SIC
close
Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Accessory Type Color For Use With/Related Products Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Body Material Body Finish Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance
IC51-1004-809 Yamaichi Electronics IC51-1004-809 164.0400
RFQ
ECAD 13 0.00000000 Yamaichi Electronics - Box Active -55°C ~ 170°C - IC51-1004 Chip Carrier Black IC Sockets download ROHS3 Compliant 2 (1 Year) 2408-IC51-1004-809 EAR99 8542.39.0000 1 - Polyethersulfone (PES), Glass Filled - 100
2144-9283-90-2401 3M 2144-9283-90-2401 -
RFQ
ECAD 5846 0.00000000 3M - Bulk Obsolete - - - - - - RoHS Compliant Not Applicable OBSOLETE 1 - - - - - - - - - - - - -
2400-9220-00-2401 3M 2400-9220-00-2401 -
RFQ
ECAD 8848 0.00000000 3M - Bulk Obsolete - - - - - - RoHS Compliant Not Applicable OBSOLETE 1 - - - - - - - - - - - - -
2313-9229-00-2401 3M 2313-9229-00-2401 -
RFQ
ECAD 2656 0.00000000 3M - Bulk Obsolete - - - - - - RoHS Compliant Not Applicable OBSOLETE 1 - - - - - - - - - - - - -
2676-929B-90-2401 3M 2676-929B-90-2401 -
RFQ
ECAD 8312 0.00000000 3M Textool™ Bulk Obsolete - - - - - - RoHS Compliant Not Applicable OBSOLETE 1 - - - - - - - - - - - - -
2320-9220-02-2401 3M 2320-9220-02-2401 -
RFQ
ECAD 5796 0.00000000 3M - Bulk Obsolete - - - - - - RoHS Compliant Not Applicable OBSOLETE 1 - - - - - - - - - - - - -
IC234-1204-022N Yamaichi Electronics IC234-1204-022N 138.2400
RFQ
ECAD 2 0.00000000 Yamaichi Electronics - Box Active -40°C ~ 150°C - IC234 Chip Carrier Black - download ROHS3 Compliant 2 (1 Year) 2408-IC234-1204-022N EAR99 8542.39.0000 1 - Polyethersulfone (PES), Glass Filled - 120
IC357-0484-142P-1 Yamaichi Electronics IC357-0484-142P-1 51.4300
RFQ
ECAD 8 0.00000000 Yamaichi Electronics - Box Active -40°C ~ 150°C - IC357 Chip Carrier Black - download ROHS3 Compliant 2 (1 Year) 2408-IC357-0484-142P-1 EAR99 8542.39.0000 1 - Polyethersulfone (PES), Glass Filled - 48
XR2A-1601-N Omron Electronics Inc-EMC Div XR2A-1601-N 2.8330
RFQ
ECAD 1319 0.00000000 Omron Electronics Inc-EMC Div * Bulk Active XR2A - 1 (Unlimited) 39-XR2A-1601-N 30
XR2A-2471-N Omron Electronics Inc-EMC Div XR2A-2471-N 4.4130
RFQ
ECAD 1144 0.00000000 Omron Electronics Inc-EMC Div * Bulk Active XR2A - 1 (Unlimited) 39-XR2A-2471-N 20
214-99-320-01-670799 Mill-Max Manufacturing Corp. 214-99-320-01-670799 3.8527
RFQ
ECAD 8635 0.00000000 Mill-Max Manufacturing Corp. 214 Tape & Reel (TR) Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Closed Frame 214-99 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected 54-214-99-320-01-670799TR EAR99 8536.69.4040 750 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 200.0µin (5.08µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.056" (1.42mm) -
214-44-316-01-670799 Mill-Max Manufacturing Corp. 214-44-316-01-670799 3.6226
RFQ
ECAD 3353 0.00000000 Mill-Max Manufacturing Corp. 214 Tape & Reel (TR) Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Closed Frame 214-44 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected 54-214-44-316-01-670799TR EAR99 8536.69.4040 750 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 200.0µin (5.08µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.056" (1.42mm) -
214-99-632-01-670799 Mill-Max Manufacturing Corp. 214-99-632-01-670799 7.6426
RFQ
ECAD 6983 0.00000000 Mill-Max Manufacturing Corp. 214 Tape & Reel (TR) Active -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Closed Frame 214-99 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected 54-214-99-632-01-670799TR EAR99 8536.69.4040 400 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.056" (1.42mm) -
214-44-306-01-670799 Mill-Max Manufacturing Corp. 214-44-306-01-670799 2.8476
RFQ
ECAD 9452 0.00000000 Mill-Max Manufacturing Corp. 214 Tape & Reel (TR) Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Closed Frame 214-44 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected 54-214-44-306-01-670799TR EAR99 8536.69.4040 750 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 200.0µin (5.08µm) 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.056" (1.42mm) -
214-44-632-01-670799 Mill-Max Manufacturing Corp. 214-44-632-01-670799 7.6426
RFQ
ECAD 5259 0.00000000 Mill-Max Manufacturing Corp. 214 Tape & Reel (TR) Active -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Closed Frame 214-44 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected 54-214-44-632-01-670799TR EAR99 8536.69.4040 400 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.056" (1.42mm) -
IC51-0804-808 Yamaichi Electronics IC51-0804-808 55.5500
RFQ
ECAD 10 0.00000000 Yamaichi Electronics IC51 Box Active - - IC51-0804 Chip Carrier Black IC Sockets download ROHS3 Compliant 2 (1 Year) REACH Unaffected 2408-IC51-0804-808 EAR99 8542.39.0000 1 - Polyethersulfone (PES), Glass Filled - 80
IC51-1004-405-1 Yamaichi Electronics IC51-1004-405-1 59.0000
RFQ
ECAD 10 0.00000000 Yamaichi Electronics IC51 Box Active -55°C ~ 170°C - Chip Carrier Black IC Sockets download ROHS3 Compliant 2 (1 Year) REACH Unaffected 2408-IC51-1004-405-1 EAR99 8542.39.0000 1 - Polyethersulfone (PES), Glass Filled - 100
1051427000 Molex 1051427000 7.1200
RFQ
ECAD 656 0.00000000 Molex * Tray Active - RoHS non-compliant Vendor Undefined REACH info available upon request EAR99 8538.90.8180 5
1052000008 Molex 1052000008 0.9300
RFQ
ECAD 900 0.00000000 Molex * Box Active download ROHS3 Compliant Vendor Undefined REACH info available upon request EAR99 8536.69.4040 76
NTE435P18 NTE Electronics, Inc NTE435P18 -
RFQ
ECAD 2692 0.00000000 NTE Electronics, Inc - Bag Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 1 (Unlimited) 2368-NTE435P18 EAR99 8535.90.8040 1 - - 0.100" (2.54mm) - - - - 18 (2 x 9) - 0.100" (2.54mm) - - -
4726 Adafruit Industries LLC 4726 4.2000
RFQ
ECAD 6999 0.00000000 Adafruit Industries LLC - Bulk Active - Surface Mount SOIC Closed Frame Solder download ROHS3 Compliant 1 (Unlimited) 1528-4726 EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - - - 8 (2 x 4) - 0.050" (1.27mm) - - -
4727 Adafruit Industries LLC 4727 6.9500
RFQ
ECAD 2982 0.00000000 Adafruit Industries LLC - Bulk Active - Surface Mount SOIC Closed Frame Solder download ROHS3 Compliant 1 (Unlimited) 1528-4727 EAR99 8536.69.4040 1 Thermoplastic UL94 V-0 0.050" (1.27mm) Tin 100.0µin (2.54µm) Tin 100.0µin (2.54µm) 16 (2 x 8) Copper Alloy 0.050" (1.27mm) Copper Alloy - -
1554116-1 TE Connectivity AMP Connectors 1554116-1 -
RFQ
ECAD 3039 0.00000000 TE Connectivity AMP Connectors - Tray Obsolete - - - - - - ROHS3 Compliant 1 (Unlimited) REACH Unaffected OBSOLETE 0000.00.0000 200 - - - - - - - - - - - - -
214-99-316-01-670800 Mill-Max Manufacturing Corp. 214-99-316-01-670800 2.2000
RFQ
ECAD 3316 0.00000000 Mill-Max Manufacturing Corp. 214 Tube Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Closed Frame 214-99 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 25 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 200.0µin (5.08µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.056" (1.42mm) -
523-93-144-15-082001 Mill-Max Manufacturing Corp. 523-93-144-15-082001 -
RFQ
ECAD 8402 0.00000000 Mill-Max Manufacturing Corp. 523 Bulk Active - Through Hole PGA - 523-93 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 144 (15 x 15) - 0.100" (2.54mm) - 0.510" (12.95mm) -
117-93-664-41-005000 Mill-Max Manufacturing Corp. 117-93-664-41-005000 8.9943
RFQ
ECAD 7823 0.00000000 Mill-Max Manufacturing Corp. 117 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 117-93 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 64 (2 x 32) Beryllium Copper 0.070" (1.78mm) Brass Alloy 0.125" (3.18mm) -
14-0518-10 Aries Electronics 14-0518-10 1.3241
RFQ
ECAD 7469 0.00000000 Aries Electronics 518 - Active - Through Hole SIP Open Frame 14-0518 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 14 (1 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
10-6511-10 Aries Electronics 10-6511-10 3.3330
RFQ
ECAD 4632 0.00000000 Aries Electronics 511 - Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 10-6511 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 40 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 10 (2 x 5) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
4606 Keystone Electronics 4606 1.9100
RFQ
ECAD 48 0.00000000 Keystone Electronics - Bulk Active - Chassis Mount Transistor, TO-3 Closed Frame Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polyester, Glass Filled UL94 V-0 - Tin - Tin - 3 (Rectangular) Brass - Brass - -
24-6554-10 Aries Electronics 24-6554-10 13.3300
RFQ
ECAD 167 0.00000000 Aries Electronics 55 Tube Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 24-655 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse