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Sockets for ICs, Transistors(23296)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Type | Features | Base Product Number | Termination | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Current Rating (Amps) | Housing Material | Material Flammability Rating | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Material - Post | Termination Post Length | Contact Resistance |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
110-41-428-61-001000 | 20.6509 |  |
2743 | 0.00000000 | Mill-Max Manufacturing Corp. | 110 | Tube | Active | -55°C ~ 125°C | Through Hole | DIP, 0.4" (10.16mm) Row Spacing | 110-41 | Solder | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 14 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | 0.125" (3.18mm) | 10mOhm | |||
|
614-83-632-31-012101 | 3.1539 | |
6148 | 0.00000000 | Preci-Dip | 614 | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Carrier, Open Frame | 614-83 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 12 | 1 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | - | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.136" (3.45mm) | 10mOhm | ||
|
32-3553-18 | 118.0613 | |
2694 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | -55°C ~ 250°C | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 32-3553 | Solder | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 8 | 1 A | Polyetheretherketone (PEEK), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 32 (2 x 16) | Beryllium Nickel | 0.100" (2.54mm) | Beryllium Nickel | 0.110" (2.78mm) | - | ||
|
511-13-209-17-081003 | - | |
9327 | 0.00000000 | Mill-Max Manufacturing Corp. | 511 | Bulk | Active | -55°C ~ 125°C | Through Hole | PGA | Open Frame | 511-13 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 209 (17 x 17) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | 0.170" (4.32mm) | 10mOhm | ||
|
515-13-241-18-075003 | - | |
7641 | 0.00000000 | Mill-Max Manufacturing Corp. | 515 | Bulk | Active | -55°C ~ 125°C | Through Hole | PGA | Open Frame | 515-13 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 241 (18 x 18) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | 0.108" (2.74mm) | 10mOhm | ||
|
29-0508-20 | - | |
7803 | 0.00000000 | Aries Electronics | 505 | - | Active | - | - | - | - | 29-0508 | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | - | - | - | - | - | - | - | - | - | - | - | - | - | |||
|
ICA-648-ZWGT-3 | 17.5411 | |
9309 | 0.00000000 | Samtec Inc. | ICA | Tube | Active | -55°C ~ 125°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | Solder | download | ROHS3 Compliant | 612-ICA-648-ZWGT-3 | 9 | 1 A | Polyester, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 10.0µin (0.25µm) | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | Brass | 10mOhm | |||||||
 |
116-83-210-41-002101 | 1.1517 | |
6151 | 0.00000000 | Preci-Dip | 116 | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.2" (5.08mm) Row Spacing | Elevated, Open Frame | 116-83 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 42 | 1 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | - | 10 (2 x 5) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | 10mOhm | ||
|
510-87-281-19-081101 | 9.5773 | |
4410 | 0.00000000 | Preci-Dip | 510 | Bulk | Active | -55°C ~ 125°C | Through Hole | PGA | Open Frame | 510-87 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 11 | 1 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | Flash | Tin | - | 281 (19 x 19) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | 10mOhm | ||
|
515-93-181-15-041001 | - | |
1158 | 0.00000000 | Mill-Max Manufacturing Corp. | 515 | Bulk | Active | -55°C ~ 125°C | Through Hole | PGA | Open Frame | 515-93 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 200.0µin (5.08µm) | 181 (15 x 15) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | 0.108" (2.74mm) | 10mOhm | ||
|
5916657-2 | - | |
8367 | 0.00000000 | TE Connectivity AMP Connectors | - | Tray | Obsolete | - | Through Hole | PGA, ZIF (ZIP) | Open Frame | 5916657 | Solder | - | ROHS3 Compliant | 1 (Unlimited) | Vendor Undefined | EAR99 | 8536.69.4040 | 450 | Thermoplastic | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 30.0µin (0.76µm) | 321 (19 x 19) | Copper Alloy | 0.100" (2.54mm) | Copper Alloy | 0.080" (2.03mm) | - | |||
|
116-43-628-41-008000 | 15.5666 | |
2941 | 0.00000000 | Mill-Max Manufacturing Corp. | 116 | Tube | Active | -55°C ~ 125°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Elevated, Open Frame | 116-43 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 14 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | 0.472" (11.99mm) | 10mOhm | ||
 |
116-83-314-41-003101 | 1.2630 | |
9696 | 0.00000000 | Preci-Dip | 116 | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Elevated, Open Frame | 116-83 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 30 | 1 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | - | 14 (2 x 7) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | 10mOhm | ||
|
40-6501-31 | 17.0654 | |
1434 | 0.00000000 | Aries Electronics | 501 | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 40-650 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1.5 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 40 (2 x 20) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.690" (17.52mm) | - | ||
|
100-PGM13069-11 | 28.8300 | |
2237 | 0.00000000 | Aries Electronics | PGM | Bulk | Active | -55°C ~ 125°C | Through Hole | PGA | - | 100-PGM | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | - | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.165" (4.19mm) | - | ||
 |
06-0518-10 | 1.0000 | |
292 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Through Hole | SIP | Open Frame | 06-0518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 6 (1 x 6) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||
|
28-0518-10 | 2.6058 | |
6542 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Through Hole | SIP | Open Frame | 28-0518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 28 (1 x 28) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||
|
14-0518-11H | 3.2320 | |
9011 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Through Hole | SIP | Open Frame | 14-0518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 14 (1 x 14) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||
|
08-820-90WR | 5.8529 | |
4112 | 0.00000000 | Aries Electronics | Vertisockets™ 800 | Bulk | Active | - | Through Hole, Right Angle, Horizontal | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame | 08-820 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1.5 A | Polyamide (PA46), Nylon 4/6 | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 8 (2 x 4) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.145" (3.68mm) | - | ||
|
25-7350-10 | 13.2933 | |
6581 | 0.00000000 | Aries Electronics | 700 Elevator Strip-Line™ | Bulk | Active | -55°C ~ 105°C | Through Hole | SIP | Elevated | 25-7350 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1.5 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 25 (1 x 25) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.150" (3.81mm) | - | ||
 |
8060-1G6 | - | |
8458 | 0.00000000 | TE Connectivity AMP Connectors | 8060 | Bulk | Obsolete | -55°C ~ 125°C | Panel Mount | Transistor, TO-5 | Closed Frame | 8060 | Solder | download | RoHS Compliant | 1 (Unlimited) | EAR99 | 8536.69.4040 | 400 | Fluoropolymer (FP) | - | - | Gold | - | Gold | - | 4 (Round) | Beryllium Copper | - | Beryllium Copper | - | - | ||||
|
22-8500-610C | 14.1274 | |
6225 | 0.00000000 | Aries Electronics | 8 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame, Elevated | 22-8500 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 22 (2 x 11) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | ||
|
28-C212-21 | 22.7922 | |
2243 | 0.00000000 | Aries Electronics | EJECT-A-DIP™ | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 28-C212 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.040" (1.02mm) | - | ||
|
32-C300-20 | 21.0250 | |
8536 | 0.00000000 | Aries Electronics | EJECT-A-DIP™ | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 32-C300 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.040" (1.02mm) | - | ||
|
114-47-642-41-117000 | 14.6700 | |
5759 | 0.00000000 | Mill-Max Manufacturing Corp. | 114 | Tube | Active | -55°C ~ 125°C | Surface Mount | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 114-47 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 9 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | UL94 V-0 | 0.100" (2.54mm) | Gold | Flash | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | - | 10mOhm | ||
|
518-77-420M26-001105 | 58.6592 | |
9411 | 0.00000000 | Preci-Dip | 518 | Bulk | Active | -55°C ~ 125°C | Through Hole | PGA | Open Frame | 518-77 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 15 | 1 A | FR4 Epoxy Glass | UL94 V-0 | 0.050" (1.27mm) | Gold | Flash | Gold | Flash | 420 (26 x 26) | Beryllium Copper | 0.050" (1.27mm) | Brass | 0.110" (2.78mm) | 10mOhm | ||
|
88-PGM13028-10H | 31.9062 | |
2532 | 0.00000000 | Aries Electronics | PGM | Bulk | Active | -55°C ~ 105°C | Through Hole | PGA | - | 88-PGM1 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.165" (4.19mm) | - | ||
|
614-13-101-13-061007 | - | |
2230 | 0.00000000 | Mill-Max Manufacturing Corp. | 614 | Bulk | Active | -55°C ~ 125°C | Through Hole | PGA | Carrier, Open Frame | 614-13 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 101 (13 x 13) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | 0.146" (3.71mm) | 10mOhm | ||
|
36-0508-21 | 23.1194 | |
5034 | 0.00000000 | Aries Electronics | 508 | Bulk | Active | -55°C ~ 125°C | Through Hole | SIP | - | 36-0508 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6 | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 36 (1 x 36) | Beryllium Copper | - | Brass | 0.360" (9.14mm) | - | ||
|
22-4513-11 | 4.9894 | |
8412 | 0.00000000 | Aries Electronics | Lo-PRO®file, 513 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.4" (10.16mm) Row Spacing | Closed Frame | 22-4513 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 22 (2 x 11) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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