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Connectors, Interconnects(5418)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Type | Features | Base Product Number | Termination | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Current Rating (Amps) | Housing Material | Material Flammability Rating | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Convert From (Adapter End) | Convert To (Adapter End) | Number of Pins | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Material - Post | Termination Post Length | Contact Resistance | Board Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
7131-108-18 | - |  |
1718 | 0.00000000 | Aries Electronics | - | Bulk | Active | - | Through Hole | - | 7131-10 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | - | - | - | - | - | Tin-Lead | 200.0µin (5.08µm) | HB2E Relay | DIP, 0.3" (7.62mm) Row Spacing | 8 | - | - | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | ||||||
|
14-35W000-11-RC | - | |
2907 | 0.00000000 | Aries Electronics | Correct-A-Chip® 35W000 | Bulk | Active | - | Through Hole | - | 14-35W0 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 27 | - | - | 0.050" (1.27mm) | - | - | Gold | 10.0µin (0.25µm) | SOIC-W | DIP, 0.3" (7.62mm) Row Spacing | 14 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | ||||||
|
18-35W000-11-RC | 22.3833 | |
1533 | 0.00000000 | Aries Electronics | Correct-A-Chip® 35W000 | Bulk | Active | - | Through Hole | - | 18-35W0 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 21 | - | - | 0.050" (1.27mm) | - | - | Gold | 10.0µin (0.25µm) | SOIC-W | DIP, 0.3" (7.62mm) Row Spacing | 18 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | ||||||
|
16-354000-11-RC | 18.2038 | |
4813 | 0.00000000 | Aries Electronics | Correct-A-Chip® 354000 | Bulk | Active | - | Surface Mount | - | 16-3540 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | DIP, 0.3" (7.62mm) Row Spacing | SOIC | 16 | Beryllium Copper | 0.050" (1.27mm) | Brass | 0.030" (0.76mm) | - | |||||
|
20-354000-11-RC | 25.6063 | |
7210 | 0.00000000 | Aries Electronics | Correct-A-Chip® 354000 | Bulk | Active | - | Surface Mount | - | 20-3540 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | DIP, 0.3" (7.62mm) Row Spacing | SOIC | 20 | Beryllium Copper | 0.050" (1.27mm) | Brass | 0.030" (0.76mm) | - | |||||
|
20-354000-21-RC | 25.6063 | |
5084 | 0.00000000 | Aries Electronics | Correct-A-Chip® 354000 | Bulk | Active | - | Surface Mount | - | 20-3540 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | DIP, 0.3" (7.62mm) Row Spacing | SOIC | 20 | Beryllium Copper | 0.050" (1.27mm) | Brass | 0.089" (2.28mm) | - | |||||
|
24-354000-21-RC | 28.6007 | |
2305 | 0.00000000 | Aries Electronics | Correct-A-Chip® 354000 | Bulk | Active | - | Surface Mount | - | 24-3540 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | DIP, 0.3" (7.62mm) Row Spacing | SOIC | 24 | Beryllium Copper | 0.050" (1.27mm) | Brass | 0.089" (2.28mm) | - | |||||
|
28-350002-11-RC-P | - | |
5357 | 0.00000000 | Aries Electronics | Correct-A-Chip® 350000 | Bulk | Discontinued at SIC | - | Through Hole | - | 28-3500 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 154 | - | - | 0.050" (1.27mm) | - | - | Gold | 10.0µin (0.25µm) | SOIC | DIP, 0.3" (7.62mm) Row Spacing | 28 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | ||||||
|
1109681-628 | - | |
7017 | 0.00000000 | Aries Electronics | - | Bulk | Active | - | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Spacer | 1109681 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 200.0µin (5.08µm) | 28 (2 x 14) | Brass | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||
|
1109681-648 | - | |
8009 | 0.00000000 | Aries Electronics | - | Bulk | Active | - | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Spacer | 1109681 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 200.0µin (5.08µm) | 48 (2 x 24) | Brass | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||
 |
LCQT-QFP0.5-52 | 9.9080 | |
2982 | 0.00000000 | Aries Electronics | Correct-A-Chip® | Tube | Active | -55°C ~ 125°C | Through Hole | - | LCQT-QF | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | A870AR | EAR99 | 8536.69.4040 | 17 | Polyester | UL94 V-0 | 0.020" (0.50mm) | - | - | Gold | Flash | Multiple Packages | QFP | 52 | - | 0.100" (2.54mm) | Brass | 0.236" (6.00mm) | FR4 Epoxy Glass | |||||
 |
LCQT-QFP0.65-80 | 9.9080 | |
8040 | 0.00000000 | Aries Electronics | Correct-A-Chip® | Tube | Active | -55°C ~ 125°C | Through Hole | - | LCQT-QF | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | A877AR | EAR99 | 8536.69.4040 | 17 | Polyester | UL94 V-0 | 0.026" (0.65mm) | - | - | Gold | Flash | Multiple Packages | QFP | 80 | - | 0.100" (2.54mm) | Brass | 0.236" (6.00mm) | FR4 Epoxy Glass | |||||
|
28-3554-10 | 12.4533 | |
4217 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | -65°C ~ 105°C | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 28-3554 | Solder | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | Q6708658 | EAR99 | 8536.69.4040 | 9 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |||||
|
40-6501-30 | 9.9263 | |
6263 | 0.00000000 | Aries Electronics | 501 | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 40-650 | Wire Wrap | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | Q6774564 | EAR99 | 8536.69.4040 | 1 | 1.5 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.690" (17.52mm) | - | |||||
|
24-650000-11-RC-P | - | |
3615 | 0.00000000 | Aries Electronics | Correct-A-Chip® 650000 | Bulk | Discontinued at SIC | - | Through Hole | - | 24-650 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 98 | - | - | 0.050" (1.27mm) | Gold | - | Gold | 10.0µin (0.25µm) | SOIC | DIP, 0.6" (15.24mm) Row Spacing | 24 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | ||||||
|
28-650000-11-RC-P | - | |
8101 | 0.00000000 | Aries Electronics | Correct-A-Chip® 650000 | Bulk | Discontinued at SIC | - | Through Hole | - | 28-650 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 84 | - | - | 0.050" (1.27mm) | Gold | - | Gold | 10.0µin (0.25µm) | SOIC | DIP, 0.6" (15.24mm) Row Spacing | 28 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | ||||||
|
24-6551-16 | 44.6840 | |
6043 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 24-655 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 10 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||
|
24-3553-16 | 44.6840 | |
5927 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 24-3553 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 10 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||
|
24-6551-11 | 16.2813 | |
1476 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 24-655 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 10 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | - | Gold | - | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||
|
1109253 | - | |
3124 | 0.00000000 | Aries Electronics | - | - | Active | - | - | - | - | - | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 10 | - | - | - | - | - | - | - | - | - | - | - | - | - | ||||||||
|
44-3554-16 | 78.9129 | |
8778 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 44-3554 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||
|
24-3554-10 | 10.9080 | |
1877 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 24-3554 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 10 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||
|
28-3551-10 | 12.4533 | |
8789 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 28-3551 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 9 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||
|
28-3552-10 | 12.4533 | |
9260 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 28-3552 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 9 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||
|
28-6552-11 | 17.6589 | |
5568 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 28-6552 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 9 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | - | Gold | - | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||
|
28-3554-16 | 52.7978 | |
2386 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | -55°C ~ 250°C | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 28-3554 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 9 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||
|
28-3554-11 | 17.6589 | |
2720 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | -55°C ~ 250°C | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 28-3554 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 9 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | - | Gold | - | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||
|
32-3552-16 | 58.3775 | |
7334 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 32-3552 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 8 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||
|
32-3553-16 | 58.3775 | |
9716 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 32-3553 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 8 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||
|
32-3552-10 | 13.1180 | |
2018 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 32-3552 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 8 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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