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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Accessory Type Color For Use With/Related Products Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Body Material Body Finish Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance
PX-84LCC Kycon, Inc. PX-84LCC -
RFQ
ECAD 6870 0.00000000 Kycon, Inc. PX Tube Last Time Buy -40°C ~ 75°C Through Hole PLCC Closed Frame Solder - RoHS Compliant 1 (Unlimited) 2092-PX-84LCC EAR99 8536.69.4040 16 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.050" (1.27mm) Tin - Tin - 84 (4 x 21) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.132" (3.35mm) 15mOhm
289-PLS17001-12 Aries Electronics 289-PLS17001-12 122.6100
RFQ
ECAD 9035 0.00000000 Aries Electronics PLS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 289-PLS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
2310924-3 TE Connectivity AMP Connectors 2310924-3 39.4100
RFQ
ECAD 48 0.00000000 TE Connectivity AMP Connectors - Tray Active - - 2310924 Bolster Assembly Silver LGA 3647 Sockets download RoHS non-compliant Not Applicable Vendor Undefined EAR99 8473.30.9100 84 UL94 V-0 Stainless Steel -
110-83-316-01-822101 Preci-Dip 110-83-316-01-822101 0.7041
RFQ
ECAD 4789 0.00000000 Preci-Dip 110 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 110-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 25 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 16 (2 x 8), 4 Loaded Beryllium Copper 0.100" (2.54mm) Brass - 10mOhm
117-43-764-41-005000 Mill-Max Manufacturing Corp. 117-43-764-41-005000 10.8900
RFQ
ECAD 30 0.00000000 Mill-Max Manufacturing Corp. 117 Tube Active -55°C ~ 125°C Through Hole DIP, 0.75" (19.05mm) Row Spacing Open Frame 117-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 64 (2 x 32) Beryllium Copper 0.070" (1.78mm) Brass Alloy 0.125" (3.18mm) -
100-032-001 3M 100-032-001 -
RFQ
ECAD 3279 0.00000000 3M 100 Bulk Obsolete -65°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Seal Tape 100-032 Solder - RoHS non-compliant 1 (Unlimited) EAR99 8536.69.4040 200 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold Flash 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.126" (3.20mm) -
612-43-628-41-001000 Mill-Max Manufacturing Corp. 612-43-628-41-001000 16.2968
RFQ
ECAD 6043 0.00000000 Mill-Max Manufacturing Corp. 612 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Carrier, Open Frame 612-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.124" (3.15mm) 10mOhm
28-8459-610C Aries Electronics 28-8459-610C 16.0982
RFQ
ECAD 3993 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated 28-8459 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
110-93-324-61-105000 Mill-Max Manufacturing Corp. 110-93-324-61-105000 22.1327
RFQ
ECAD 1660 0.00000000 Mill-Max Manufacturing Corp. 110 Tube Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame 110-93 Solder - 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
16-3518-10 Aries Electronics 16-3518-10 1.6100
RFQ
ECAD 595 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 16-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 24 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
510-83-160-13-001101 Preci-Dip 510-83-160-13-001101 7.9288
RFQ
ECAD 7642 0.00000000 Preci-Dip 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 160 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
551-10-028-06-005004 Mill-Max Manufacturing Corp. 551-10-028-06-005004 -
RFQ
ECAD 9286 0.00000000 Mill-Max Manufacturing Corp. 551 Bulk Active - Through Hole PGA - 551-10 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 28 (6 x 6) - 0.100" (2.54mm) Brass Alloy 0.154" (3.91mm) -
122-83-318-41-001101 Preci-Dip 122-83-318-41-001101 1.8771
RFQ
ECAD 8292 0.00000000 Preci-Dip 122 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 122-83 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 23 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.370" (9.40mm) 10mOhm
ICA-324-ZWGG-2 Samtec Inc. ICA-324-ZWGG-2 12.8411
RFQ
ECAD 1921 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-324-ZWGG-2 18 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
12-7XXXX-10 Aries Electronics 12-7XXXX-10 -
RFQ
ECAD 8425 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 12-7XXX Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 12 (1 x 12) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
714-43-222-31-018000 Mill-Max Manufacturing Corp. 714-43-222-31-018000 6.8300
RFQ
ECAD 8869 0.00000000 Mill-Max Manufacturing Corp. 714 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.1" (2.54mm) Row Spacing Carrier, Closed Frame 714-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected ED1307-22 EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) -
523-13-032-09-041003 Mill-Max Manufacturing Corp. 523-13-032-09-041003 -
RFQ
ECAD 9128 0.00000000 Mill-Max Manufacturing Corp. 523 Bulk Active - Through Hole PGA - 523-13 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 32 (9 x 9) - 0.100" (2.54mm) - 0.510" (12.95mm) -
27-0518-10H Aries Electronics 27-0518-10H 2.9896
RFQ
ECAD 5121 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 27-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 27 (1 x 27) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
522-13-028-06-005002 Mill-Max Manufacturing Corp. 522-13-028-06-005002 -
RFQ
ECAD 5576 0.00000000 Mill-Max Manufacturing Corp. 522 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 522-13 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 28 (6 x 6) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) 10mOhm
28-1518-11H Aries Electronics 28-1518-11H 6.8317
RFQ
ECAD 6335 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.2" (5.08mm) Row Spacing Open Frame 28-1518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
614-41-422-31-018000 Mill-Max Manufacturing Corp. 614-41-422-31-018000 15.1696
RFQ
ECAD 1395 0.00000000 Mill-Max Manufacturing Corp. 614 Tube Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Carrier, Open Frame 614-41 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 18 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
517-83-321-19-121111 Preci-Dip 517-83-321-19-121111 21.9316
RFQ
ECAD 7809 0.00000000 Preci-Dip 517 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 517-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 321 (19 x 19) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
114-93-306-41-117000 Mill-Max Manufacturing Corp. 114-93-306-41-117000 12.2570
RFQ
ECAD 8087 0.00000000 Mill-Max Manufacturing Corp. 114 Tube Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame 114-93 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 67 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) -
ICA-318-ZWGT Samtec Inc. ICA-318-ZWGT 6.6876
RFQ
ECAD 5601 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-318-ZWGT 25 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10.0µin (0.25µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
A-CCS32-Z Assmann WSW Components A-CCS32-Z -
RFQ
ECAD 5193 0.00000000 Assmann WSW Components - Bag Obsolete -55°C ~ 105°C Through Hole PLCC Closed Frame Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 29 1 A Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.050" (1.27mm) Tin 150.0µin (3.81µm) Tin 150.0µin (3.81µm) 32 (2 x 7, 2 x 9) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.130" (3.30mm) 30mOhm
111-41-328-41-001000 Mill-Max Manufacturing Corp. 111-41-328-41-001000 13.8563
RFQ
ECAD 5042 0.00000000 Mill-Max Manufacturing Corp. 111 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 111-41 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
510-91-144-12-000003 Mill-Max Manufacturing Corp. 510-91-144-12-000003 29.2880
RFQ
ECAD 1977 0.00000000 Mill-Max Manufacturing Corp. 510 Bulk Active -55°C ~ 125°C Through Hole PGA Closed Frame 510-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 144 (12 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
515-91-299-20-096001 Mill-Max Manufacturing Corp. 515-91-299-20-096001 -
RFQ
ECAD 8296 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 299 (20 x 20) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
1109800-12 Aries Electronics 1109800-12 -
RFQ
ECAD 2301 0.00000000 Aries Electronics Correct-A-Chip® 1109800 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Programmable 1109800 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 12 (2 x 6) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
614-13-361-19-000012 Mill-Max Manufacturing Corp. 614-13-361-19-000012 -
RFQ
ECAD 6356 0.00000000 Mill-Max Manufacturing Corp. 614 Bulk Active -55°C ~ 125°C Through Hole PGA Carrier, Open Frame 614-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 361 (19 x 19) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.136" (3.45mm) 10mOhm
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse