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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Color Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status ECCN HTSUS Standard Package Connector Type Pitch Number of Rows Row Spacing Contact Finish Contact Finish Thickness Current Rating (Amps) Housing Material Material Flammability Rating Contact Type Pitch - Mating Number of Positions Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
48-3554-16 Aries Electronics 48-3554-16 81.4717
RFQ
ECAD 9100 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 48-3554 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 6 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
06-2513-10 Aries Electronics 06-2513-10 0.9721
RFQ
ECAD 7139 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Closed Frame 06-2513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
48-6554-11 Aries Electronics 48-6554-11 32.6100
RFQ
ECAD 186 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 48-6554 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 6 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold - Gold - 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
50-9513-10 Aries Electronics 50-9513-10 7.7335
RFQ
ECAD 3716 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Closed Frame 50-9513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 50 (2 x 25) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
14-8825-310C Aries Electronics 14-8825-310C 9.4798
RFQ
ECAD 3510 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 14-8825 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
24-6551-10 Aries Electronics 24-6551-10 10.9080
RFQ
ECAD 1945 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 24-655 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
40-6625-70 Aries Electronics 40-6625-70 10.7079
RFQ
ECAD 4005 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 40-6625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 2 0.600" (15.24mm) Tin 200.0µin (5.08µm) Post 40
42-6574-18 Aries Electronics 42-6574-18 155.2867
RFQ
ECAD 7528 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 42-6574 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
18-810-90 Aries Electronics 18-810-90 14.9487
RFQ
ECAD 4304 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Vertical DIP, 0.3" (7.62mm) Row Spacing Closed Frame 18-810 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 18 (2 x 9) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
16-822-90WR Aries Electronics 16-822-90WR 9.6173
RFQ
ECAD 8935 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame 16-822 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 16 (2 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
18-8670-310C Aries Electronics 18-8670-310C 11.4353
RFQ
ECAD 3172 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 18-8670 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
10-600-10 Aries Electronics 10-600-10 1.4201
RFQ
ECAD 5519 0.00000000 Aries Electronics 600 Bulk Active Through Hole - 10-600 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 36 DIP, DIL - Header 0.100" (2.54mm) 2 0.300" (7.62mm) Tin 200.0µin (5.08µm) Forked 10
18-68660-10 Aries Electronics 18-68660-10 -
RFQ
ECAD 1122 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated 18-6866 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 18 (2 x 9) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.140" (3.56mm) -
32-6508-20 Aries Electronics 32-6508-20 15.3145
RFQ
ECAD 3346 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 32-6508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
20-820-90 Aries Electronics 20-820-90 10.4171
RFQ
ECAD 3283 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active -55°C ~ 105°C Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame 20-820 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 20 (2 x 10) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
28-653000-10 Aries Electronics 28-653000-10 42.7500
RFQ
ECAD 138 0.00000000 Aries Electronics Correct-A-Chip® 653000 Bulk Active - Through Hole Socket Included 28-6530 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 17 1 A - UL94 V-0 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 28 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
336-PLS21022-12 Aries Electronics 336-PLS21022-12 149.8067
RFQ
ECAD 7170 0.00000000 Aries Electronics PLS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 336-PLS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
20-7455-10 Aries Electronics 20-7455-10 11.5988
RFQ
ECAD 2426 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 20-7455 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 20 (1 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
06-1508-30 Aries Electronics 06-1508-30 2.3432
RFQ
ECAD 9509 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Closed Frame 06-1508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
14-8625-310C Aries Electronics 14-8625-310C 9.4798
RFQ
ECAD 7842 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 14-8625 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
14-4823-90C Aries Electronics 14-4823-90C 7.7719
RFQ
ECAD 9870 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active -55°C ~ 105°C Through Hole, Right Angle, Horizontal DIP, 0.4" (10.16mm) Row Spacing Closed Frame 14-4823 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
01-0503-20 Aries Electronics 01-0503-20 0.5303
RFQ
ECAD 8015 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 01-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB - Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 1 (1 x 1) Beryllium Copper - Brass 0.360" (9.14mm) -
26-822-90C Aries Electronics 26-822-90C 12.6692
RFQ
ECAD 4472 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active -55°C ~ 105°C Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame 26-822 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 26 (2 x 13) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
156-PRS16011-12 Aries Electronics 156-PRS16011-12 102.5220
RFQ
ECAD 9511 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 156-PRS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
2357-108-12 Aries Electronics 2357-108-12 -
RFQ
ECAD 6940 0.00000000 Aries Electronics - - Active - - - - 2357-10 - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - - - - - - - - - - - -
37-0518-11H Aries Electronics 37-0518-11H 8.9809
RFQ
ECAD 3627 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 37-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 37 (1 x 37) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
97-AQ132D-P Aries Electronics 97-AQ132D-P -
RFQ
ECAD 6013 0.00000000 Aries Electronics Correct-A-Chip® 97-AQ132D Bulk Discontinued at SIC 105°C Through Hole - 97-AQ13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.8000 42 - - 0.025" (0.64mm) Gold - Tin-Lead 200.0µin (5.08µm) PQFP PGA 132 - - Brass 0.125" (3.18mm) FR4 Epoxy Glass
14-0501-31 Aries Electronics 14-0501-31 11.1444
RFQ
ECAD 5487 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 125°C Through Hole SIP - 14-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 14 (1 x 14) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.690" (17.52mm) -
225-PRS17007-12 Aries Electronics 225-PRS17007-12 122.0450
RFQ
ECAD 4296 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 225-PRS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
24-1518-00 Aries Electronics 24-1518-00 5.0085
RFQ
ECAD 6300 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.2" (5.08mm) Row Spacing Open Frame 24-1518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse