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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance
614-41-324-31-007000 Mill-Max Manufacturing Corp. 614-41-324-31-007000 15.6109
RFQ
ECAD 5806 0.00000000 Mill-Max Manufacturing Corp. 614 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Carrier, Open Frame 614-41 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.146" (3.71mm) 10mOhm
612-11-624-41-001000 Mill-Max Manufacturing Corp. 612-11-624-41-001000 15.9014
RFQ
ECAD 1507 0.00000000 Mill-Max Manufacturing Corp. 612 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Carrier, Open Frame 612-11 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) - - - - 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.124" (3.15mm) 10mOhm
17-0501-30 Aries Electronics 17-0501-30 10.3262
RFQ
ECAD 3235 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 105°C Through Hole SIP - 17-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 17 (1 x 17) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.690" (17.52mm) -
714-43-204-31-018000 Mill-Max Manufacturing Corp. 714-43-204-31-018000 1.4000
RFQ
ECAD 57 0.00000000 Mill-Max Manufacturing Corp. 714 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.1" (2.54mm) Row Spacing Carrier, Closed Frame 714-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected ED1307-04 EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 4 (2 x 2) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) -
28-C300-11 Aries Electronics 28-C300-11 8.2325
RFQ
ECAD 1532 0.00000000 Aries Electronics EJECT-A-DIP™ Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 28-C300 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
515-13-109-12-051002 Mill-Max Manufacturing Corp. 515-13-109-12-051002 -
RFQ
ECAD 9478 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 109 (12 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
110-87-210-41-001101 Preci-Dip 110-87-210-41-001101 0.6700
RFQ
ECAD 22 0.00000000 Preci-Dip 110 Tube Active -55°C ~ 125°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Open Frame 110-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 41 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
116-43-314-61-001000 Mill-Max Manufacturing Corp. 116-43-314-61-001000 22.5402
RFQ
ECAD 3337 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-43 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 28 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.594" (15.09mm) 10mOhm
XR2A-0825 Omron Electronics Inc-EMC Div XR2A-0825 2.0900
RFQ
ECAD 183 0.00000000 Omron Electronics Inc-EMC Div XR2 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame XR2A Solder download RoHS Compliant 1 (Unlimited) 2266-XR2A-0825 EAR99 8536.69.4040 60 1 A Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Gold Flash 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - 20mOhm
114-83-308-41-117101 Preci-Dip 114-83-308-41-117101 0.5165
RFQ
ECAD 2283 0.00000000 Preci-Dip 114 Bulk Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame 114-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 52 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 0.047" (1.20mm) 10mOhm
110-93-320-61-001000 Mill-Max Manufacturing Corp. 110-93-320-61-001000 16.7710
RFQ
ECAD 1216 0.00000000 Mill-Max Manufacturing Corp. 110 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing 110-93 Solder - 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 20 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
40-6513-11H Aries Electronics 40-6513-11H 11.8898
RFQ
ECAD 3991 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 40-6513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
68-PRS11033-16 Aries Electronics 68-PRS11033-16 -
RFQ
ECAD 9681 0.00000000 Aries Electronics PRS Bulk Obsolete -65°C ~ 200°C Through Hole PGA, ZIF (ZIP) Closed Frame Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze 50.0µin (1.27µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
612-11-950-41-001000 Mill-Max Manufacturing Corp. 612-11-950-41-001000 22.2766
RFQ
ECAD 8334 0.00000000 Mill-Max Manufacturing Corp. 612 Tube Active -55°C ~ 125°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Carrier, Open Frame 612-11 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) - - - - 50 (2 x 25) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.124" (3.15mm) 10mOhm
20-9513-10 Aries Electronics 20-9513-10 3.9592
RFQ
ECAD 7521 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Closed Frame 20-9513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
18-822-90 Aries Electronics 18-822-90 15.0703
RFQ
ECAD 6960 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active -55°C ~ 105°C Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame 18-822 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 18 (2 x 9) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
04-7422-10 Aries Electronics 04-7422-10 5.1429
RFQ
ECAD 2390 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 04-7422 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 60 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 4 (1 x 4) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
10-8375-310C Aries Electronics 10-8375-310C 7.3114
RFQ
ECAD 2252 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 10-8375 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
10-3513-10T Aries Electronics 10-3513-10T 1.2665
RFQ
ECAD 1029 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 10-3513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
40-6503-31 Aries Electronics 40-6503-31 27.7993
RFQ
ECAD 3234 0.00000000 Aries Electronics 503 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 40-650 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Phosphor Bronze 0.500" (12.70mm) -
1-1814655-3 TE Connectivity AMP Connectors 1-1814655-3 -
RFQ
ECAD 6370 0.00000000 TE Connectivity AMP Connectors - Bulk Obsolete -55°C ~ 125°C Through Hole SIP Closed Frame 1814655 Solder download ROHS3 Compliant 1 (Unlimited) REACH Affected 2266-1-1814655-3 EAR99 8536.69.4040 1,000 1 A Thermoplastic, Polyester UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold 29.5µin (0.75µm) 20 (1 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.114" (2.90mm) 10mOhm
AW 127-12/Z-T Assmann WSW Components AW 127-12/Z-T 0.2000
RFQ
ECAD 3968 0.00000000 Assmann WSW Components - - Active - - - - AW 127-1 - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 100 - - - - - - - - - - - - -
2287402-1 TE Connectivity AMP Connectors 2287402-1 -
RFQ
ECAD 7448 0.00000000 TE Connectivity AMP Connectors - Bulk Obsolete - Surface Mount LGA Closed Frame 2287402 Solder download RoHS Compliant 1 (Unlimited) Vendor Undefined EAR99 8536.69.4040 180 Thermoplastic UL94 V-0 0.036" (0.91mm) Gold 15.0µin (0.38µm) Gold 15.0µin (0.38µm) 1151 Copper Alloy 0.036" (0.91mm) Copper Alloy - -
64-9508-20 Aries Electronics 64-9508-20 30.2536
RFQ
ECAD 4204 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Open Frame 64-9508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 64 (2 x 32) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
ICF-308-S-I-TR Samtec Inc. ICF-308-S-I-TR 2.8159
RFQ
ECAD 9982 0.00000000 Samtec Inc. ICF Tape & Reel (TR) Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-308-S-I-TR 475 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
10-8250-310C Aries Electronics 10-8250-310C 7.3114
RFQ
ECAD 4460 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 10-8250 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
7100265144 3M 7100265144 127.5040
RFQ
ECAD 1201 0.00000000 3M - Bulk Active - 19-7100265144 5
100-022-050 3M 100-022-050 -
RFQ
ECAD 3036 0.00000000 3M 100 Bulk Obsolete -65°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame 100-022 Solder download 1 (Unlimited) EAR99 8536.69.4040 200 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold Flash 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.126" (3.20mm) -
110-43-324-41-605000 Mill-Max Manufacturing Corp. 110-43-324-41-605000 14.0725
RFQ
ECAD 1060 0.00000000 Mill-Max Manufacturing Corp. 110 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 110-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
20-4508-20 Aries Electronics 20-4508-20 10.6535
RFQ
ECAD 2735 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame 20-4508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse