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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Color Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Connector Type Pitch Number of Rows Row Spacing Contact Finish Contact Finish Thickness Current Rating (Amps) Housing Material Material Flammability Rating Contact Type Pitch - Mating Number of Positions Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance
18-6503-20 Aries Electronics 18-6503-20 8.4819
RFQ
ECAD 8958 0.00000000 Aries Electronics 503 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 18-650 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Phosphor Bronze 0.360" (9.14mm) -
179-PGM15011-10H Aries Electronics 179-PGM15011-10H 65.3873
RFQ
ECAD 5913 0.00000000 Aries Electronics PGM Bulk Active -55°C ~ 105°C Through Hole PGA - 179-PGM Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Brass 0.165" (4.19mm) -
14-8625-10 Aries Electronics 14-8625-10 5.2005
RFQ
ECAD 7129 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 14-8625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 2 0.800" (20.32mm) Tin 200.0µin (5.08µm) Forked 14
28-6518-101 Aries Electronics 28-6518-101 5.4692
RFQ
ECAD 2304 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 28-6518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
12-6810-90TWR Aries Electronics 12-6810-90TWR 10.2718
RFQ
ECAD 9753 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Vertical DIP, 0.6" (15.24mm) Row Spacing Closed Frame 12-6810 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 12 (2 x 6) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
28-3575-18 Aries Electronics 28-3575-18 128.2422
RFQ
ECAD 5085 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 28-3575 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 9 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
24-3554-18 Aries Electronics 24-3554-18 89.4940
RFQ
ECAD 1773 0.00000000 Aries Electronics 55 Bulk Active -55°C ~ 250°C Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 24-3554 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polyetheretherketone (PEEK), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 24 (2 x 12) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
24-6556-31 Aries Electronics 24-6556-31 17.8509
RFQ
ECAD 4014 0.00000000 Aries Electronics 6556 Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 24-655 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.423" (10.74mm) -
20-7XXXX-10 Aries Electronics 20-7XXXX-10 -
RFQ
ECAD 1996 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 20-7XXX Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 20 (1 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
07-0503-31 Aries Electronics 07-0503-31 5.3348
RFQ
ECAD 8715 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 07-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 7 (1 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
336-PRS20019-12 Aries Electronics 336-PRS20019-12 146.5633
RFQ
ECAD 5534 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 336-PRS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
08-2503-21 Aries Electronics 08-2503-21 7.6376
RFQ
ECAD 9397 0.00000000 Aries Electronics 503 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Closed Frame 08-2503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Phosphor Bronze 0.360" (9.14mm) -
16-0625-70 Aries Electronics 16-0625-70 5.9682
RFQ
ECAD 4799 0.00000000 Aries Electronics 0625 Bulk Active Through Hole - 16-0625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Header Strip 0.100" (2.54mm) 1 - Tin 200.0µin (5.08µm) Post 16
18-6810-90TWR Aries Electronics 18-6810-90TWR 12.8587
RFQ
ECAD 7899 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Vertical DIP, 0.6" (15.24mm) Row Spacing Closed Frame 18-6810 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected Q3405510 EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 18 (2 x 9) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
22-4518-11H Aries Electronics 22-4518-11H 7.9831
RFQ
ECAD 5675 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame 22-4518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
44-6570-16 Aries Electronics 44-6570-16 58.6350
RFQ
ECAD 6665 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 44-6570 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 44 (2 x 22) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
121-PLS13121-12 Aries Electronics 121-PLS13121-12 91.5840
RFQ
ECAD 7593 0.00000000 Aries Electronics PLS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 121-PLS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
07-0503-21 Aries Electronics 07-0503-21 5.3348
RFQ
ECAD 9809 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 07-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 7 (1 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
28-3573-10 Aries Electronics 28-3573-10 14.2691
RFQ
ECAD 1597 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 28-3573 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
22-3625-31 Aries Electronics 22-3625-31 12.5176
RFQ
ECAD 3070 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 22-3625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 2 0.300" (7.62mm) Gold 10.0µin (0.25µm) Solder Cup 22
84-PLS10003-12 Aries Electronics 84-PLS10003-12 76.9217
RFQ
ECAD 6481 0.00000000 Aries Electronics PLS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 84-PLS1 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
28-1508-30 Aries Electronics 28-1508-30 10.4716
RFQ
ECAD 3954 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Closed Frame 28-1508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
64-9625-31 Aries Electronics 64-9625-31 28.7647
RFQ
ECAD 9434 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 64-9625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 2 0.900" (22.86mm) Gold 10.0µin (0.25µm) Solder Cup 64
38-1508-31 Aries Electronics 38-1508-31 24.4282
RFQ
ECAD 4102 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Closed Frame 38-1508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 38 (2 x 19) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
03-0517-90C Aries Electronics 03-0517-90C 0.9721
RFQ
ECAD 3397 0.00000000 Aries Electronics 0517 Bulk Active - Through Hole, Right Angle SIP - 03-0517 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 - Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 3 (1 x 3) Beryllium Copper - Brass 0.125" (3.18mm) -
26-0501-31 Aries Electronics 26-0501-31 16.3770
RFQ
ECAD 1102 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 125°C Through Hole SIP - 26-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 26 (1 x 26) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.690" (17.52mm) -
16-8750-310C Aries Electronics 16-8750-310C 10.0717
RFQ
ECAD 7579 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 16-8750 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
40-C212-10 Aries Electronics 40-C212-10 10.3400
RFQ
ECAD 66 0.00000000 Aries Electronics EJECT-A-DIP™ Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 40-C212 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
34-3625-70 Aries Electronics 34-3625-70 10.3262
RFQ
ECAD 2191 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 34-3625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 2 0.300" (7.62mm) Tin 200.0µin (5.08µm) Post 34
16-0625-21 Aries Electronics 16-0625-21 6.0256
RFQ
ECAD 4793 0.00000000 Aries Electronics 0625 Bulk Active Through Hole - 16-0625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Header Strip 0.100" (2.54mm) 1 - Gold 10.0µin (0.25µm) Post 16
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse