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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Applications Mounting Type Type Features Base Product Number Color Termination Ingress Protection Style DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status ECCN HTSUS Standard Package Connector Type Pitch Number of Rows Row Spacing Contact Finish Contact Finish Thickness Current Rating (Amps) Contact Material Housing Material Material Flammability Rating Contact Type Pitch - Mating Number of Positions Row Spacing - Mating Number of Positions Loaded Fastening Type Contact Length - Post Insulation Height Contact Shape Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Insulation Material Insulation Color Voltage Rating Mated Stacking Heights Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
28-651000-10 Aries Electronics 28-651000-10 32.8712
RFQ
ECAD 7418 0.00000000 Aries Electronics Correct-A-Chip® 651000 Bulk Active - Through Hole - 28-6510 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 17 1 A - - 0.026" (0.65mm) - - Tin-Lead 200.0µin (5.08µm) SSOP DIP, 0.6" (15.24mm) Row Spacing 28 - 0.100" (2.54mm) Brass 0.145" (3.68mm) FR4 Epoxy Glass
26-6625-11 Aries Electronics 26-6625-11 12.8016
RFQ
ECAD 1796 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 26-6625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 2 0.600" (15.24mm) Gold 10.0µin (0.25µm) Forked 26
18-3625-31 Aries Electronics 18-3625-31 9.4224
RFQ
ECAD 2510 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 18-3625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 2 0.300" (7.62mm) Gold 10.0µin (0.25µm) Solder Cup 18
48-6625-20 Aries Electronics 48-6625-20 13.0860
RFQ
ECAD 1214 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 48-6625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 2 0.600" (15.24mm) Tin 200.0µin (5.08µm) Post 48
14-8910-310C Aries Electronics 14-8910-310C 9.4798
RFQ
ECAD 6076 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 14-8910 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
36-6553-16 Aries Electronics 36-6553-16 65.7271
RFQ
ECAD 1311 0.00000000 Aries Electronics 55 Bulk Active -55°C ~ 250°C Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 36-6553 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyetheretherketone (PEEK), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
40-3552-16 Aries Electronics 40-3552-16 68.9886
RFQ
ECAD 7539 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 40-3552 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
121-PRS13106-12 Aries Electronics 121-PRS13106-12 83.4633
RFQ
ECAD 5193 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 121-PRS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
24-6553-16 Aries Electronics 24-6553-16 44.6840
RFQ
ECAD 3554 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 24-655 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
14-F40-10 Aries Electronics 14-F40-10 11.6535
RFQ
ECAD 5491 0.00000000 Aries Electronics F40 Bulk Active -55°C ~ 105°C - Through Hole - 14-F40 Solder - - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Receptacle, Breakaway 2 8A Brass Alloy UL94 V-0 Female Socket 0.200" (5.08mm) 14 0.200" (5.08mm) All - 0.129" (3.28mm) 0.040" (1.02mm) Circular Tin 200.0µin (5.08µm) Tin Polyamide (PA46), Nylon 4/6, Glass Filled Black - - 200.0µin (5.08µm)
44-3571-16 Aries Electronics 44-3571-16 58.6350
RFQ
ECAD 5250 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 44-3571 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 44 (2 x 22) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
23-0625-10 Aries Electronics 23-0625-10 10.1809
RFQ
ECAD 9323 0.00000000 Aries Electronics 0625 Bulk Active Through Hole - 23-0625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Header Strip 0.100" (2.54mm) 1 - Tin 200.0µin (5.08µm) Forked 23
14-665000-00 Aries Electronics 14-665000-00 17.2658
RFQ
ECAD 6108 0.00000000 Aries Electronics Correct-A-Chip® 665000 Bulk Active - Surface Mount - 14-6650 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC-W SOIC 14 - 0.050" (1.27mm) Brass 0.031" (0.80mm) FR4 Epoxy Glass
20-6513-10 Aries Electronics 20-6513-10 3.1916
RFQ
ECAD 7646 0.00000000 Aries Electronics 513 - Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 20-6513 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
40-6575-11 Aries Electronics 40-6575-11 29.1900
RFQ
ECAD 3092 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 40-6575 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
14-C195-10T Aries Electronics 14-C195-10T 3.0906
RFQ
ECAD 3648 0.00000000 Aries Electronics EJECT-A-DIP™ Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 14-C195 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
16-3625-70 Aries Electronics 16-3625-70 4.2016
RFQ
ECAD 6401 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 16-3625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 2 0.300" (7.62mm) Tin 200.0µin (5.08µm) Post 16
40-3625-21 Aries Electronics 40-3625-21 13.0668
RFQ
ECAD 5553 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 40-3625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 2 0.300" (7.62mm) Gold 10.0µin (0.25µm) Post 40
24-6552-10 Aries Electronics 24-6552-10 10.9080
RFQ
ECAD 3622 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 24-655 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
48-6822-90C Aries Electronics 48-6822-90C 21.0415
RFQ
ECAD 9384 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active -55°C ~ 105°C Through Hole, Right Angle, Horizontal DIP, 0.6" (15.24mm) Row Spacing Closed Frame 48-6822 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
24-3518-10 Aries Electronics 24-3518-10 2.2600
RFQ
ECAD 40 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 24-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
40-516-11S Aries Electronics 40-516-11S 16.7954
RFQ
ECAD 3425 0.00000000 Aries Electronics 516 Bulk Active - Through Hole DIP, ZIF (ZIP) Closed Frame 40-516 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 13 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.150" (3.81mm) -
11-0518-10H Aries Electronics 11-0518-10H 1.2474
RFQ
ECAD 9649 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 11-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 11 (1 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
20-3625-70 Aries Electronics 20-3625-70 5.7186
RFQ
ECAD 9193 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 20-3625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 2 0.300" (7.62mm) Tin 200.0µin (5.08µm) Post 20
18-600-21 Aries Electronics 18-600-21 2.9088
RFQ
ECAD 6106 0.00000000 Aries Electronics 600 Bulk Active Through Hole - 18-600 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 20 DIP, DIL - Header 0.100" (2.54mm) 2 0.300" (7.62mm) Gold 10.0µin (0.25µm) Post 18
20-0625-11 Aries Electronics 20-0625-11 10.5625
RFQ
ECAD 3094 0.00000000 Aries Electronics 0625 Bulk Active Through Hole - 20-0625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Header Strip 0.100" (2.54mm) 1 - Gold 10.0µin (0.25µm) Forked 20
76-PRS19033-12 Aries Electronics 76-PRS19033-12 95.8600
RFQ
ECAD 8787 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 76-PRS1 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
36-0518-10H Aries Electronics 36-0518-10H 3.9390
RFQ
ECAD 7918 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 36-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 36 (1 x 36) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
18-3518-10H Aries Electronics 18-3518-10H 3.3532
RFQ
ECAD 3311 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 18-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 22 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
34-6822-90C Aries Electronics 34-6822-90C -
RFQ
ECAD 9058 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active -55°C ~ 105°C Through Hole, Right Angle, Horizontal DIP, 0.6" (15.24mm) Row Spacing Closed Frame 34-6822 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 34 (2 x 17) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse