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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance
ICA-308-ATT Samtec Inc. ICA-308-ATT 2.7361
RFQ
ECAD 2043 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-308-ATT 56 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
317-93-107-41-005000 Mill-Max Manufacturing Corp. 317-93-107-41-005000 12.4758
RFQ
ECAD 8455 0.00000000 Mill-Max Manufacturing Corp. 317 Bulk Active -55°C ~ 125°C Through Hole SIP - 317-93 Solder download 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 40 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 7 (1 x 7) Beryllium Copper 0.070" (1.78mm) Brass Alloy 0.125" (3.18mm) 10mOhm
ICO-624-ZAGT Samtec Inc. ICO-624-ZAGT 8.5300
RFQ
ECAD 2563 0.00000000 Samtec Inc. ICO Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICO-624-ZAGT 18 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
44-3554-11 Aries Electronics 44-3554-11 27.2591
RFQ
ECAD 8282 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 44-3554 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold - Gold - 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
518-77-360M19-001105 Preci-Dip 518-77-360M19-001105 51.1725
RFQ
ECAD 4829 0.00000000 Preci-Dip 518 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 518-77 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 21 1 A FR4 Epoxy Glass UL94 V-0 0.050" (1.27mm) Gold Flash Gold Flash 360 (19 x 19) Beryllium Copper 0.050" (1.27mm) Brass 0.110" (2.78mm) 10mOhm
44-6572-10 Aries Electronics 44-6572-10 20.1743
RFQ
ECAD 9982 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 44-6572 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
114-PRS13021-16 Aries Electronics 114-PRS13021-16 -
RFQ
ECAD 3757 0.00000000 Aries Electronics PRS Bulk Obsolete -65°C ~ 200°C Through Hole PGA, ZIF (ZIP) Closed Frame Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze 50.0µin (1.27µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
208-PRS17017-12 Aries Electronics 208-PRS17017-12 111.6725
RFQ
ECAD 7407 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 208-PRS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
0473370001 Molex 0473370001 -
RFQ
ECAD 2641 0.00000000 Molex 47337 Tape & Reel (TR) Obsolete -55°C ~ 85°C Surface Mount Camera Socket Open Frame 047337 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 4,800 0.5 A Polyamide (PA), Nylon UL94 V-0 0.035" (0.90mm) Gold 12.0µin (0.30µm) Gold Flash 24 (4 x 6) Copper Alloy 0.035" (0.90mm) Copper Alloy - -
400-032-000 3M 400-032-000 -
RFQ
ECAD 2553 0.00000000 3M 400 - Obsolete - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame - - RoHS non-compliant 1 (Unlimited) EAR99 8536.69.4040 200 - - 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 8.00µin (0.203µm) 32 (2 x 16) - 0.100" (2.54mm) - - -
515-93-240-17-061001 Mill-Max Manufacturing Corp. 515-93-240-17-061001 -
RFQ
ECAD 6032 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 240 (17 x 17) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
523-13-256-16-000002 Mill-Max Manufacturing Corp. 523-13-256-16-000002 -
RFQ
ECAD 7280 0.00000000 Mill-Max Manufacturing Corp. 523 Bulk Active - Through Hole PGA - 523-13 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 256 (16 x 16) - 0.100" (2.54mm) - 0.510" (12.95mm) -
511-91-081-12-071003 Mill-Max Manufacturing Corp. 511-91-081-12-071003 -
RFQ
ECAD 1432 0.00000000 Mill-Max Manufacturing Corp. 511 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 511-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 81 (12 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
511-93-045-08-005002 Mill-Max Manufacturing Corp. 511-93-045-08-005002 -
RFQ
ECAD 5692 0.00000000 Mill-Max Manufacturing Corp. 511 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 511-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 45 (8 x 8) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
116-83-610-41-002101 Preci-Dip 116-83-610-41-002101 1.1914
RFQ
ECAD 2101 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Elevated, Open Frame 116-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 42 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
116-43-432-41-007000 Mill-Max Manufacturing Corp. 116-43-432-41-007000 15.9302
RFQ
ECAD 5965 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Elevated, Open Frame 116-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.402" (10.21mm) 10mOhm
4832-6000-CP 3M 4832-6000-CP 1.0900
RFQ
ECAD 496 0.00000000 3M 4800 Tube Active -25°C ~ 85°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 4832 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 12 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 35.4µin (0.90µm) Tin 35.0µin (0.90µm) 32 (2 x 16) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
26-0501-20 Aries Electronics 26-0501-20 13.2236
RFQ
ECAD 2572 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 105°C Through Hole SIP - 26-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 26 (1 x 26) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.420" (10.67mm) -
48-6574-16 Aries Electronics 48-6574-16 55.5400
RFQ
ECAD 8150 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 48-6574 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
614-43-314-31-007000 Mill-Max Manufacturing Corp. 614-43-314-31-007000 14.1618
RFQ
ECAD 4050 0.00000000 Mill-Max Manufacturing Corp. 614 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Carrier, Open Frame 614-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 28 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.146" (3.71mm) 10mOhm
48-3570-11 Aries Electronics 48-3570-11 34.1150
RFQ
ECAD 2135 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 48-3570 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 6 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
515-91-121-15-061002 Mill-Max Manufacturing Corp. 515-91-121-15-061002 -
RFQ
ECAD 1419 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 121 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
24-822-90C Aries Electronics 24-822-90C 10.7988
RFQ
ECAD 7471 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active -55°C ~ 105°C Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame 24-822 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
ICF-628-TM-O Samtec Inc. ICF-628-TM-O 4.4706
RFQ
ECAD 9945 0.00000000 Samtec Inc. ICF Tube Active -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-628-TM-O 16 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Tin - Tin - 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
100-PLS10001-12 Aries Electronics 100-PLS10001-12 76.5100
RFQ
ECAD 8651 0.00000000 Aries Electronics PLS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 100-PLS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
114-83-624-41-117101 Preci-Dip 114-83-624-41-117101 1.6050
RFQ
ECAD 8688 0.00000000 Preci-Dip 114 Bulk Active -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Open Frame 114-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 17 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.047" (1.20mm) 10mOhm
28-C212-30 Aries Electronics 28-C212-30 18.4726
RFQ
ECAD 9614 0.00000000 Aries Electronics EJECT-A-DIP™ Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 28-C212 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.040" (1.02mm) -
APO-628-G-A Samtec Inc. APO-628-G-A 14.6400
RFQ
ECAD 2140 0.00000000 Samtec Inc. APO Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-APO-628-G-A 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 28 (2 x 14) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
510-87-012-05-001101 Preci-Dip 510-87-012-05-001101 0.3607
RFQ
ECAD 7542 0.00000000 Preci-Dip 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 42 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 12 (5 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
ICA-624-SGG-L Samtec Inc. ICA-624-SGG-L 7.9656
RFQ
ECAD 9230 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-624-SGG-L 18 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse