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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Accessory Type Color For Use With/Related Products Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Body Material Body Finish Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
115-43-322-41-001000 Mill-Max Manufacturing Corp. 115-43-322-41-001000 13.5076
RFQ
ECAD 2271 0.00000000 Mill-Max Manufacturing Corp. 115 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 115-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 18 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
08-0503-21 Aries Electronics 08-0503-21 6.0640
RFQ
ECAD 5964 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 08-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 8 (1 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
614-13-085-11-041012 Mill-Max Manufacturing Corp. 614-13-085-11-041012 -
RFQ
ECAD 6359 0.00000000 Mill-Max Manufacturing Corp. 614 Bulk Active -55°C ~ 125°C Through Hole PGA Carrier, Open Frame 614-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 85 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.136" (3.45mm) 10mOhm
30-7365-10 Aries Electronics 30-7365-10 15.3841
RFQ
ECAD 5607 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 30-7365 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 30 (1 x 30) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
0475960233 Molex 0475960233 -
RFQ
ECAD 6070 0.00000000 Molex 47596 Tray Obsolete - Surface Mount LGA Open Frame 047596 Solder download ROHS3 Compliant 1 (Unlimited) EAR99 8538.90.8180 240 Thermoplastic UL94 V-0 0.036" (0.91mm) Gold 30.0µin (0.76µm) - - 1155 (40 x 40) Copper Alloy 0.036" (0.91mm) - - -
114-41-964-41-117000 Mill-Max Manufacturing Corp. 114-41-964-41-117000 17.0013
RFQ
ECAD 2277 0.00000000 Mill-Max Manufacturing Corp. 114 Tube Active -55°C ~ 125°C Surface Mount DIP, 0.9" (22.86mm) Row Spacing Open Frame 114-41 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 6 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 64 (2 x 32) Beryllium Copper 0.100" (2.54mm) Brass Alloy - 10mOhm
510-13-223-18-098003 Mill-Max Manufacturing Corp. 510-13-223-18-098003 54.4296
RFQ
ECAD 4051 0.00000000 Mill-Max Manufacturing Corp. 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 223 (18 x 18) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
551-90-209-17-081004 Mill-Max Manufacturing Corp. 551-90-209-17-081004 -
RFQ
ECAD 8974 0.00000000 Mill-Max Manufacturing Corp. 551 Bulk Active - Through Hole PGA Open Frame 551-90 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 200.0µin (5.08µm) 209 (17 x 17) - 0.100" (2.54mm) Brass Alloy 0.154" (3.91mm) -
614-83-318-41-001101 Preci-Dip 614-83-318-41-001101 1.4487
RFQ
ECAD 8716 0.00000000 Preci-Dip 614 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Carrier, Open Frame 614-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 22 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.136" (3.45mm) 10mOhm
299-87-312-11-001101 Preci-Dip 299-87-312-11-001101 3.8200
RFQ
ECAD 966 0.00000000 Preci-Dip 299 Tube Active -55°C ~ 125°C Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame 299-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 35 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 12 (2 x 6) Beryllium Copper 0.100" (2.54mm) Brass 0.128" (3.24mm) 10mOhm
20-537-20 Aries Electronics 20-537-20 16.0152
RFQ
ECAD 2197 0.00000000 Aries Electronics 537 Bulk Active -65°C ~ 260°C - 20-537 Insert Plate Black PLCC Sockets download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8538.90.8180 1 UL94 V-0 Polyphenylene Sulfide (PPS), Glass Filled - 20
146-91-422-41-013000 Mill-Max Manufacturing Corp. 146-91-422-41-013000 13.9644
RFQ
ECAD 8692 0.00000000 Mill-Max Manufacturing Corp. 146 Tube Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame 146-91 Press-Fit download 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 18 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.175" (4.45mm) 10mOhm
14-3508-202 Aries Electronics 14-3508-202 9.0960
RFQ
ECAD 1359 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 14-3508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
244-5205-00 3M 244-5205-00 131.1160
RFQ
ECAD 7534 0.00000000 3M Textool™ Box Active - - - - 244 - - Not Applicable EAR99 8536.69.4040 5 - - - - - - - - - - - - -
124-91-316-41-002000 Mill-Max Manufacturing Corp. 124-91-316-41-002000 16.0300
RFQ
ECAD 3613 0.00000000 Mill-Max Manufacturing Corp. 124 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 124-91 Wire Wrap download 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 25 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.630" (16.00mm) 10mOhm
1106396-40 Aries Electronics 1106396-40 15.8196
RFQ
ECAD 9396 0.00000000 Aries Electronics Correct-A-Chip® 1106396 Bulk Active - Through Hole - 1106396 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) DIP, 0.3" (7.62mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 40 Beryllium Copper 0.100" (2.54mm) Brass 0.130" (3.30mm) -
24-6573-16 Aries Electronics 24-6573-16 34.4582
RFQ
ECAD 2719 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 24-6573 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 24 (2 x 12) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
APA-628-G-M Samtec Inc. APA-628-G-M 16.9700
RFQ
ECAD 7037 0.00000000 Samtec Inc. APA Tube Active - Through Hole - Open Frame APA-628 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 15 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 20.0µin (0.51µm) 28 (2 x 14) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
08-3518-01 Aries Electronics 08-3518-01 3.5350
RFQ
ECAD 7328 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 08-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
510-41-132-14-071001 Mill-Max Manufacturing Corp. 510-41-132-14-071001 28.3624
RFQ
ECAD 8864 0.00000000 Mill-Max Manufacturing Corp. 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-41 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) - - - - 132 (14 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
126-91-304-41-003000 Mill-Max Manufacturing Corp. 126-91-304-41-003000 8.6572
RFQ
ECAD 3399 0.00000000 Mill-Max Manufacturing Corp. 126 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 126-91 Wire Wrap download 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 102 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 4 (2 x 2) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.661" (16.79mm) 10mOhm
124-43-952-41-002000 Mill-Max Manufacturing Corp. 124-43-952-41-002000 23.6977
RFQ
ECAD 1526 0.00000000 Mill-Max Manufacturing Corp. 124 Tube Active -55°C ~ 125°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Open Frame 124-43 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 52 (2 x 26) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.630" (16.00mm) 10mOhm
510-93-085-13-081003 Mill-Max Manufacturing Corp. 510-93-085-13-081003 28.0532
RFQ
ECAD 8901 0.00000000 Mill-Max Manufacturing Corp. 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 85 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
104-13-648-41-770000 Mill-Max Manufacturing Corp. 104-13-648-41-770000 18.9163
RFQ
ECAD 2908 0.00000000 Mill-Max Manufacturing Corp. 104 Tube Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 104-13 Press-Fit download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 3 A Thermoplastic - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.175" (4.45mm) -
522-93-281-19-081003 Mill-Max Manufacturing Corp. 522-93-281-19-081003 -
RFQ
ECAD 6590 0.00000000 Mill-Max Manufacturing Corp. 522 Bulk Active - Through Hole PGA - 522-93 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 281 (19 x 19) - 0.100" (2.54mm) - 0.370" (9.40mm) -
614-13-209-17-081001 Mill-Max Manufacturing Corp. 614-13-209-17-081001 -
RFQ
ECAD 5138 0.00000000 Mill-Max Manufacturing Corp. 614 Bulk Active -55°C ~ 125°C Through Hole PGA Carrier, Open Frame 614-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 209 (17 x 17) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.165" (4.19mm) 10mOhm
20-7636-10 Aries Electronics 20-7636-10 11.5988
RFQ
ECAD 7710 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 20-7636 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 20 (1 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
30-1518-10 Aries Electronics 30-1518-10 2.7876
RFQ
ECAD 6005 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.2" (5.08mm) Row Spacing Open Frame 30-1518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 30 (2 x 15) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
251050-001 MACOM Technology Solutions 251050-001 8.2189
RFQ
ECAD 1808 0.00000000 MACOM Technology Solutions * Bulk Active 251050 - ROHS3 Compliant 1 (Unlimited) 1
522-41-132-14-071001 Mill-Max Manufacturing Corp. 522-41-132-14-071001 -
RFQ
ECAD 4620 0.00000000 Mill-Max Manufacturing Corp. 522 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 522-41 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) - - - - 132 (14 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) 10mOhm
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse