | 7635 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | REACH Unaffected | 1686-1015 | EAR99 | 8471.50.0150 | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||||
CC-9C-V226-ZA-B | - | 5833 | 0.00000000 | Digi | ConnectCore® | Bulk | Obsolete | -40°C ~ 85°C | 3.590" L x 2.060" W (91.20mm x 52.20mm) | - | 1 (Unlimited) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 1 | ARM926EJ-S, NS9360 | 155MHz | 32MB | 64MB | MPU Core | - | SO-DIMM-144 | ||||||
101-1067 | - | 3572 | 0.00000000 | Digi | RabbitCore® | Box | Obsolete | -40°C ~ 70°C | 1.850" L x 2.730" W (47.00mm x 69.00mm) | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 3A001A3 | 8537.10.9160 | 1 | Rabbit 3000 | 44.2MHz | 1MB | 512KB (Internal), 8MB (External) | MPU Core | - | 2 IDC Headers 2x17, 1 IDC Header 2x5 | |||||
DG8065101274708 | 18.6100 | 6 | 0.00000000 | Intel | * | Bulk | Active | - | Not applicable | 3 (168 Hours) | Vendor Undefined | 0000.00.0000 | 1 | |||||||||||||||
DC-ME-Y402-MF | - | 3360 | 0.00000000 | Digi | Digi Connect ME® | Bulk | Obsolete | -40°C ~ 80°C | 1.450" L x 0.750" W (36.70mm x 19.10mm) | - | 1 (Unlimited) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 1 | ARM926EJ-S, NS9210 | 75MHz | 8MB | 4MB | MPU Core | - | RJ45 | ||||||
DC-VA-H264-10B-60-4K-MD00C-SX660 | 1.0000 | 6265 | 0.00000000 | System-On-Chip (SOC) Technologies Inc. | H.264-HD Encoder | Box | Active | - | - | DC-VA-H264 | download | 1962-DC-VA-H264-10B-60-4K-MD00C-SX660 | 1 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | 512MB | 128KB | FPGA Core | - | - | ||||||||
MYC-C3352-V4-256N256D-80-I | 52.0000 | 7908 | 0.00000000 | MYIR Tech Limited | MYC-AM335X | Book | Active | -40°C ~ 85°C | 2.756" L x 1.969" W (70.00mm x 50.00mm) | download | 3309-MYC-C3352-V4-256N256D-80-I | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A8 | 1GHz | 512MB | MPU Core | - | Pin(s) | ||||||||
MYC-Y6ULY2-V2-256N256D-50-C | 29.0000 | 5 | 0.00000000 | MYIR Tech Limited | - | Box | Active | 0°C ~ 70°C | 1.540" L x 1.460" W (39.00mm x 37.00mm) | download | ROHS3 Compliant | 3309-MYC-Y6ULY2-V2-256N256D-50-C | 1 | MCIMX6Y2DVM05A | 528MHz | 256MB | 256MB | MPU Core | - | Header | ||||||||
MYC-J1028N-8E2D-150-I | 219.0000 | 10 | 0.00000000 | MYIR Tech Limited | - | Book | Active | -40°C ~ 85°C | 3.230" L x 1.770" W (82.00mm x 45.00mm) | - | Vendor Undefined | 3309-MYC-J1028N-8E2D-150-I | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A72 | 1.5GHz | 2GB | 8GB | MPU Core | - | Card Edge | ||||||
DC-VA-H264-10B-60-4K-OPVIC-0000 | 2.0000 | 5772 | 0.00000000 | System-On-Chip (SOC) Technologies Inc. | * | Box | Active | DC-VA-H264 | download | 1962-DC-VA-H264-10B-60-4K-OPVIC-0000 | 1 | |||||||||||||||||
TE0728-03-1Q | 517.6500 | 6264 | 0.00000000 | Trenz Electronic GmbH | TE0728 | Bulk | Active | - | 2.360" L x 2.360" W (60.00mm x 60.00mm) | TE0728 | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | - | 512MB | 16MB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec SEM | |||||
100-1217-1 | - | 4514 | 0.00000000 | BECOM Systems GmbH | Blackfin® | Tape & Reel (TR) | Discontinued at SIC | 0°C ~ 70°C | 1.730" L x 1.300" W (44.00mm x 33.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 3A991A2 | 8471.50.0150 | 50 | ADSP-BF609 (Dual Core) | 500MHz x 2 | 256KB | 8MB | MPU Core | - | Expansion 2 x 100 | ||||||
TE0715-05-71C33-A | 550.2000 | 4658 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0715-05-71C33-A | 3A991A2 | 8471.50.0150 | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec LSHM | |||||
OSD32MP153A-512M-BAA | - | 7719 | 0.00000000 | Octavo Systems LLC | - | Tray | Active | 0°C ~ 85°C | 0.710" L x 0.710" W (18.00mm x 18.00mm) | download | 1676-OSD32MP153A-512M-BAA | 65 | Arm® Dual Cortex®-A7, Arm® Cortex®-M4 | 650MHz | 512MB | - | MPU Core | NEON™ SIMD | 302-BGA | |||||||||
TE0715-05-73E33-A | 757.0000 | 2344 | 0.00000000 | Trenz Electronic GmbH | TE0711 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0715-05-73E33-A | 1 | Zynq™ XC7Z030-3SBG485E | - | 1GB | 32MB | MPU Core | ARM Cortex-A9 | Board-to-Board (BTB) Socket | |||||||
MOD5282-100 | - | 8836 | 0.00000000 | NetBurner Inc. | - | Obsolete | 0°C ~ 70°C | 2.600" L x 2.000" W (66.04mm x 50.80mm) | download | RoHS non-compliant | Not Applicable | REACH Unaffected | 3A001A3 | 8471.80.1000 | 1 | ColdFire 5282 | 66MHz | 8.064MB | 512KB | MCU, Ethernet Core | - | RJ-45, 2x50 Header | ||||||
101-0675 | - | 9437 | 0.00000000 | Digi | RabbitCore® | Obsolete | 0°C ~ 70°C | 1.200" L x 2.950" W (30.00mm x 75.00mm) | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 316-1035 | 5A002A1 DIG | 8537.10.9160 | 1 | Rabbit 3000 | 22.1MHz | 128KB | 256KB | MPU Core | - | IDC Header 2x20 | |||||
101-0517 | - | 5816 | 0.00000000 | Digi | RabbitCore® | Obsolete | -40°C ~ 85°C | 1.850" L x 1.650" W (47.00mm x 42.00mm) | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 5A002A1 DIG | 8537.10.9160 | 1 | Rabbit 3000 | 29.4MHz | 512KB | 512KB | MPU Core | - | 2 IDC Headers 2x17 | ||||||
IW-G35M-11EG-4E004G-E008G-BIA | 3.0000 | 5 | 0.00000000 | iWave Systems | Zynq® UltraScale+™ | Bulk | Active | -40°C ~ 85°C | 4.330" L x 2.950" W (110.00mm x 75.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 2503-IW-G35M-11EG-4E004G-E008G-BIA | 8473.30.1180 | 1 | ARM® Cortex®-A53 (x4), ARM® Cortex™-M7(x1) | 1.5GHz, 600MHz | 4GB from PS, 4GB from PL | 8GB eMMC | MPU, FPGA | ARM® Mali 400 MP2 | 2 x 240 Pin, 2 x 240 Pin | ||||||
IW-G30M-C4EV-4E002G-E008G-BIA | 1.0000 | 10 | 0.00000000 | iWave Systems | Zynq® UltraScale+™ | Bulk | Active | -40°C ~ 85°C | 4.330" L x 2.950" W (110.00mm x 75.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 2503-IW-G30M-C4EV-4E002G-E008G-BIA | 8473.30.1180 | 1 | ARM® Cortex®-A53(x40, ARM® Cortex®-R5(x2) | 1.5GHz, 600MHz | 4GB, 1GB | 8GB eMMC | MPU, FPGA | ARM® Mali 400 MP2 | 2 x 240 Pin | ||||||
IW-G30M-C7EV-4E004G-E008G-BEA | 1.0000 | 10 | 0.00000000 | iWave Systems | - | Bulk | Active | -20°C ~ 85°C | 3.740" x 2.950" (94.99mm x 74.93mm) | download | ROHS3 Compliant | 1 (Unlimited) | 2503-IW-G30M-C7EV-4E004G-E008G-BEA | 8473.30.1180 | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5, ARM Mali 400 MP2, ZU7EV | 1.5GHz | |||||||||||
TE0841-01-035-2I | - | 9435 | 0.00000000 | Trenz Electronic GmbH | TE0841 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Kintex UltraScale KU35 | 4GB | 32MB | FPGA Core | - | Samtec LSHM | |||||||
TE0720-03-61C530A | - | 2386 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-61C530A | 1 | ARM Cortex-A9 | 125MHz | 256MB | - | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||||||
MYC-CZU5EV-V2-4E4D-1200-I | 745.0000 | 7459 | 0.00000000 | MYIR Tech Limited | MYC-CZU3EG | Book | Active | -40°C ~ 85°C | 2.362" L x 2.047" W (60.00mm x 52.00mm) | download | 3309-MYC-CZU5EV-V2-4E4D-1200-I | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | 4GB | MCU, Ethernet Core | Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E / XCZU4EV-1SFVC784I/ XCZU5EV-2SFVC784I | Pin(s) | |||||||||
MYC-YF135-4E512D-100-I | 25.0000 | 10 | 0.00000000 | MYIR Tech Limited | MYC-YF13X | Book | Active | -40°C ~ 85°C | 1.540" L x 1.460" W (39.00mm x 37.00mm) | download | 3309-MYC-YF135-4E512D-100-I | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A7 | 1GHz | 512MB | 256MB (NAND), 400B EEPROM | - | 320-BGA | ||||||||
MYC-C3358-V4-512N512D-100-C | 59.0000 | 1952 | 0.00000000 | MYIR Tech Limited | MYC-AM335X | Book | Active | 0°C ~ 70°C | 2.756" L x 1.969" W (70.00mm x 50.00mm) | download | 3309-MYC-C3358-V4-512N512D-100-C | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A8 | 1GHz | 512MB | MPU Core | - | Pin(s) | ||||||||
MYC-C7Z015-4E1D-766-I | 225.0000 | 5873 | 0.00000000 | MYIR Tech Limited | Zynq®-7000 | Box | Active | -40°C ~ 85°C | 2.950" L x 2.170" W (75.00mm x 55.00mm) | download | ROHS3 Compliant | 3309-MYC-C7Z015-4E1D-766-I | EAR99 | 8473.30.1180 | 1 | ARM® Cortex®-A9 | 766MHz | 1GB | 4GB | MPU, FPGA Core | Zynq-7000 (Z-7015) | Board-to-Board (BTB) Socket | ||||||
MYC-C4377-V2-4E512D-100-I | 100.0000 | 7742 | 0.00000000 | MYIR Tech Limited | MYC-C437X | Book | Active | -40°C ~ 85°C | 2.362" L x 1.772" W (60.00mm x 45.00mm) | download | 3309-MYC-C4377-V2-4E512D-100-I | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A9 | 1GHz | 512MB | MCU, Ethernet Core | - | Pin(s) | ||||||||
MYC-C7Z010-V2-4E1D-667-I | 145.0000 | 5 | 0.00000000 | MYIR Tech Limited | MYC-C7Z010 | Book | Active | -40°C ~ 85°C | 2.953" L x 2.165" W (75.00mm x 55.00mm) | download | 3309-MYC-C7Z010-V2-4E1D-667-I | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A9 | 1GB | FPGA | Pin(s) | ||||||||||
MYC-J3352-V2-256N256D-80-I | 52.0000 | 2196 | 0.00000000 | MYIR Tech Limited | MCC-AM335X-J | Book | Active | -40°C ~ 85°C | 2.661" L x 1.772" W (67.60mm x 45.00mm) | download | 3309-MYC-J3352-V2-256N256D-80-I | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A8 | 1GHz | 256MB | MCU, Ethernet Core | - | Pin(s) |
Daily average RFQ Volume
Standard Product Unit
Worldwide Manufacturers
In-stock Warehouse