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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance
26-0501-21 Aries Electronics 26-0501-21 16.3770
RFQ
ECAD 8623 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 125°C Through Hole SIP - 26-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 26 (1 x 26) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.420" (10.67mm) -
D01-9503242 Harwin Inc. D01-9503242 -
RFQ
ECAD 3419 0.00000000 Harwin Inc. D01-950 Tube Obsolete -55°C ~ 125°C Through Hole SIP Elevated Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 250 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 32 (1 x 32) Beryllium Copper 0.100" (2.54mm) Brass 0.126" (3.20mm) 10mOhm
21-7XXXX-10 Aries Electronics 21-7XXXX-10 -
RFQ
ECAD 3982 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 21-7XXX Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 21 (1 x 21) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
20-7903-10 Aries Electronics 20-7903-10 11.5988
RFQ
ECAD 2456 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 20-7903 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 20 (1 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
06-6513-11 Aries Electronics 06-6513-11 1.6312
RFQ
ECAD 6542 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 06-6513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
08-2513-10H Aries Electronics 08-2513-10H 2.3028
RFQ
ECAD 5684 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Closed Frame 08-2513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
29-71250-10 Aries Electronics 29-71250-10 15.2448
RFQ
ECAD 7981 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 29-7125 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 29 (1 x 29) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
551-10-068-11-061003 Mill-Max Manufacturing Corp. 551-10-068-11-061003 -
RFQ
ECAD 8687 0.00000000 Mill-Max Manufacturing Corp. 551 Bulk Active - Through Hole PGA Open Frame 551-10 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 68 (11 x 11) - 0.100" (2.54mm) Brass Alloy 0.154" (3.91mm) -
APO-624-G-B Samtec Inc. APO-624-G-B 21.1700
RFQ
ECAD 8959 0.00000000 Samtec Inc. APO Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-APO-624-G-B 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
38-7XXXX-10 Aries Electronics 38-7XXXX-10 -
RFQ
ECAD 4038 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 38-7XXX Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 38 (1 x 38) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
34-7XXXX-10 Aries Electronics 34-7XXXX-10 -
RFQ
ECAD 7419 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 34-7XXX Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 34 (1 x 34) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
16-8380-310C Aries Electronics 16-8380-310C 10.0717
RFQ
ECAD 5277 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 16-8380 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
08-3518-10H Aries Electronics 08-3518-10H 1.5160
RFQ
ECAD 4666 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 08-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 49 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
01-0513-10 Aries Electronics 01-0513-10 0.2101
RFQ
ECAD 3182 0.00000000 Aries Electronics 0513 Bulk Active - Through Hole SIP - 01-0513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 - Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 1 (1 x 1) Beryllium Copper - Brass 0.125" (3.18mm) -
126-43-424-41-003000 Mill-Max Manufacturing Corp. 126-43-424-41-003000 16.9302
RFQ
ECAD 3550 0.00000000 Mill-Max Manufacturing Corp. 126 Tube Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame 126-43 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.661" (16.79mm) 10mOhm
30-1518-00 Aries Electronics 30-1518-00 6.6661
RFQ
ECAD 2123 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.2" (5.08mm) Row Spacing Open Frame 30-1518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 30 (2 x 15) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
ICF-632-TL-O-TR Samtec Inc. ICF-632-TL-O-TR 4.3268
RFQ
ECAD 4653 0.00000000 Samtec Inc. ICF Tape & Reel (TR) Active -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-632-TL-O-TR 275 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Tin - Tin - 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
2-640359-4 TE Connectivity AMP Connectors 2-640359-4 -
RFQ
ECAD 8662 0.00000000 TE Connectivity AMP Connectors Diplomate DL Tube Obsolete -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame Solder download Not applicable 1 (Unlimited) Vendor Undefined EAR99 8536.69.4040 23 Thermoplastic UL94 V-0 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 15.0µin (0.38µm) 18 (2 x 9) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.128" (3.24mm) 30mOhm
614-91-648-31-018000 Mill-Max Manufacturing Corp. 614-91-648-31-018000 17.6618
RFQ
ECAD 8276 0.00000000 Mill-Max Manufacturing Corp. 614 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Carrier, Open Frame 614-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
523-93-169-17-101001 Mill-Max Manufacturing Corp. 523-93-169-17-101001 -
RFQ
ECAD 9503 0.00000000 Mill-Max Manufacturing Corp. 523 Bulk Active - Through Hole PGA - 523-93 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 169 (17 x 17) - 0.100" (2.54mm) - 0.510" (12.95mm) -
510-87-209-17-062101 Preci-Dip 510-87-209-17-062101 6.9135
RFQ
ECAD 2197 0.00000000 Preci-Dip 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 209 (17 x 17) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
510-83-101-11-001101 Preci-Dip 510-83-101-11-001101 5.5230
RFQ
ECAD 6851 0.00000000 Preci-Dip 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 19 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 101 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
1109822 Aries Electronics 1109822 -
RFQ
ECAD 1942 0.00000000 Aries Electronics - - Active - - - - - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - - - - - - - - - - - -
110-93-428-61-001000 Mill-Max Manufacturing Corp. 110-93-428-61-001000 21.5161
RFQ
ECAD 3374 0.00000000 Mill-Max Manufacturing Corp. 110 Tube Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing 110-93 Solder - 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
08-0501-30 Aries Electronics 08-0501-30 4.8480
RFQ
ECAD 3605 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 105°C Through Hole SIP - 08-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 30 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 8 (1 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.690" (17.52mm) -
25-0513-10 Aries Electronics 25-0513-10 3.9400
RFQ
ECAD 1 0.00000000 Aries Electronics 0513 Bulk Active - Through Hole SIP - 25-0513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 25 (1 x 25) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
28-6574-11 Aries Electronics 28-6574-11 22.0723
RFQ
ECAD 8656 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 28-6574 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
C9114-00 Aries Electronics C9114-00 -
RFQ
ECAD 1150 0.00000000 Aries Electronics Edge-Grip™, C91 Bulk Obsolete -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame Wire Wrap download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 14 (2 x 7) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.675" (17.15mm) -
24-6551-10 Aries Electronics 24-6551-10 10.9080
RFQ
ECAD 1945 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 24-655 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
28-6553-11 Aries Electronics 28-6553-11 17.6589
RFQ
ECAD 1958 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 28-6553 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 9 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse