SIC
close
Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Accessory Type Color For Use With/Related Products Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Connector Type Pitch Number of Rows Row Spacing Contact Finish Contact Finish Thickness Current Rating (Amps) Housing Material Material Flammability Rating Contact Type Pitch - Mating Number of Positions Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Body Material Body Finish Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
28-3518-111 Aries Electronics 28-3518-111 7.0044
RFQ
ECAD 1881 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 28-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
0500-1.600 Aries Electronics 0500-1.600 -
RFQ
ECAD 8335 0.00000000 Aries Electronics - - Active - - - - 0500-1 - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - - - - - - - - - - - -
14-3508-212 Aries Electronics 14-3508-212 14.2168
RFQ
ECAD 9241 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 14-3508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
10-3513-11H Aries Electronics 10-3513-11H 3.0098
RFQ
ECAD 2313 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 10-3513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
08-655-10 Aries Electronics 08-655-10 0.5303
RFQ
ECAD 4140 0.00000000 Aries Electronics 655 Bulk Active - 08-655 Cap (Cover) 680 Series download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8538.90.8180 1 8
23-0513-10H Aries Electronics 23-0513-10H 4.1410
RFQ
ECAD 4204 0.00000000 Aries Electronics 0513 Bulk Active - Through Hole SIP - 23-0513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 23 (1 x 23) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
36-3552-10 Aries Electronics 36-3552-10 14.9834
RFQ
ECAD 9960 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 36-3552 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
16-3508-312 Aries Electronics 16-3508-312 15.7846
RFQ
ECAD 8580 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 16-3508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
48-3571-10 Aries Electronics 48-3571-10 20.9433
RFQ
ECAD 2137 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 48-3571 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 6 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
06-3518-10T Aries Electronics 06-3518-10T 0.6908
RFQ
ECAD 7661 0.00000000 Aries Electronics 518 - Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 06-3518 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected Q1134087A EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
08-0503-21 Aries Electronics 08-0503-21 6.0640
RFQ
ECAD 5964 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 08-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 8 (1 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
08-6625-11 Aries Electronics 08-6625-11 3.9996
RFQ
ECAD 2055 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 08-6625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 2 0.600" (15.24mm) Gold 10.0µin (0.25µm) Forked 8
34-0518-10 Aries Electronics 34-0518-10 3.1310
RFQ
ECAD 2798 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 34-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 34 (1 x 34) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
96-128M80 Aries Electronics 96-128M80 -
RFQ
ECAD 3623 0.00000000 Aries Electronics Correct-A-Chip® Obsolete 105°C Through Hole - Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 - - 0.031" (0.80mm) Tin - Tin-Lead 200.0µin (5.08µm) QFP PGA 128 Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) FR4 Epoxy Glass
20-537-20 Aries Electronics 20-537-20 16.0152
RFQ
ECAD 2197 0.00000000 Aries Electronics 537 Bulk Active -65°C ~ 260°C - 20-537 Insert Plate Black PLCC Sockets download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8538.90.8180 1 UL94 V-0 Polyphenylene Sulfide (PPS), Glass Filled - 20
18-0501-31 Aries Electronics 18-0501-31 13.3700
RFQ
ECAD 9569 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 125°C Through Hole SIP - 18-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 18 (1 x 18) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.690" (17.52mm) -
44-3551-18 Aries Electronics 44-3551-18 153.9971
RFQ
ECAD 8998 0.00000000 Aries Electronics 55 Bulk Active -55°C ~ 250°C Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 44-3551 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyetheretherketone (PEEK), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 44 (2 x 22) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
12-3513-11H Aries Electronics 12-3513-11H 4.0400
RFQ
ECAD 3750 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 12-3513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 12 (2 x 6) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
36-6571-11 Aries Electronics 36-6571-11 27.5047
RFQ
ECAD 8343 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 36-6571 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
32-3625-51 Aries Electronics 32-3625-51 30.5807
RFQ
ECAD 7632 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 32-3625 Black Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 2 0.300" (7.62mm) Gold 10.0µin (0.25µm) Forked 32
32-8625-10 Aries Electronics 32-8625-10 10.5988
RFQ
ECAD 1796 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 32-8625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 2 0.800" (20.32mm) Tin 200.0µin (5.08µm) Forked 32
28-650000-10-P Aries Electronics 28-650000-10-P -
RFQ
ECAD 4324 0.00000000 Aries Electronics Correct-A-Chip® 650000 Bulk Discontinued at SIC - Through Hole - 28-650 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 84 - - 0.050" (1.27mm) - - Tin-Lead - SOIC DIP, 0.6" (15.24mm) Row Spacing 28 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
128-PLS13078-12 Aries Electronics 128-PLS13078-12 84.7000
RFQ
ECAD 8010 0.00000000 Aries Electronics PLS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 128-PLS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
01-0508-30 Aries Electronics 01-0508-30 0.4949
RFQ
ECAD 6060 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole SIP - 01-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 - Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 1 (1 x 1) Beryllium Copper - Brass 0.500" (12.70mm) -
40-3513-10H Aries Electronics 40-3513-10H 9.1628
RFQ
ECAD 9878 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 40-3513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
32-8724-610C Aries Electronics 32-8724-610C 17.0654
RFQ
ECAD 1559 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated 32-8724 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
40-81150-610C Aries Electronics 40-81150-610C 22.1379
RFQ
ECAD 2285 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated 40-8115 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
11-0508-31 Aries Electronics 11-0508-31 8.4437
RFQ
ECAD 8342 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole SIP - 11-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 11 (1 x 11) Beryllium Copper - Brass 0.500" (12.70mm) -
22-4511-10 Aries Electronics 22-4511-10 -
RFQ
ECAD 5674 0.00000000 Aries Electronics 511 Bulk Obsolete -55°C ~ 105°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Closed Frame Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 22 (2 x 11) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
11-0600-11 Aries Electronics 11-0600-11 1.7847
RFQ
ECAD 2104 0.00000000 Aries Electronics 0600 Bulk Active Through Hole - 11-0600 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 1 - Gold 10.0µin (0.25µm) Forked 11
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse