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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Accessory Type Color For Use With/Related Products Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Body Material Body Finish Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
84-PRS13053-12 Aries Electronics 84-PRS13053-12 76.9217
RFQ
ECAD 7392 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 84-PRS1 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
614-41-306-31-018000 Mill-Max Manufacturing Corp. 614-41-306-31-018000 12.9078
RFQ
ECAD 2156 0.00000000 Mill-Max Manufacturing Corp. 614 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Carrier, Open Frame 614-41 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 67 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
16-0518-10H Aries Electronics 16-0518-10H 1.7271
RFQ
ECAD 9486 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 16-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 16 (1 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
115-87-308-41-003101 Preci-Dip 115-87-308-41-003101 0.3577
RFQ
ECAD 8913 0.00000000 Preci-Dip 115 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 115-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 52 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 0.095" (2.41mm) 10mOhm
ICA-422-STT Samtec Inc. ICA-422-STT 2.6595
RFQ
ECAD 1624 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 105°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-422-STT 20 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
614-13-176-15-061001 Mill-Max Manufacturing Corp. 614-13-176-15-061001 -
RFQ
ECAD 7988 0.00000000 Mill-Max Manufacturing Corp. 614 Bulk Active -55°C ~ 125°C Through Hole PGA Carrier, Open Frame 614-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 176 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.165" (4.19mm) 10mOhm
510-93-361-19-000001 Mill-Max Manufacturing Corp. 510-93-361-19-000001 49.9160
RFQ
ECAD 9393 0.00000000 Mill-Max Manufacturing Corp. 510 Bulk Active -55°C ~ 125°C Through Hole PGA Closed Frame 510-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 361 (19 x 19) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
52-537-20 Aries Electronics 52-537-20 16.0152
RFQ
ECAD 2137 0.00000000 Aries Electronics 537 Bulk Active -65°C ~ 260°C - 52-537 Insert Plate Black PLCC Sockets download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8538.90.8180 1 UL94 V-0 Polyphenylene Sulfide (PPS), Glass Filled - 52
510-93-059-11-001002 Mill-Max Manufacturing Corp. 510-93-059-11-001002 25.0338
RFQ
ECAD 4803 0.00000000 Mill-Max Manufacturing Corp. 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 59 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
124-83-312-41-002101 Preci-Dip 124-83-312-41-002101 1.7288
RFQ
ECAD 8906 0.00000000 Preci-Dip 124 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 124-83 Wire Wrap - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 35 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 12 (2 x 6) Beryllium Copper 0.100" (2.54mm) Brass 0.630" (16.00mm) 10mOhm
110-43-652-41-001000 Mill-Max Manufacturing Corp. 110-43-652-41-001000 16.4282
RFQ
ECAD 3897 0.00000000 Mill-Max Manufacturing Corp. 110 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 110-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 52 (2 x 26) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
15-0503-21 Aries Electronics 15-0503-21 10.6172
RFQ
ECAD 5218 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 15-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 15 (1 x 15) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
IC51-1004-405-1 Yamaichi Electronics IC51-1004-405-1 59.0000
RFQ
ECAD 10 0.00000000 Yamaichi Electronics IC51 Box Active -55°C ~ 170°C - Chip Carrier Black IC Sockets download ROHS3 Compliant 2 (1 Year) REACH Unaffected 2408-IC51-1004-405-1 EAR99 8542.39.0000 1 - Polyethersulfone (PES), Glass Filled - 100
114-87-640-41-134161 Preci-Dip 114-87-640-41-134161 2.1306
RFQ
ECAD 1905 0.00000000 Preci-Dip 114 Bulk Active -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Open Frame 114-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.047" (1.20mm) 10mOhm
515-93-085-10-031002 Mill-Max Manufacturing Corp. 515-93-085-10-031002 -
RFQ
ECAD 6669 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 85 (10 x 10) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
12-350000-10-HT Aries Electronics 12-350000-10-HT 17.6546
RFQ
ECAD 7501 0.00000000 Aries Electronics Correct-A-Chip® 350000 Bulk Active - Through Hole - 12-3500 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) Tin - Tin-Lead 200.0µin (5.08µm) SOIC DIP, 0.3" (7.62mm) Row Spacing 12 - 0.100" (2.54mm) Brass 0.125" (3.18mm) Polyimide (PI)
08-1508-21 Aries Electronics 08-1508-21 6.5246
RFQ
ECAD 9755 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Closed Frame 08-1508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
523-13-169-17-101001 Mill-Max Manufacturing Corp. 523-13-169-17-101001 -
RFQ
ECAD 6230 0.00000000 Mill-Max Manufacturing Corp. 523 Bulk Active - Through Hole PGA - 523-13 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 169 (17 x 17) - 0.100" (2.54mm) - 0.510" (12.95mm) -
116-91-648-41-006000 Mill-Max Manufacturing Corp. 116-91-648-41-006000 15.8091
RFQ
ECAD 1569 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Elevated, Open Frame 116-91 Solder download 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.236" (5.99mm) 10mOhm
14-354000-20 Aries Electronics 14-354000-20 22.5795
RFQ
ECAD 2446 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 14-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 14 Beryllium Copper 0.050" (1.27mm) Brass - -
116-83-650-41-006101 Preci-Dip 116-83-650-41-006101 4.9872
RFQ
ECAD 6347 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Elevated, Open Frame 116-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 50 (2 x 25) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
232-28 CNC Tech 232-28 -
RFQ
ECAD 5105 0.00000000 CNC Tech - Tube Obsolete -55°C ~ 105°C Surface Mount PLCC Closed Frame 232 Solder download ROHS3 Compliant 1 (Unlimited) EAR99 8536.69.4040 4,356 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.050" (1.27mm) Tin 100.0µin (2.54µm) Tin 100.0µin (2.54µm) 28 (4 x 7) Phosphor Bronze 0.050" (1.27mm) Phosphor Bronze - 30mOhm
AR 32-HZL/07-TT Assmann WSW Components AR 32-HZL/07-TT 1.4417
RFQ
ECAD 4495 0.00000000 Assmann WSW Components - Tube Active -40°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame AR32-HZ Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 3 A Thermoplastic, Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - 4mOhm
104-13-328-41-770000 Mill-Max Manufacturing Corp. 104-13-328-41-770000 15.3605
RFQ
ECAD 6386 0.00000000 Mill-Max Manufacturing Corp. 104 Tube Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 104-13 Press-Fit download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 3 A Thermoplastic - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.175" (4.45mm) -
116-87-304-41-013101 Preci-Dip 116-87-304-41-013101 0.7998
RFQ
ECAD 9392 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 108 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 4 (2 x 2) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
126-91-306-41-002000 Mill-Max Manufacturing Corp. 126-91-306-41-002000 12.8946
RFQ
ECAD 7386 0.00000000 Mill-Max Manufacturing Corp. 126 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 126-91 Wire Wrap download 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 67 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.543" (13.79mm) 10mOhm
115-83-324-41-003101 Preci-Dip 115-83-324-41-003101 1.6026
RFQ
ECAD 3865 0.00000000 Preci-Dip 115 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 115-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 17 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.095" (2.41mm) 10mOhm
515-93-225-15-000003 Mill-Max Manufacturing Corp. 515-93-225-15-000003 -
RFQ
ECAD 8751 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Closed Frame 515-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 225 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
33-0508-20 Aries Electronics 33-0508-20 12.8397
RFQ
ECAD 9635 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole SIP - 33-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 33 (1 x 33) Beryllium Copper - Brass 0.360" (9.14mm) -
110-41-950-61-001000 Mill-Max Manufacturing Corp. 110-41-950-61-001000 23.2491
RFQ
ECAD 8968 0.00000000 Mill-Max Manufacturing Corp. 110 Tube Active -55°C ~ 125°C Through Hole DIP, 0.9" (22.86mm) Row Spacing 110-41 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 50 (2 x 25) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse