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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance
1109741-48 Aries Electronics 1109741-48 -
RFQ
ECAD 4040 0.00000000 Aries Electronics - - Active - - - - 1109741 - - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - - - - - - - - - - - -
ICA-324-ZHGT Samtec Inc. ICA-324-ZHGT 12.6444
RFQ
ECAD 7320 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame ICA-324 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 18 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
510-83-100-13-064101 Preci-Dip 510-83-100-13-064101 5.4682
RFQ
ECAD 6006 0.00000000 Preci-Dip 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 100 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
AW 127-40/Z-T Assmann WSW Components AW 127-40/Z-T 0.6631
RFQ
ECAD 7881 0.00000000 Assmann WSW Components - - Active - - - - AW 127-4 - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 100 - - - - - - - - - - - - -
88-PGM13041-10 Aries Electronics 88-PGM13041-10 13.1715
RFQ
ECAD 6921 0.00000000 Aries Electronics PGM Bulk Active -55°C ~ 105°C Through Hole PGA - 88-PGM1 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Brass 0.165" (4.19mm) -
123-47-628-41-001000 Mill-Max Manufacturing Corp. 123-47-628-41-001000 16.6395
RFQ
ECAD 2483 0.00000000 Mill-Max Manufacturing Corp. 123 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 123-47 Solder download ROHS3 Compliant Not Applicable REACH Unaffected ED11144 EAR99 8536.69.4040 14 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold Flash Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) -
ICA-308-WGG-2 Samtec Inc. ICA-308-WGG-2 5.3732
RFQ
ECAD 7793 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-308-WGG-2 56 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
116-83-310-41-007101 Preci-Dip 116-83-310-41-007101 1.1058
RFQ
ECAD 2151 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 42 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
18-81240-610C Aries Electronics 18-81240-610C 11.6535
RFQ
ECAD 8810 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated 18-8124 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
614-93-225-15-000007 Mill-Max Manufacturing Corp. 614-93-225-15-000007 -
RFQ
ECAD 1500 0.00000000 Mill-Max Manufacturing Corp. 614 Bulk Active -55°C ~ 125°C Through Hole PGA Carrier, Closed Frame 614-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 225 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.146" (3.71mm) 10mOhm
24-823-90C Aries Electronics 24-823-90C 10.7988
RFQ
ECAD 9033 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active -55°C ~ 105°C Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame 24-823 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
32-3573-16 Aries Electronics 32-3573-16 39.7994
RFQ
ECAD 4711 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 32-3573 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
510-83-223-18-002101 Preci-Dip 510-83-223-18-002101 11.6271
RFQ
ECAD 7303 0.00000000 Preci-Dip 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 223 (18 x 18) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
08-6503-20 Aries Electronics 08-6503-20 3.9390
RFQ
ECAD 2595 0.00000000 Aries Electronics 503 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 08-650 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Phosphor Bronze 0.360" (9.14mm) -
299-87-630-10-002101 Preci-Dip 299-87-630-10-002101 7.9382
RFQ
ECAD 9171 0.00000000 Preci-Dip 299 Bulk Active -55°C ~ 125°C Through Hole, Right Angle, Horizontal DIP, 0.6" (15.24mm) Row Spacing Closed Frame 299-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 30 (2 x 15) Beryllium Copper 0.100" (2.54mm) Brass 0.128" (3.24mm) 10mOhm
116-83-306-41-001101 Preci-Dip 116-83-306-41-001101 0.8654
RFQ
ECAD 1838 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 70 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
APA-322-T-P Samtec Inc. APA-322-T-P -
RFQ
ECAD 1058 0.00000000 Samtec Inc. APA Bulk Active - Through Hole - Open Frame APA-322 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 22 (2 x 11) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
614-91-318-31-018000 Mill-Max Manufacturing Corp. 614-91-318-31-018000 14.8555
RFQ
ECAD 5678 0.00000000 Mill-Max Manufacturing Corp. 614 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Carrier, Open Frame 614-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 22 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
510-13-289-17-000001 Mill-Max Manufacturing Corp. 510-13-289-17-000001 65.3386
RFQ
ECAD 9886 0.00000000 Mill-Max Manufacturing Corp. 510 Bulk Active -55°C ~ 125°C Through Hole PGA Closed Frame 510-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 289 (17 x 17) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
40-8350-610C Aries Electronics 40-8350-610C 22.1379
RFQ
ECAD 4383 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated 40-8350 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
02-0517-90C Aries Electronics 02-0517-90C 0.7090
RFQ
ECAD 1995 0.00000000 Aries Electronics 0517 Bulk Active - Through Hole, Right Angle SIP - 02-0517 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 - Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 2 (1 x 2) Beryllium Copper - Brass 0.125" (3.18mm) -
346-43-151-41-013000 Mill-Max Manufacturing Corp. 346-43-151-41-013000 9.3300
RFQ
ECAD 3443 0.00000000 Mill-Max Manufacturing Corp. 346 Bulk Active -55°C ~ 125°C Through Hole SIP - 346-43 Press-Fit download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 51 (1 x 51) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.175" (4.45mm) -
614-91-420-31-012000 Mill-Max Manufacturing Corp. 614-91-420-31-012000 14.6203
RFQ
ECAD 3749 0.00000000 Mill-Max Manufacturing Corp. 614 Tube Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Carrier, Open Frame 614-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 20 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.136" (3.45mm) 10mOhm
17-0513-10H Aries Electronics 17-0513-10H 3.0906
RFQ
ECAD 4351 0.00000000 Aries Electronics 0513 Bulk Active - Through Hole SIP - 17-0513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 17 (1 x 17) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
14-3508-302 Aries Electronics 14-3508-302 9.0960
RFQ
ECAD 7197 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 14-3508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
517-83-304-14-051111 Preci-Dip 517-83-304-14-051111 19.6241
RFQ
ECAD 8634 0.00000000 Preci-Dip 517 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 517-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 304 (14 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
546-83-224-18-091135 Preci-Dip 546-83-224-18-091135 25.6768
RFQ
ECAD 9327 0.00000000 Preci-Dip 546 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 546-83 Press-Fit download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.050" (1.27mm) Gold 29.5µin (0.75µm) Tin - 224 (18 x 18) Beryllium Copper 0.100" (2.54mm) Bronze 0.098" (2.50mm) 10mOhm
614-93-114-15-063012 Mill-Max Manufacturing Corp. 614-93-114-15-063012 -
RFQ
ECAD 3365 0.00000000 Mill-Max Manufacturing Corp. 614 Bulk Active -55°C ~ 125°C Through Hole PGA Carrier, Open Frame 614-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 114 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.136" (3.45mm) 10mOhm
122-83-628-41-001101 Preci-Dip 122-83-628-41-001101 3.5232
RFQ
ECAD 8125 0.00000000 Preci-Dip 122 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 122-83 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.370" (9.40mm) 10mOhm
2134146-2 TE Connectivity AMP Connectors 2134146-2 -
RFQ
ECAD 8065 0.00000000 TE Connectivity AMP Connectors - Tape & Reel (TR) Obsolete - Surface Mount PGA Open Frame Solder download ROHS3 Compliant 1 (Unlimited) Vendor Undefined EAR99 8536.69.4040 12,800 Thermoplastic UL94 V-0 0.157" (4.00mm) Gold Flash Tin-Lead Flash 989 (35 x 36) Copper Alloy 0.157" (4.00mm) Copper Alloy 0.157" (4.00mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse