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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Applications Mounting Type Type Features Base Product Number Color Termination Ingress Protection Style DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Connector Type Pitch Number of Rows Row Spacing Contact Finish Contact Finish Thickness Current Rating (Amps) Contact Material Housing Material Material Flammability Rating Contact Type Pitch - Mating Number of Positions Row Spacing - Mating Number of Positions Loaded Fastening Type Contact Length - Post Insulation Height Contact Shape Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Insulation Material Insulation Color Voltage Rating Mated Stacking Heights Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
48-6501-21 Aries Electronics 48-6501-21 19.2418
RFQ
ECAD 9642 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 48-6501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 48 (2 x 24) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.410" (10.41mm) -
08-301296-10 Aries Electronics 08-301296-10 14.3910
RFQ
ECAD 6753 0.00000000 Aries Electronics Correct-A-Chip® 301296 Bulk Active - Through Hole - 08-3012 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC JEDEC 8 - - Brass 0.125" (3.18mm) FR4 Epoxy Glass
LCQT-QFP0.8-32 Aries Electronics LCQT-QFP0.8-32 10.6353
RFQ
ECAD 6452 0.00000000 Aries Electronics Correct-A-Chip® Tube Active -55°C ~ 125°C Through Hole - LCQT-QF Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected A866AR EAR99 8536.69.4040 15 Polyester UL94 V-0 0.031" (0.80mm) - - Gold Flash Multiple Packages QFP 32 - 0.100" (2.54mm) Brass 0.236" (6.00mm) FR4 Epoxy Glass
18-666000-00 Aries Electronics 18-666000-00 14.0250
RFQ
ECAD 3991 0.00000000 Aries Electronics Correct-A-Chip® 666000 Bulk Active - Surface Mount - 18-6660 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC SOWIC 18 - 0.050" (1.27mm) Brass 0.080" (2.03mm) FR4 Epoxy Glass
16-C280-21 Aries Electronics 16-C280-21 14.4432
RFQ
ECAD 7360 0.00000000 Aries Electronics EJECT-A-DIP™ Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 16-C280 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.040" (1.02mm) -
24-6518-10H Aries Electronics 24-6518-10H 4.6460
RFQ
ECAD 6427 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 24-6518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 20 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
10-7410-10 Aries Electronics 10-7410-10 9.1628
RFQ
ECAD 3287 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 10-7410 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 10 (1 x 10) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
08-71000-10 Aries Electronics 08-71000-10 6.4479
RFQ
ECAD 9069 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 08-7100 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 30 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 8 (1 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
1111163 Aries Electronics 1111163 -
RFQ
ECAD 5673 0.00000000 Aries Electronics Correct-A-Chip® 1111163 Bulk Active - - - 1111163 - download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 - Gold 10.0µin (0.25µm) - - Socket, 0.6" (15.24mm) Row Spacing PLCC 40 Brass - - - FR4 Epoxy Glass
16-820-90T Aries Electronics 16-820-90T 7.7719
RFQ
ECAD 7666 0.00000000 Aries Electronics Vertisockets™ 800 - Active 105°C Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame 16-820 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
34-71050-10 Aries Electronics 34-71050-10 14.0250
RFQ
ECAD 9489 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 34-7105 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 34 (1 x 34) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
06-1508-30 Aries Electronics 06-1508-30 2.3432
RFQ
ECAD 9509 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Closed Frame 06-1508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
44-536-11 Aries Electronics 44-536-11 -
RFQ
ECAD 4445 0.00000000 Aries Electronics 536 - Obsolete - Through Hole PLCC, ZIF (ZIP) Open Frame - - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) Gold 12.0µin (0.30µm) - - 44 (4 x 11) - - - - -
08-2511-11 Aries Electronics 08-2511-11 4.8742
RFQ
ECAD 6591 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Closed Frame 08-2511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 8 (2 x 4) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
10-F40-10 Aries Electronics 10-F40-10 8.4628
RFQ
ECAD 1114 0.00000000 Aries Electronics F40 Bulk Active -55°C ~ 105°C - Through Hole - 10-F40 Solder - - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Receptacle, Breakaway 2 8A Brass Alloy UL94 V-0 Female Socket 0.200" (5.08mm) 10 0.200" (5.08mm) All - 0.129" (3.28mm) 0.040" (1.02mm) Circular Tin 200.0µin (5.08µm) Tin Polyamide (PA46), Nylon 4/6, Glass Filled Black - - 200.0µin (5.08µm)
20-3625-21 Aries Electronics 20-3625-21 6.8680
RFQ
ECAD 8696 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 20-3625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 2 0.300" (7.62mm) Gold 10.0µin (0.25µm) Post 20
18-0518-10H Aries Electronics 18-0518-10H 1.7852
RFQ
ECAD 4069 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 18-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 18 (1 x 18) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
68-505-110-RC-P Aries Electronics 68-505-110-RC-P -
RFQ
ECAD 1062 0.00000000 Aries Electronics Correct-A-Chip® 505 Bulk Discontinued at SIC - Through Hole - 68-505 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 72 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC PGA 68 - 0.050" (1.27mm) Brass 0.150" (3.81mm) FR4 Epoxy Glass
20-600-21 Aries Electronics 20-600-21 3.1108
RFQ
ECAD 9074 0.00000000 Aries Electronics 600 Bulk Active Through Hole - 20-600 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 19 DIP, DIL - Header 0.100" (2.54mm) 2 0.300" (7.62mm) Gold 10.0µin (0.25µm) Post 20
68-652000-11-RC Aries Electronics 68-652000-11-RC 62.0700
RFQ
ECAD 9670 0.00000000 Aries Electronics Correct-A-Chip® 652000 Bulk Active - Through Hole - 68-6520 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - - 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 68 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
18-820-90C Aries Electronics 18-820-90C 9.6173
RFQ
ECAD 9899 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active -55°C ~ 105°C Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame 18-820 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
48-6552-16 Aries Electronics 48-6552-16 81.4717
RFQ
ECAD 6811 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 48-6552 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 6 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
1106396-36 Aries Electronics 1106396-36 14.6000
RFQ
ECAD 2866 0.00000000 Aries Electronics Correct-A-Chip® 1106396 Bulk Active - Through Hole - 1106396 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) DIP, 0.3" (7.62mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 36 Beryllium Copper 0.100" (2.54mm) Brass 0.130" (3.30mm) -
18-1508-30 Aries Electronics 18-1508-30 7.1963
RFQ
ECAD 6406 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Closed Frame 18-1508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
12-6625-70 Aries Electronics 12-6625-70 3.4340
RFQ
ECAD 4600 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 12-6625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 2 0.600" (15.24mm) Tin 200.0µin (5.08µm) Post 12
28-354000-20 Aries Electronics 28-354000-20 30.1064
RFQ
ECAD 4831 0.00000000 Aries Electronics Correct-A-Chip® 354000 Tube Active - Surface Mount - 28-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected 28-354000-20-NDR EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 - Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 28 Beryllium Copper 0.100" (2.54mm) Brass - -
56-PLS14031-12 Aries Electronics 56-PLS14031-12 78.5350
RFQ
ECAD 3108 0.00000000 Aries Electronics PLS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 56-PLS1 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
40-3574-10 Aries Electronics 40-3574-10 17.8346
RFQ
ECAD 2631 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 40-3574 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
C9314-02 Aries Electronics C9314-02 -
RFQ
ECAD 9073 0.00000000 Aries Electronics Lo-PRO®file, C93 Bulk Obsolete -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame Solder download RoHS non-compliant Not Applicable REACH Unaffected Q3250569 EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 14 (2 x 7) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.140" (3.56mm) 20mOhm
18-6625-51 Aries Electronics 18-6625-51 17.0042
RFQ
ECAD 3622 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 18-6625 Black Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 2 0.600" (15.24mm) Gold 10.0µin (0.25µm) Forked 18
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse