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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Accessory Type Color For Use With/Related Products Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Connector Type Pitch Number of Rows Row Spacing Contact Finish Contact Finish Thickness Current Rating (Amps) Housing Material Material Flammability Rating Contact Type Pitch - Mating Number of Positions Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance
03-0518-00 Aries Electronics 03-0518-00 0.3500
RFQ
ECAD 2428 0.00000000 Aries Electronics 518 Bulk Active - Surface Mount SIP Open Frame 03-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 3 (1 x 3) Beryllium Copper 0.100" (2.54mm) Brass 0.046" (1.17mm) -
25-0503-20 Aries Electronics 25-0503-20 11.3261
RFQ
ECAD 5649 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 25-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 25 (1 x 25) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
24-6554-16 Aries Electronics 24-6554-16 48.6900
RFQ
ECAD 138 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 24-655 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
06-0600-20 Aries Electronics 06-0600-20 0.7999
RFQ
ECAD 5125 0.00000000 Aries Electronics 0600 Bulk Active Through Hole - 06-0600 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 SIP, SIL - Header 0.100" (2.54mm) 1 - Tin 200.0µin (5.08µm) Post 6
09-0517-90C Aries Electronics 09-0517-90C 3.1108
RFQ
ECAD 7303 0.00000000 Aries Electronics 0517 Bulk Active - Through Hole, Right Angle SIP - 09-0517 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 - Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 9 (1 x 9) Beryllium Copper - Brass 0.125" (3.18mm) -
3883-312-10-32 Aries Electronics 3883-312-10-32 13.2412
RFQ
ECAD 3161 0.00000000 Aries Electronics - - Active - - - - 3883-31 - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - - - - - - - - - - - -
24-6508-312 Aries Electronics 24-6508-312 20.6325
RFQ
ECAD 9606 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 24-650 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
02-7450-10 Aries Electronics 02-7450-10 4.3632
RFQ
ECAD 6829 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 02-7450 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 2 (1 x 2) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
36-1508-31 Aries Electronics 36-1508-31 23.1522
RFQ
ECAD 7191 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Closed Frame 36-1508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
68-PGM10006-10 Aries Electronics 68-PGM10006-10 13.1806
RFQ
ECAD 8632 0.00000000 Aries Electronics PGM Bulk Active - Through Hole PGA - 68-PGM1 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected Q12049240 EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
20-8370-310C Aries Electronics 20-8370-310C 12.7829
RFQ
ECAD 6283 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 20-8370 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
31-0508-20 Aries Electronics 31-0508-20 11.5625
RFQ
ECAD 1650 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole SIP - 31-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 31 (1 x 31) Beryllium Copper - Brass 0.360" (9.14mm) -
48-6571-16 Aries Electronics 48-6571-16 55.5400
RFQ
ECAD 7782 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 48-6571 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 6 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 48 (2 x 24) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
26-1518-10T Aries Electronics 26-1518-10T 2.6462
RFQ
ECAD 2698 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.2" (5.08mm) Row Spacing Open Frame 26-1518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 26 (2 x 13) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
30-6503-21 Aries Electronics 30-6503-21 20.9760
RFQ
ECAD 5972 0.00000000 Aries Electronics 503 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 30-6503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 30 (2 x 15) Beryllium Copper 0.100" (2.54mm) Phosphor Bronze 0.360" (9.14mm) -
20-650-10 Aries Electronics 20-650-10 4.6700
RFQ
ECAD 78 0.00000000 Aries Electronics 650 Bulk Active - 20-650 Cap (Cover) 0600 Series Header download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8538.90.8180 1 20
28-3551-11 Aries Electronics 28-3551-11 17.6589
RFQ
ECAD 7972 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 28-3551 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 9 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold - Gold - 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
32-3552-11 Aries Electronics 32-3552-11 20.4525
RFQ
ECAD 6827 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 32-3552 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold - Gold - 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
42-3552-16 Aries Electronics 42-3552-16 75.3414
RFQ
ECAD 2953 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 42-3552 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
44-6552-11 Aries Electronics 44-6552-11 27.2591
RFQ
ECAD 4487 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 44-6552 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold - Gold - 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
24-6554-18 Aries Electronics 24-6554-18 89.4940
RFQ
ECAD 5027 0.00000000 Aries Electronics 55 Bulk Active -55°C ~ 250°C Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 24-655 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polyetheretherketone (PEEK), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 24 (2 x 12) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
28-3553-18 Aries Electronics 28-3553-18 107.2267
RFQ
ECAD 4282 0.00000000 Aries Electronics 55 Bulk Active -55°C ~ 250°C Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 28-3553 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 9 1 A Polyetheretherketone (PEEK), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 28 (2 x 14) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
44-6556-40 Aries Electronics 44-6556-40 60.8675
RFQ
ECAD 9796 0.00000000 Aries Electronics 6556 Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 44-6556 Solder Cup download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) Brass 0.180" (4.57mm) -
44-3573-11 Aries Electronics 44-3573-11 32.6262
RFQ
ECAD 7544 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 44-3573 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
28-3574-18 Aries Electronics 28-3574-18 117.6818
RFQ
ECAD 2933 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 28-3574 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
32-3571-11 Aries Electronics 32-3571-11 24.4613
RFQ
ECAD 4277 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 32-3571 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
32-3575-11 Aries Electronics 32-3575-11 24.4613
RFQ
ECAD 4501 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 32-3575 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
48-6571-18 Aries Electronics 48-6571-18 119.1250
RFQ
ECAD 9761 0.00000000 Aries Electronics 57 Bulk Active -55°C ~ 250°C Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 48-6571 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 6 1 A Polyetheretherketone (PEEK), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 48 (2 x 24) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
48-3572-11 Aries Electronics 48-3572-11 34.1150
RFQ
ECAD 6143 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 48-3572 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 6 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
162-PRS20020-12 Aries Electronics 162-PRS20020-12 119.2625
RFQ
ECAD 4246 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 162-PRS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse