Tel: +86-0755-83501315
Email: sales@sic-components.com
Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Type | Features | Base Product Number | Termination | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | ECCN | HTSUS | Standard Package | Current Rating (Amps) | Housing Material | Material Flammability Rating | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Convert From (Adapter End) | Convert To (Adapter End) | Number of Pins | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Material - Post | Termination Post Length | Contact Resistance | Board Material |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
175-PGM16010-10 | 19.9943 | 5144 | 0.00000000 | Aries Electronics | PGM | Bulk | Active | -55°C ~ 105°C | Through Hole | PGA | - | 175-PGM | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.165" (4.19mm) | - | |||||||
181-PGM18040-10 | 20.3381 | 7877 | 0.00000000 | Aries Electronics | PGM | Bulk | Active | -55°C ~ 105°C | Through Hole | PGA | - | 181-PGM | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.165" (4.19mm) | - | |||||||
192-PGM17043-10H | 69.4682 | 7318 | 0.00000000 | Aries Electronics | PGM | Bulk | Active | -55°C ~ 105°C | Through Hole | PGA | - | 192-PGM | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.165" (4.19mm) | - | |||||||
223-PGM18039-10 | 22.8411 | 7751 | 0.00000000 | Aries Electronics | PGM | Bulk | Active | -55°C ~ 105°C | Through Hole | PGA | - | 223-PGM | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.165" (4.19mm) | - | |||||||
37-PGM10012-11 | 16.0464 | 4020 | 0.00000000 | Aries Electronics | PGM | Bulk | Active | -55°C ~ 125°C | Through Hole | PGA | - | 37-PGM1 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | - | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.165" (4.19mm) | - | |||||||
66-PGM11054-10 | 13.0668 | 6315 | 0.00000000 | Aries Electronics | PGM | Bulk | Active | -55°C ~ 105°C | Through Hole | PGA | - | 66-PGM1 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.165" (4.19mm) | - | |||||||
68-PGM11033-10H | 13.3458 | 3815 | 0.00000000 | Aries Electronics | PGM | Bulk | Active | -55°C ~ 105°C | Through Hole | PGA | - | 68-PGM1 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.165" (4.19mm) | - | |||||||
69-PGM11031-11 | 19.0618 | 9417 | 0.00000000 | Aries Electronics | PGM | Bulk | Active | -55°C ~ 125°C | Through Hole | PGA | - | 69-PGM1 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | - | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.165" (4.19mm) | - | |||||||
77-PGM10015-11 | 20.3543 | 8200 | 0.00000000 | Aries Electronics | PGM | Bulk | Active | -55°C ~ 125°C | Through Hole | PGA | - | 77-PGM1 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | - | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.165" (4.19mm) | - | |||||||
84-PGM10003-10 | 14.1085 | 9403 | 0.00000000 | Aries Electronics | PGM | Bulk | Active | -55°C ~ 105°C | Through Hole | PGA | - | 84-PGM1 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.165" (4.19mm) | - | |||||||
84-PGM11010-11H | 18.6691 | 3903 | 0.00000000 | Aries Electronics | PGM | Bulk | Active | -55°C ~ 125°C | Through Hole | PGA | - | 84-PGM1 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | - | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.165" (4.19mm) | - | |||||||
84-PGM13042-10T | 39.1873 | 2741 | 0.00000000 | Aries Electronics | PGM | Bulk | Active | -55°C ~ 105°C | Through Hole | PGA | - | 84-PGM1 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.165" (4.19mm) | - | |||||||
84-PGM13053-50 | 20.4200 | 2879 | 0.00000000 | Aries Electronics | PGM | Bulk | Active | -55°C ~ 105°C | Through Hole | PGA | - | 84-PGM1 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.165" (4.19mm) | - | |||||||
85-PGM11007-10H | 31.0879 | 9972 | 0.00000000 | Aries Electronics | PGM | Bulk | Active | -55°C ~ 105°C | Through Hole | PGA | - | 85-PGM1 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.165" (4.19mm) | - | |||||||
20-350000-10-HT | 16.8918 | 7470 | 0.00000000 | Aries Electronics | Correct-A-Chip® 350000 | Bulk | Active | - | Through Hole | - | 20-3500 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 19 | - | - | 0.050" (1.27mm) | Tin | - | Tin-Lead | 200.0µin (5.08µm) | SOIC | DIP, 0.3" (7.62mm) Row Spacing | 20 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | Polyimide (PI) | |||||||
18-35W000-10-P | - | 6435 | 0.00000000 | Aries Electronics | Correct-A-Chip® 35W000 | Bulk | Discontinued at SIC | - | Through Hole | - | 18-35W0 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 144 | - | - | 0.050" (1.27mm) | - | - | Tin-Lead | - | SOIC-W | DIP, 0.3" (7.62mm) Row Spacing | 18 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | |||||||
14-354000-10 | 22.5795 | 5643 | 0.00000000 | Aries Electronics | Correct-A-Chip® 354000 | Bulk | Active | - | Surface Mount | - | 14-3540 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | DIP, 0.3" (7.62mm) Row Spacing | SOIC | 14 | Beryllium Copper | 0.050" (1.27mm) | Brass | - | - | ||||||
18-354000-10 | - | 8885 | 0.00000000 | Aries Electronics | Correct-A-Chip® 354000 | Bulk | Active | - | Surface Mount | - | 18-3540 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | DIP, 0.3" (7.62mm) Row Spacing | SOIC | 18 | Beryllium Copper | 0.050" (1.27mm) | Brass | - | - | ||||||
32-354000-10 | - | 5570 | 0.00000000 | Aries Electronics | Correct-A-Chip® 354000 | Bulk | Active | - | Surface Mount | - | 32-3540 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | - | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | DIP, 0.3" (7.62mm) Row Spacing | SOIC | 32 | Beryllium Copper | 0.100" (2.54mm) | Brass | - | - | ||||||
1109522 | 14.0327 | 6436 | 0.00000000 | Aries Electronics | Correct-A-Chip® 1109522 | Bulk | Active | - | Through Hole | - | 1109522 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 200.0µin (5.08µm) | DIP, 0.3" (7.62mm) Row Spacing | JEDEC | 8 | Beryllium Copper | - | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | ||||||
84-652000-10 | 136.7750 | 1239 | 0.00000000 | Aries Electronics | Correct-A-Chip® 652000 | Bulk | Active | - | Through Hole | - | 84-6520 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | - | - | 0.050" (1.27mm) | - | - | Tin-Lead | 200.0µin (5.08µm) | PLCC | DIP, 0.6" (15.24mm) Row Spacing | 84 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | ||||||
20-353000-10 | - | 5555 | 0.00000000 | Aries Electronics | Correct-A-Chip® 353000 | Bulk | Active | - | Through Hole | Socket Included | 20-3530 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | - | UL94 V-0 | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Tin-Lead | - | PLCC | DIP, 0.3" (7.62mm) Row Spacing | 20 | Phosphor Bronze | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | ||||||
68-505-110-P | - | 8963 | 0.00000000 | Aries Electronics | Correct-A-Chip® 505 | Bulk | Discontinued at SIC | - | Through Hole | - | 68-505 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 72 | - | - | 0.050" (1.27mm) | - | - | Tin-Lead | 200.0µin (5.08µm) | PLCC | PGA | 68 | - | 0.050" (1.27mm) | Brass | 0.150" (3.81mm) | FR4 Epoxy Glass | |||||||
84-505-110-P | - | 3212 | 0.00000000 | Aries Electronics | Correct-A-Chip® 505 | Bulk | Discontinued at SIC | - | Through Hole | - | 84-505 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 56 | - | - | 0.050" (1.27mm) | - | - | Tin-Lead | 200.0µin (5.08µm) | PLCC | PGA | 84 | - | 0.050" (1.27mm) | Brass | 0.150" (3.81mm) | FR4 Epoxy Glass | |||||||
28-505-111 | 14.1462 | 1685 | 0.00000000 | Aries Electronics | Correct-A-Chip® 505 | Bulk | Active | - | Through Hole | - | 28-505 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | - | - | 0.050" (1.27mm) | - | - | Tin-Lead | 200.0µin (5.08µm) | PLCC | PGA | 28 | - | 0.050" (1.27mm) | Brass | 0.150" (3.81mm) | FR4 Epoxy Glass | |||||||
44-505-111 | 14.3039 | 8447 | 0.00000000 | Aries Electronics | Correct-A-Chip® 505 | Bulk | Active | - | Through Hole | - | 44-505 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | - | - | 0.050" (1.27mm) | - | - | Tin-Lead | 200.0µin (5.08µm) | PLCC | PGA | 44 | - | 0.050" (1.27mm) | Brass | 0.150" (3.81mm) | FR4 Epoxy Glass | |||||||
68-505-110-RC | - | 3667 | 0.00000000 | Aries Electronics | Correct-A-Chip® 505 | Bulk | Active | - | Through Hole | - | 68-505 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | - | - | 0.050" (1.27mm) | - | - | Tin-Lead | 200.0µin (5.08µm) | PLCC | PGA | 68 | - | 0.050" (1.27mm) | Brass | 0.150" (3.81mm) | FR4 Epoxy Glass | |||||||
20-651000-10 | 32.8877 | 9926 | 0.00000000 | Aries Electronics | Correct-A-Chip® 651000 | Bulk | Active | - | Through Hole | - | 20-6510 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | - | - | 0.026" (0.65mm) | - | - | Tin-Lead | 200.0µin (5.08µm) | SSOP | DIP, 0.6" (15.24mm) Row Spacing | 20 | - | 0.100" (2.54mm) | Brass | 0.145" (3.68mm) | FR4 Epoxy Glass | ||||||
32-655000-10-P | - | 3029 | 0.00000000 | Aries Electronics | Correct-A-Chip® 655000 | Bulk | Discontinued at SIC | - | Through Hole | - | 32-6550 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 72 | - | - | 0.020" (0.50mm) | Silver | - | Tin-Lead | 200.0µin (5.08µm) | TSOP | DIP, 0.6" (15.24mm) Row Spacing | 32 | Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | |||||||
08-666000-00 | 13.9379 | 1912 | 0.00000000 | Aries Electronics | Correct-A-Chip® 666000 | Bulk | Active | - | Surface Mount | - | 08-6660 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | - | - | 0.050" (1.27mm) | - | - | Tin-Lead | 200.0µin (5.08µm) | SOIC | SOWIC | 8 | - | 0.050" (1.27mm) | Brass | 0.080" (2.03mm) | FR4 Epoxy Glass |
Daily average RFQ Volume
Standard Product Unit
Worldwide Manufacturers
In-stock Warehouse