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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Accessory Type Color For Use With/Related Products Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Body Material Body Finish Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance
48-6518-10E Aries Electronics 48-6518-10E 15.9590
RFQ
ECAD 3911 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 48-6518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
111-93-642-61-001000 Mill-Max Manufacturing Corp. 111-93-642-61-001000 23.8704
RFQ
ECAD 4473 0.00000000 Mill-Max Manufacturing Corp. 111 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 111-93 Solder - 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 9 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) -
12-810-90C Aries Electronics 12-810-90C 13.0200
RFQ
ECAD 226 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Vertical DIP, 0.3" (7.62mm) Row Spacing Closed Frame 12-810 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 12 (2 x 6) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
714-43-218-31-018000 Mill-Max Manufacturing Corp. 714-43-218-31-018000 5.8300
RFQ
ECAD 3250 0.00000000 Mill-Max Manufacturing Corp. 714 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.1" (2.54mm) Row Spacing Carrier, Closed Frame 714-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected ED1307-18 EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) -
510-93-022-05-001002 Mill-Max Manufacturing Corp. 510-93-022-05-001002 20.7358
RFQ
ECAD 2063 0.00000000 Mill-Max Manufacturing Corp. 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 22 (5 x 5) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
32-6553-11 Aries Electronics 32-6553-11 16.2969
RFQ
ECAD 2586 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 32-6553 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
34-0508-30 Aries Electronics 34-0508-30 13.2183
RFQ
ECAD 6201 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole SIP - 34-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 34 (1 x 34) Beryllium Copper - Brass 0.500" (12.70mm) -
551-10-032-09-041004 Mill-Max Manufacturing Corp. 551-10-032-09-041004 -
RFQ
ECAD 3646 0.00000000 Mill-Max Manufacturing Corp. 551 Bulk Active - Through Hole PGA Open Frame 551-10 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 32 (9 x 9) - 0.100" (2.54mm) Brass Alloy 0.154" (3.91mm) -
612-91-628-41-001000 Mill-Max Manufacturing Corp. 612-91-628-41-001000 15.4318
RFQ
ECAD 1351 0.00000000 Mill-Max Manufacturing Corp. 612 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Carrier, Open Frame 612-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.124" (3.15mm) 10mOhm
1981467-1 TE Connectivity AMP Connectors 1981467-1 -
RFQ
ECAD 5235 0.00000000 TE Connectivity AMP Connectors - Bulk Active - - 1981467 Backplate Silver LGA1366 Sockets download ROHS3 Compliant 1 (Unlimited) Vendor Undefined EAR99 8538.90.8180 200 - Steel Nickel
2225-9028-00-2421 3M 2225-9028-00-2421 -
RFQ
ECAD 3656 0.00000000 3M Textool™ Bulk Obsolete - - - - - download Not Applicable OBSOLETE 5 - - - - - - - - - - - - -
515-13-059-11-001001 Mill-Max Manufacturing Corp. 515-13-059-11-001001 -
RFQ
ECAD 2525 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 59 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
APA-422-G-K Samtec Inc. APA-422-G-K -
RFQ
ECAD 3142 0.00000000 Samtec Inc. APA Bulk Active - Through Hole - Open Frame APA-422 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 20.0µin (0.51µm) 22 (2 x 11) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
110-99-318-61-001000 Mill-Max Manufacturing Corp. 110-99-318-61-001000 16.7741
RFQ
ECAD 1439 0.00000000 Mill-Max Manufacturing Corp. 110 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing 110-99 Solder - 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 22 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 200.0µin (5.08µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
116-91-320-41-006000 Mill-Max Manufacturing Corp. 116-91-320-41-006000 13.7703
RFQ
ECAD 8611 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-91 Solder download 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 20 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.236" (5.99mm) 10mOhm
19-7400-10 Aries Electronics 19-7400-10 12.7829
RFQ
ECAD 5742 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 19-7400 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 19 (1 x 19) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
12-7550-10 Aries Electronics 12-7550-10 8.7507
RFQ
ECAD 5572 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 12-7550 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 12 (1 x 12) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
2225-6317-9UA-1902 3M 2225-6317-9UA-1902 -
RFQ
ECAD 9387 0.00000000 3M Textool™ Bulk Obsolete -55°C ~ 150°C Through Hole PGA, ZIF (ZIP) Closed Frame Solder download Not Applicable OBSOLETE 1 1 A Polyethersulfone (PES) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 225 (15 x 15) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
551-90-323-21-005003 Mill-Max Manufacturing Corp. 551-90-323-21-005003 -
RFQ
ECAD 7954 0.00000000 Mill-Max Manufacturing Corp. 551 Bulk Active - Through Hole PGA - 551-90 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 200.0µin (5.08µm) 323 (21 x 21) - 0.100" (2.54mm) Brass Alloy 0.154" (3.91mm) -
24-C212-00 Aries Electronics 24-C212-00 11.2717
RFQ
ECAD 9545 0.00000000 Aries Electronics EJECT-A-DIP™ Bulk Active -55°C ~ 105°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Closed Frame 24-C212 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.040" (1.02mm) -
551-10-085-13-081005 Mill-Max Manufacturing Corp. 551-10-085-13-081005 -
RFQ
ECAD 8865 0.00000000 Mill-Max Manufacturing Corp. 551 Bulk Active - Through Hole PGA - 551-10 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 85 (13 x 13) - 0.100" (2.54mm) Brass Alloy 0.154" (3.91mm) -
1-1437504-6 TE Connectivity AMP Connectors 1-1437504-6 -
RFQ
ECAD 7057 0.00000000 TE Connectivity AMP Connectors 8060 - Obsolete - - Transistor, TO-5 - 1437504 Solder download RoHS Compliant 1 (Unlimited) Vendor Undefined EAR99 8536.69.4040 400 - - - Gold - - - 3 (Round) - - - - -
240-4205-01 3M 240-4205-01 -
RFQ
ECAD 8789 0.00000000 3M Textool™ Box Active - - - - 240 - - Not Applicable EAR99 8536.69.4040 5 - - - - - - - - - - - - -
116-87-328-41-001101 Preci-Dip 116-87-328-41-001101 3.4725
RFQ
ECAD 8092 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
110-43-650-41-001000 Mill-Max Manufacturing Corp. 110-43-650-41-001000 16.1948
RFQ
ECAD 7834 0.00000000 Mill-Max Manufacturing Corp. 110 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 110-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 50 (2 x 25) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
ICF-322-T-I Samtec Inc. ICF-322-T-I 3.5080
RFQ
ECAD 9554 0.00000000 Samtec Inc. ICF Tube Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-322-T-I 20 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Tin - Tin - 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
511-93-168-17-105002 Mill-Max Manufacturing Corp. 511-93-168-17-105002 -
RFQ
ECAD 5886 0.00000000 Mill-Max Manufacturing Corp. 511 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 511-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 168 (17 x 17) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
SMPX-52LCC-N-TR Kycon, Inc. SMPX-52LCC-N-TR 1.7770
RFQ
ECAD 7514 0.00000000 Kycon, Inc. SMPX Tape & Reel (TR) Active -50°C ~ 105°C Surface Mount PLCC Closed Frame SMPX-52L Solder download RoHS Compliant 1 (Unlimited) 2092-SMPX-52LCC-N-TR EAR99 8536.69.4040 340 1 A Thermoplastic, Glass Filled - 0.050" (1.27mm) Tin 160.0µin (4.06µm) Tin - 52 (4 x 13) Phosphor Bronze 0.050" (1.27mm) Phosphor Bronze - 15mOhm
79300-17-011 3M 79300-17-011 -
RFQ
ECAD 3881 0.00000000 3M - Bulk Obsolete - - - - - - Not Applicable OBSOLETE 20 - - - - - - - - - - - - -
08-0517-90C Aries Electronics 08-0517-90C 2.7876
RFQ
ECAD 5573 0.00000000 Aries Electronics 0517 Bulk Active - Through Hole, Right Angle SIP - 08-0517 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 - Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 8 (1 x 8) Beryllium Copper - Brass 0.125" (3.18mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse