- RFQ
- BOM
-
Contact Us
Tel: +86-0755-83501315
Email: sales@sic-components.com
- Chinese
- English
- French
- German
- Portuguese
- Spanish
- Russian
- Japanese
- Korean
- Arabic
- Irish
- Greek
- Turkish
- Italian
- Danish
- Romanian
- Indonesian
- Czech
- Afrikaans
- Swedish
- Polish
- Basque
- Catalan
- Esperanto
- Hindi
- Lao
- Albanian
- Amharic
- Armenian
- Azerbaijani
- Belarusian
- Bengali
- Bosnian
- Bulgarian
- Cebuano
- Chichewa
- Corsican
- Croatian
- Dutch
- Estonian
- Filipino
- Finnish
- Frisian
- Galician
- Georgian
- Gujarati
- Haitian
- Hausa
- Hawaiian
- Hebrew
- Hmong
- Hungarian
- Icelandic
- Igbo
- Javanese
- Kannada
- Kazakh
- Khmer
- Kurdish
- Kyrgyz
- Latin
- Latvian
- Lithuanian
- Luxembou..
- Macedonian
- Malagasy
- Malay
- Malayalam
- Maltese
- Maori
- Marathi
- Mongolian
- Burmese
- Nepali
- Norwegian
- Pashto
- Persian
- Punjabi
- Serbian
- Sesotho
- Sinhala
- Slovak
- Slovenian
- Somali
- Samoan
- Scots Gaelic
- Shona
- Sindhi
- Sundanese
- Swahili
- Tajik
- Tamil
- Telugu
- Thai
- Ukrainian
- Urdu
- Uzbek
- Vietnamese
- Welsh
- Xhosa
- Yiddish
- Yoruba
- Zulu
- Kinyarwanda
- Tatar
- Oriya
- Turkmen
- Uyghur
Microcontrollers, Microprocessor, FPGA Modules(1588)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
MYC-J1028N-8E2D-150-I | 219.0000 |  |
10 | 0.00000000 | MYIR Tech Limited | - | Book | Active | -40°C ~ 85°C | 3.230" L x 1.770" W (82.00mm x 45.00mm) | - | Vendor Undefined | 3309-MYC-J1028N-8E2D-150-I | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A72 | 1.5GHz | 2GB | 8GB | MPU Core | - | Card Edge | ||||
 |
DC-VA-H264-10B-60-4K-OPVIC-0000 | 2.0000 | |
5772 | 0.00000000 | System-On-Chip (SOC) Technologies Inc. | * | Box | Active | DC-VA-H264 | download | 1962-DC-VA-H264-10B-60-4K-OPVIC-0000 | 1 | |||||||||||||||
 |
TE0728-03-1Q | 517.6500 | |
6264 | 0.00000000 | Trenz Electronic GmbH | TE0728 | Bulk | Active | - | 2.360" L x 2.360" W (60.00mm x 60.00mm) | TE0728 | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | - | 512MB | 16MB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec SEM | |||
 |
100-1217-1 | - | |
4514 | 0.00000000 | BECOM Systems GmbH | Blackfin® | Tape & Reel (TR) | Discontinued at SIC | 0°C ~ 70°C | 1.730" L x 1.300" W (44.00mm x 33.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 3A991A2 | 8471.50.0150 | 50 | ADSP-BF609 (Dual Core) | 500MHz x 2 | 256KB | 8MB | MPU Core | - | Expansion 2 x 100 | ||||
 |
OSD32MP153A-512M-BAA | - | |
7719 | 0.00000000 | Octavo Systems LLC | - | Tray | Active | 0°C ~ 85°C | 0.710" L x 0.710" W (18.00mm x 18.00mm) | download | 1676-OSD32MP153A-512M-BAA | 65 | Arm® Dual Cortex®-A7, Arm® Cortex®-M4 | 650MHz | 512MB | - | MPU Core | NEON™ SIMD | 302-BGA | |||||||
|
TE0715-05-73E33-A | 757.0000 | |
2344 | 0.00000000 | Trenz Electronic GmbH | TE0711 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0715-05-73E33-A | 1 | Zynq™ XC7Z030-3SBG485E | - | 1GB | 32MB | MPU Core | ARM Cortex-A9 | Board-to-Board (BTB) Socket | |||||
|
101-0675 | - | |
9437 | 0.00000000 | Digi | RabbitCore® | Obsolete | 0°C ~ 70°C | 1.200" L x 2.950" W (30.00mm x 75.00mm) | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 316-1035 | 5A002A1 DIG | 8537.10.9160 | 1 | Rabbit 3000 | 22.1MHz | 128KB | 256KB | MPU Core | - | IDC Header 2x20 | |||
|
101-0517 | - | |
5816 | 0.00000000 | Digi | RabbitCore® | Obsolete | -40°C ~ 85°C | 1.850" L x 1.650" W (47.00mm x 42.00mm) | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 5A002A1 DIG | 8537.10.9160 | 1 | Rabbit 3000 | 29.4MHz | 512KB | 512KB | MPU Core | - | 2 IDC Headers 2x17 | ||||
 |
IW-G35M-11EG-4E004G-E008G-BIA | 3.0000 | |
5 | 0.00000000 | iWave Systems | Zynq® UltraScale+™ | Bulk | Active | -40°C ~ 85°C | 4.330" L x 2.950" W (110.00mm x 75.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 2503-IW-G35M-11EG-4E004G-E008G-BIA | 8473.30.1180 | 1 | ARM® Cortex®-A53 (x4), ARM® Cortex™-M7(x1) | 1.5GHz, 600MHz | 4GB from PS, 4GB from PL | 8GB eMMC | MPU, FPGA | ARM® Mali 400 MP2 | 2 x 240 Pin, 2 x 240 Pin | ||||
 |
IW-G30M-C4EV-4E002G-E008G-BIA | 1.0000 | |
10 | 0.00000000 | iWave Systems | Zynq® UltraScale+™ | Bulk | Active | -40°C ~ 85°C | 4.330" L x 2.950" W (110.00mm x 75.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 2503-IW-G30M-C4EV-4E002G-E008G-BIA | 8473.30.1180 | 1 | ARM® Cortex®-A53(x40, ARM® Cortex®-R5(x2) | 1.5GHz, 600MHz | 4GB, 1GB | 8GB eMMC | MPU, FPGA | ARM® Mali 400 MP2 | 2 x 240 Pin | ||||
 |
TE0841-01-035-2I | - | |
9435 | 0.00000000 | Trenz Electronic GmbH | TE0841 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Kintex UltraScale KU35 | 4GB | 32MB | FPGA Core | - | Samtec LSHM | |||||
 |
MYC-CZU5EV-V2-4E4D-1200-I | 745.0000 | |
7459 | 0.00000000 | MYIR Tech Limited | MYC-CZU3EG | Book | Active | -40°C ~ 85°C | 2.362" L x 2.047" W (60.00mm x 52.00mm) | download | 3309-MYC-CZU5EV-V2-4E4D-1200-I | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | 4GB | MCU, Ethernet Core | Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E / XCZU4EV-1SFVC784I/ XCZU5EV-2SFVC784I | Pin(s) | |||||||
 |
MYC-C3358-V4-512N512D-100-C | 59.0000 | |
1952 | 0.00000000 | MYIR Tech Limited | MYC-AM335X | Book | Active | 0°C ~ 70°C | 2.756" L x 1.969" W (70.00mm x 50.00mm) | download | 3309-MYC-C3358-V4-512N512D-100-C | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A8 | 1GHz | 512MB | MPU Core | - | Pin(s) | ||||||
 |
MYC-C7Z015-4E1D-766-I | 225.0000 | |
5873 | 0.00000000 | MYIR Tech Limited | Zynq®-7000 | Box | Active | -40°C ~ 85°C | 2.950" L x 2.170" W (75.00mm x 55.00mm) | download | ROHS3 Compliant | 3309-MYC-C7Z015-4E1D-766-I | EAR99 | 8473.30.1180 | 1 | ARM® Cortex®-A9 | 766MHz | 1GB | 4GB | MPU, FPGA Core | Zynq-7000 (Z-7015) | Board-to-Board (BTB) Socket | ||||
 |
MYC-C4377-V2-4E512D-100-I | 100.0000 | |
7742 | 0.00000000 | MYIR Tech Limited | MYC-C437X | Book | Active | -40°C ~ 85°C | 2.362" L x 1.772" W (60.00mm x 45.00mm) | download | 3309-MYC-C4377-V2-4E512D-100-I | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A9 | 1GHz | 512MB | MCU, Ethernet Core | - | Pin(s) | ||||||
 |
MYC-C7Z010-V2-4E1D-667-I | 145.0000 | |
5 | 0.00000000 | MYIR Tech Limited | MYC-C7Z010 | Book | Active | -40°C ~ 85°C | 2.953" L x 2.165" W (75.00mm x 55.00mm) | download | 3309-MYC-C7Z010-V2-4E1D-667-I | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A9 | 1GB | FPGA | Pin(s) | ||||||||
|
MYC-J3352-V2-256N256D-80-I | 52.0000 | |
2196 | 0.00000000 | MYIR Tech Limited | MCC-AM335X-J | Book | Active | -40°C ~ 85°C | 2.661" L x 1.772" W (67.60mm x 45.00mm) | download | 3309-MYC-J3352-V2-256N256D-80-I | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A8 | 1GHz | 256MB | MCU, Ethernet Core | - | Pin(s) | ||||||
|
MYC-YA151C-256N256D-65-I-T | 27.0000 | |
5 | 0.00000000 | MYIR Tech Limited | - | Box | Active | -40°C ~ 85°C | 1.540" L x 1.460" W (39.00mm x 37.00mm) | download | ROHS3 Compliant | Not Applicable | Vendor Undefined | 3309-MYC-YA151C-256N256D-65-I-T | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A7, ARM® Cortex®-M4 | 650MHz | 256MB | 256MB | MPU Core | - | Pin Header | ||
|
MYC-C3352-V4-512N512D-80-I | 69.0000 | |
8158 | 0.00000000 | MYIR Tech Limited | MYC-AM335X | Book | Active | -40°C ~ 85°C | 2.756" L x 1.969" W (70.00mm x 50.00mm) | download | 3309-MYC-C3352-V4-512N512D-80-I | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A8 | 1GHz | 512MB | MPU Core | - | Pin(s) | ||||||
 |
MYC-JX8MPQ-8E3D-160-C | 132.0000 | |
5208 | 0.00000000 | MYIR Tech Limited | - | Book | Active | 0°C ~ 70°C | 3.230" L x 1.770" W (82.00mm x 45.00mm) | - | Vendor Undefined | 3309-MYC-JX8MPQ-8E3D-160-C | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A53, ARM® Cortex®-M7 | 800MHz, 1.6GHz | 3GB | 8GB | MPU Core | - | Card Edge | ||||
|
ME-XU1-15EG-1E-D12E-G1-R4.2 | - | |
5704 | 0.00000000 | Enclustra FPGA Solutions | - | Bulk | Active | 0°C ~ 85°C | 2.910" L x 2.130" W (74.00mm x 54.00mm) | download | 2879-ME-XU1-15EG-1E-D12E-G1-R4.2 | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | 600MHz, 1.5GHz | 4GB | 16GB | MPU, FPGA Core | - | 168 Pin | |||||||
|
AM3352-SOM-IND | 52.6500 | |
1484 | 0.00000000 | Olimex LTD | - | Bulk | Active | -40°C ~ 85°C | 2.400" L x 1.500" W (61.00mm x 38.00mm) | - | ROHS3 Compliant | 1188-AM3352-SOM-IND | 1 | ARM® Cortex®-A8, AM3352 | 1GHz | 512MB | - | MPU Core | - | 40 Pin | ||||||
|
TE0817-01-7AI21-A | 2.0000 | |
6747 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | -40°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0817-01-7AI21-A | 1 | Zynq UltraScale+ XCZU7CG-1FBVB900I | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
|
TE0817-01-4BE21-A | 953.0000 | |
5796 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0817-01-4BE21-A | 1 | Zynq™ UltraScale+™ XCZU4EG-1FBVB900E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
|
TE0720-03-1QC12 | - | |
6211 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-1QC12 | OBSOLETE | 1 | ARM Cortex-A9 | 125MHz | 1GB | 4GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | ||||
|
SOMOMAP3503-12-1783GFIR | 566.0160 | |
1433 | 0.00000000 | Beacon EmbeddedWorks | OMAP35x | Bulk | Active | -40°C ~ 85°C | 1.230" L x 3.010" W (31.20mm x 76.50mm) | SOMOMAP3503 | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 0000.00.0000 | 50 | ARM® Cortex®-A8, OMAP3503 | 600MHz | 256MB | 512MB (NAND), 16MB (NOR) | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||
 |
IW-G35M-19EG-4E004G-E008G-BIA | 4.0000 | |
10 | 0.00000000 | iWave Systems | Zynq® UltraScale+™ | Bulk | Active | -40°C ~ 85°C | 4.330" L x 2.950" W (110.00mm x 75.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 2503-IW-G35M-19EG-4E004G-E008G-BIA | 3A001A3 | 8473.30.9900 | 1 | ARM® Cortex®-A53(x4), ARM® Cortex™-M7(x1) | 1.5GHz, 600MHz | 4GB from PS, 4GB from PL | 8GB eMMC | MPU, FPGA | ARM® Mali 400 MP2 | 2 x 240 Pin, 2 x 240 Pin | |||
 |
IW-G24M-CU2F-4E002G-S008G-LEI | 1.0000 | |
5 | 0.00000000 | iWave Systems | Arria® 10 | Bulk | Active | -40°C ~ 85°C | 3.740" L x 2.950" W (95.00mm x 75.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 2503-IW-G24M-CU2F-4E002G-S008G-LEI | 8473.30.1180 | 1 | ARM® Cortex®-A9, Arria 10 SX | 1.5GHz | 4GB | 8GB | MPU, FPGA Core | - | 2 x 240 Pin | ||||
 |
TE0745-02-30-1I | - | |
6742 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | 1 (Unlimited) | REACH Unaffected | 1686-1046 | 3A991D | 8537.10.9160 | 1 | ARM® Cortex®-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec UFPS | ||||
 |
TE0320-00-EV02B | 222.0000 | |
1729 | 0.00000000 | Trenz Electronic GmbH | TE0320 | Bulk | Not For New Designs | 0°C ~ 70°C | 2.700" L x 1.900" W (68.00mm x 48.00mm) | TE0320 | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Spartan-3A DSP | 100MHz | 128MB | 4MB | FPGA, USB Core | Cypress EZ-USB FX2LP | B2B |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
Wishlist (0 Items)