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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
1109800-22 Aries Electronics 1109800-22 -
RFQ
ECAD 9873 0.00000000 Aries Electronics Correct-A-Chip® 1109800 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Programmable 1109800 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
1109800-24 Aries Electronics 1109800-24 -
RFQ
ECAD 2612 0.00000000 Aries Electronics Correct-A-Chip® 1109800 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Programmable 1109800 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
1109800-26 Aries Electronics 1109800-26 -
RFQ
ECAD 4402 0.00000000 Aries Electronics Correct-A-Chip® 1109800 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Programmable 1109800 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 26 (2 x 13) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
1109800-8 Aries Electronics 1109800-8 -
RFQ
ECAD 4556 0.00000000 Aries Electronics Correct-A-Chip® 1109800 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Programmable 1109800 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
1109252 Aries Electronics 1109252 -
RFQ
ECAD 9936 0.00000000 Aries Electronics Correct-A-Chip® 1109252 Bulk Active - Through Hole - 1109252 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - - - - Tin-Lead - PLCC DIP, 0.6" (15.24mm) Row Spacing 28 - 0.070" (1.78mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
68-304538-10 Aries Electronics 68-304538-10 78.9650
RFQ
ECAD 7800 0.00000000 Aries Electronics Correct-A-Chip® 304538 Bulk Active - Through Hole - 68-3045 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC PGA 68 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
22-304504-18 Aries Electronics 22-304504-18 -
RFQ
ECAD 8679 0.00000000 Aries Electronics Correct-A-Chip® 304504 Bulk Active - Through Hole - 22-3045 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC DIP, 0.4" (10.16mm) Row Spacing 22 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
97-80C251 Aries Electronics 97-80C251 -
RFQ
ECAD 3270 0.00000000 Aries Electronics - Bulk Active - - - 97-80C2 - - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - - - - - - - - - - - - -
16-35W000-11-RC-P (220 UP) Aries Electronics 16-35W000-11-RC-P (220 UP) -
RFQ
ECAD 2855 0.00000000 Aries Electronics Correct-A-Chip® 35W000 Bulk Discontinued at SIC - Through Hole - 16-35W0 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 220 - - 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) SOIC-W DIP, 0.3" (7.62mm) Row Spacing 16 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
28-35W000-11-RC Aries Electronics 28-35W000-11-RC 22.0264
RFQ
ECAD 9822 0.00000000 Aries Electronics Correct-A-Chip® 35W000 Bulk Active - Through Hole - 28-35W0 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 - - - - - Gold 10.0µin (0.25µm) SOIC-W DIP, 0.3" (7.62mm) Row Spacing 28 - 0.050" (1.27mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
16-35W000-11-RC Aries Electronics 16-35W000-11-RC 22.1542
RFQ
ECAD 2321 0.00000000 Aries Electronics Correct-A-Chip® 35W000 Bulk Active - Through Hole - 16-35W0 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) SOIC-W DIP, 0.3" (7.62mm) Row Spacing 16 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
14-354000-21-RC Aries Electronics 14-354000-21-RC 22.5795
RFQ
ECAD 2982 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 14-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 14 Beryllium Copper 0.050" (1.27mm) Brass 0.089" (2.28mm) -
16-354000-21-RC Aries Electronics 16-354000-21-RC 23.3483
RFQ
ECAD 6666 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 16-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 16 Beryllium Copper 0.050" (1.27mm) Brass 0.089" (2.28mm) -
18-354000-21-RC Aries Electronics 18-354000-21-RC -
RFQ
ECAD 8925 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 18-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 18 Beryllium Copper 0.050" (1.27mm) Brass 0.089" (2.28mm) -
28-354000-21-RC Aries Electronics 28-354000-21-RC 30.1064
RFQ
ECAD 5204 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 28-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 - Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 28 Beryllium Copper 0.100" (2.54mm) Brass 0.089" (2.28mm) -
28-652000-11-RC Aries Electronics 28-652000-11-RC 45.2512
RFQ
ECAD 7832 0.00000000 Aries Electronics Correct-A-Chip® 652000 Bulk Active - Through Hole - 28-6520 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 17 1 A - - 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 28 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
28-653000-11-RC Aries Electronics 28-653000-11-RC 42.5882
RFQ
ECAD 9198 0.00000000 Aries Electronics Correct-A-Chip® 653000 Bulk Active - Through Hole Socket Included 28-6530 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 17 1 A - UL94 V-0 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 28 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
32-652000-11-RC Aries Electronics 32-652000-11-RC 46.4487
RFQ
ECAD 3630 0.00000000 Aries Electronics Correct-A-Chip® 652000 Bulk Active - Through Hole - 32-6520 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 1 A - - 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 32 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
44-653000-11-RC Aries Electronics 44-653000-11-RC 54.4800
RFQ
ECAD 1520 0.00000000 Aries Electronics Correct-A-Chip® 653000 Bulk Active - Through Hole Socket Included 44-6530 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - UL94 V-0 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 44 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
84-652000-11-RC Aries Electronics 84-652000-11-RC 68.0957
RFQ
ECAD 3514 0.00000000 Aries Electronics Correct-A-Chip® 652000 Bulk Active - Through Hole - 84-6520 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - - 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 84 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
84-653000-11-RC Aries Electronics 84-653000-11-RC 163.1033
RFQ
ECAD 9033 0.00000000 Aries Electronics Correct-A-Chip® 653000 Bulk Active - Through Hole Socket Included 84-6530 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - UL94 V-0 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 84 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
16-307349-11-RC-P (170 UP) Aries Electronics 16-307349-11-RC-P (170 UP) -
RFQ
ECAD 1759 0.00000000 Aries Electronics Correct-A-Chip® 307349 Bulk Discontinued at SIC - Through Hole - 16-3073 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 170 - - 0.050" (1.27mm) Gold - Gold 10.0µin (0.25µm) PLCC DIP, 0.3" (7.62mm) Row Spacing 16 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
1109681-316 Aries Electronics 1109681-316 -
RFQ
ECAD 4330 0.00000000 Aries Electronics - Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Spacer 1109681 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 16 (2 x 8) Brass 0.100" (2.54mm) Brass 0.125" (3.18mm) -
1109681-320 Aries Electronics 1109681-320 -
RFQ
ECAD 1748 0.00000000 Aries Electronics - Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Spacer 1109681 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 20 (2 x 10) Brass 0.100" (2.54mm) Brass 0.125" (3.18mm) -
1109681-328 Aries Electronics 1109681-328 -
RFQ
ECAD 7089 0.00000000 Aries Electronics - Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Spacer 1109681 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 28 (2 x 14) Brass 0.100" (2.54mm) Brass 0.125" (3.18mm) -
69802-452LF Amphenol ICC (FCI) 69802-452LF -
RFQ
ECAD 3777 0.00000000 Amphenol ICC (FCI) - Tube Obsolete -55°C ~ 125°C Surface Mount PLCC Closed Frame 69802 Solder download 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1,000 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.050" (1.27mm) Tin 150.0µin (3.81µm) Tin 150.0µin (3.81µm) 52 (4 x 13) Phosphor Bronze 0.050" (1.27mm) Phosphor Bronze - 20mOhm
TDU03DTOD Sullins Connector Solutions TDU03DTOD 13.8000
RFQ
ECAD 5948 0.00000000 Sullins Connector Solutions - Tray Active -55°C ~ 175°C Through Hole Transistor Board Guide, Flange TDU03 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected S9633 EAR99 8536.69.4040 10 5 A Polyphenylene Sulfide (PPS) - - Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 3 (Rectangular) Beryllium Copper - Beryllium Copper 0.130" (3.30mm) 30mOhm
TMJ03DKSD-S1512 Sullins Connector Solutions TMJ03DKSD-S1512 16.3220
RFQ
ECAD 8582 0.00000000 Sullins Connector Solutions - Tray Active -50°C ~ 175°C Through Hole Transistor, TO-254 Flange TMJ03 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected S9638 EAR99 8536.69.4040 10 3 A Polyphenylene Sulfide (PPS) - 0.150" (3.81mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 3 (Rectangular) Beryllium Copper 0.150" (3.81mm) Beryllium Copper - 30mOhm
DILB20P-223TLF Amphenol ICC (FCI) DILB20P-223TLF 0.7800
RFQ
ECAD 13 0.00000000 Amphenol ICC (FCI) - Tube Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame DILB20P Solder download RoHS Compliant 1 (Unlimited) REACH Affected EAR99 8536.69.4040 24 1 A Polyamide (PA), Nylon UL94 V-0 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 100.0µin (2.54µm) 20 (2 x 10) Copper Alloy 0.100" (2.54mm) Copper Alloy 0.124" (3.15mm) 30mOhm
DILB8P-223TLF Amphenol ICC (FCI) DILB8P-223TLF 0.3600
RFQ
ECAD 29 0.00000000 Amphenol ICC (FCI) - Tube Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame DILB8P Solder download RoHS Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 60 1 A Polyamide (PA), Nylon UL94 V-0 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 100.0µin (2.54µm) 8 (2 x 4) Copper Alloy 0.100" (2.54mm) Copper Alloy 0.124" (3.15mm) 30mOhm
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse