SIC
close
Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Accessory Type Color For Use With/Related Products Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Body Material Body Finish Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance
28-6575-16 Aries Electronics 28-6575-16 37.3706
RFQ
ECAD 9935 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 28-6575 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 9 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
510-83-100-15-101101 Preci-Dip 510-83-100-15-101101 5.8100
RFQ
ECAD 5018 0.00000000 Preci-Dip 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 100 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
510-83-175-16-001101 Preci-Dip 510-83-175-16-001101 9.2703
RFQ
ECAD 6849 0.00000000 Preci-Dip 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 13 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 175 (16 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
517-83-325-18-111111 Preci-Dip 517-83-325-18-111111 20.6498
RFQ
ECAD 7006 0.00000000 Preci-Dip 517 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 517-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 325 (18 x 18) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
510-87-114-13-062101 Preci-Dip 510-87-114-13-062101 3.8856
RFQ
ECAD 4221 0.00000000 Preci-Dip 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 114 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
ICO-628-SGT Samtec Inc. ICO-628-SGT 6.9100
RFQ
ECAD 2 0.00000000 Samtec Inc. ICO Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame ICO-628 Solder download ROHS3 Compliant 1 (Unlimited) REACH Affected SAM15990 EAR99 8536.69.4040 16 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
ICO-628-ZMGG Samtec Inc. ICO-628-ZMGG 11.4425
RFQ
ECAD 5785 0.00000000 Samtec Inc. ICO Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICO-628-ZMGG 16 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
ICA-320-ZSGG Samtec Inc. ICA-320-ZSGG 7.4427
RFQ
ECAD 7433 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-320-ZSGG 22 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
40-6570-16 Aries Electronics 40-6570-16 47.0314
RFQ
ECAD 2199 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 40-6570 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
510-83-179-18-001101 Preci-Dip 510-83-179-18-001101 9.3330
RFQ
ECAD 6891 0.00000000 Preci-Dip 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 179 (18 x 18) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
510-83-084-12-051101 Preci-Dip 510-83-084-12-051101 4.5932
RFQ
ECAD 5767 0.00000000 Preci-Dip 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 17 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 84 (12 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
APO-640-T-T Samtec Inc. APO-640-T-T 13.2400
RFQ
ECAD 5324 0.00000000 Samtec Inc. APO Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-APO-640-T-T 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 40 (2 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
523-93-084-10-031002 Mill-Max Manufacturing Corp. 523-93-084-10-031002 -
RFQ
ECAD 7219 0.00000000 Mill-Max Manufacturing Corp. 523 Bulk Active - Through Hole PGA - 523-93 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 84 (10 x 10) - 0.100" (2.54mm) - 0.510" (12.95mm) -
522-93-125-13-041001 Mill-Max Manufacturing Corp. 522-93-125-13-041001 -
RFQ
ECAD 5238 0.00000000 Mill-Max Manufacturing Corp. 522 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 522-93 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 125 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) 10mOhm
0475938000 Molex 0475938000 -
RFQ
ECAD 2352 0.00000000 Molex 47593 Tray Obsolete - - 047593 Back Plate Silver LGA 13XX Connectors download ROHS3 Compliant 1 (Unlimited) EAR99 8538.90.8180 1,000 - Steel Nickel
511-93-114-15-063001 Mill-Max Manufacturing Corp. 511-93-114-15-063001 -
RFQ
ECAD 8296 0.00000000 Mill-Max Manufacturing Corp. 511 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 511-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 114 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
126-91-428-41-001000 Mill-Max Manufacturing Corp. 126-91-428-41-001000 15.3500
RFQ
ECAD 3798 0.00000000 Mill-Max Manufacturing Corp. 126 Tube Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame 126-91 Wire Wrap download 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.425" (10.80mm) 10mOhm
244-5205-00 3M 244-5205-00 131.1160
RFQ
ECAD 7534 0.00000000 3M Textool™ Box Active - - - - 244 - - Not Applicable EAR99 8536.69.4040 5 - - - - - - - - - - - - -
116-43-324-61-008000 Mill-Max Manufacturing Corp. 116-43-324-61-008000 23.8597
RFQ
ECAD 7642 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-43 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.472" (11.99mm) 10mOhm
510-91-145-13-041002 Mill-Max Manufacturing Corp. 510-91-145-13-041002 29.3652
RFQ
ECAD 6894 0.00000000 Mill-Max Manufacturing Corp. 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 145 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
1051632005 Molex 1051632005 -
RFQ
ECAD 6912 0.00000000 Molex 105163 Tape & Reel (TR) Obsolete - - 105163 Cover Silver Camera Socket download ROHS3 Compliant 1 (Unlimited) REACH Unaffected 105163-2005 EAR99 8536.69.4040 4,000 - Stainless Steel -
116-87-432-41-009101 Preci-Dip 116-87-432-41-009101 3.5966
RFQ
ECAD 5459 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Elevated, Open Frame 116-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 13 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
05-0511-10 Aries Electronics 05-0511-10 4.9127
RFQ
ECAD 5422 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 105°C Through Hole SIP - 05-0511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 50.0µin (1.27µm) 5 (1 x 5) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
210-47-318-41-001000 Mill-Max Manufacturing Corp. 210-47-318-41-001000 12.7115
RFQ
ECAD 2807 0.00000000 Mill-Max Manufacturing Corp. 210 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 210-47 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 22 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold Flash Tin 200.0µin (5.08µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
818-AG11D-ES TE Connectivity AMP Connectors 818-AG11D-ES -
RFQ
ECAD 8181 0.00000000 TE Connectivity AMP Connectors 800 Tube Obsolete -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 818 Solder download RoHS non-compliant 1 (Unlimited) REACH Affected EAR99 8536.69.4040 1,040 3 A Polyester UL94 V-0 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead - 18 (2 x 9) Copper Alloy 0.100" (2.54mm) Copper Alloy 0.125" (3.18mm) 10mOhm
34-1518-10H Aries Electronics 34-1518-10H 3.7370
RFQ
ECAD 5597 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.2" (5.08mm) Row Spacing Open Frame 34-1518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 34 (2 x 17) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
511-93-028-06-005003 Mill-Max Manufacturing Corp. 511-93-028-06-005003 -
RFQ
ECAD 4991 0.00000000 Mill-Max Manufacturing Corp. 511 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 511-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 28 (6 x 6) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
IC201-1004-008 Yamaichi Electronics IC201-1004-008 -
RFQ
ECAD 6603 0.00000000 Yamaichi Electronics - Box Active -40°C ~ 150°C - IC201 Chip Carrier Black - download ROHS3 Compliant 2 (1 Year) 2408-IC201-1004-008 EAR99 8542.39.0000 1 - Polyetherimide (PEI), Glass Filled - 100
114-83-310-41-134191 Preci-Dip 114-83-310-41-134191 0.8696
RFQ
ECAD 2540 0.00000000 Preci-Dip 114 Bulk Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame 114-83 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1,000 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.047" (1.20mm) 10mOhm
0475968755 Molex 0475968755 -
RFQ
ECAD 9936 0.00000000 Molex * Bulk Obsolete 047596 - 1 (Unlimited) 160
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse