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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
551-90-101-13-061003 Mill-Max Manufacturing Corp. 551-90-101-13-061003 -
RFQ
ECAD 8486 0.00000000 Mill-Max Manufacturing Corp. 551 Tube Active - Through Hole PGA Open Frame 551-90 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 200.0µin (5.08µm) 101 (13 x 13) - 0.100" (2.54mm) Brass Alloy 0.154" (3.91mm) -
248-1282-19-0602J 3M 248-1282-19-0602J -
RFQ
ECAD 9737 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 248 Wire Wrap download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 48 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.620" (15.75mm) -
116-83-652-41-009101 Preci-Dip 116-83-652-41-009101 8.1986
RFQ
ECAD 7483 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Elevated, Open Frame 116-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 52 (2 x 26) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
511-91-085-11-041003 Mill-Max Manufacturing Corp. 511-91-085-11-041003 -
RFQ
ECAD 3298 0.00000000 Mill-Max Manufacturing Corp. 511 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 511-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 85 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
104-13-648-41-780000 Mill-Max Manufacturing Corp. 104-13-648-41-780000 19.7359
RFQ
ECAD 6487 0.00000000 Mill-Max Manufacturing Corp. 104 Tube Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 104-13 Press-Fit download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 3 A Thermoplastic - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.250" (6.35mm) -
24-81000-310C Aries Electronics 24-81000-310C 14.1819
RFQ
ECAD 5407 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 24-8100 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
04-0508-31 Aries Electronics 04-0508-31 2.9492
RFQ
ECAD 3772 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole SIP - 04-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 4 (1 x 4) Beryllium Copper - Brass 0.500" (12.70mm) -
110-88-640-41-530000 Mill-Max Manufacturing Corp. 110-88-640-41-530000 -
RFQ
ECAD 3033 0.00000000 Mill-Max Manufacturing Corp. 110 Tube Obsolete -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 110-88 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) - - - - 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
110-13-318-61-001000 Mill-Max Manufacturing Corp. 110-13-318-61-001000 16.7741
RFQ
ECAD 8286 0.00000000 Mill-Max Manufacturing Corp. 110 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 110-13 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 22 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) -
612-83-306-41-001101 Preci-Dip 612-83-306-41-001101 0.4779
RFQ
ECAD 5198 0.00000000 Preci-Dip 612 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Carrier, Open Frame 612-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 69 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) Brass 0.291" (7.39mm) 10mOhm
42-3575-11 Aries Electronics 42-3575-11 31.5623
RFQ
ECAD 5199 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 42-3575 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
510-87-084-13-082101 Preci-Dip 510-87-084-13-082101 2.8628
RFQ
ECAD 9317 0.00000000 Preci-Dip 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 84 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
917-87-208-41-005101 Preci-Dip 917-87-208-41-005101 1.0413
RFQ
ECAD 4220 0.00000000 Preci-Dip 917 Bulk Active -55°C ~ 125°C Through Hole Transistor, TO-5 - 917-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 490 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 - Gold Flash Tin - 8 (Round) Beryllium Copper - Brass 0.125" (3.18mm) 10mOhm
614-87-648-41-001101 Preci-Dip 614-87-648-41-001101 3.1856
RFQ
ECAD 1263 0.00000000 Preci-Dip 614 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Carrier, Open Frame 614-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Brass 0.136" (3.45mm) 10mOhm
110-88-964-41-530000 Mill-Max Manufacturing Corp. 110-88-964-41-530000 -
RFQ
ECAD 5423 0.00000000 Mill-Max Manufacturing Corp. 110 Bulk Obsolete -55°C ~ 125°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Open Frame 110-88 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 6 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) - - - - 64 (2 x 32) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
522-93-073-11-042003 Mill-Max Manufacturing Corp. 522-93-073-11-042003 -
RFQ
ECAD 6486 0.00000000 Mill-Max Manufacturing Corp. 522 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 522-93 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 73 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) 10mOhm
24-3518-101H Aries Electronics 24-3518-101H 5.5267
RFQ
ECAD 9111 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 24-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
32-8240-610C Aries Electronics 32-8240-610C 17.0654
RFQ
ECAD 8655 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated 32-8240 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
515-91-155-18-121003 Mill-Max Manufacturing Corp. 515-91-155-18-121003 -
RFQ
ECAD 6962 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 155 (18 x 18) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
32-9513-10T Aries Electronics 32-9513-10T 5.4308
RFQ
ECAD 8770 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Closed Frame 32-9513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
551-10-085-11-041004 Mill-Max Manufacturing Corp. 551-10-085-11-041004 -
RFQ
ECAD 9990 0.00000000 Mill-Max Manufacturing Corp. 551 Tube Active - Through Hole PGA Open Frame 551-10 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 18 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 85 (11 x 11) - 0.100" (2.54mm) Brass Alloy 0.154" (3.91mm) -
551-10-064-10-051005 Mill-Max Manufacturing Corp. 551-10-064-10-051005 -
RFQ
ECAD 7023 0.00000000 Mill-Max Manufacturing Corp. 551 Bulk Active - Through Hole PGA - 551-10 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 64 (10 x 10) - 0.100" (2.54mm) Brass Alloy 0.154" (3.91mm) -
126-43-652-41-002000 Mill-Max Manufacturing Corp. 126-43-652-41-002000 23.0250
RFQ
ECAD 3500 0.00000000 Mill-Max Manufacturing Corp. 126 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 126-43 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 52 (2 x 26) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.543" (13.79mm) 10mOhm
522-93-052-09-045001 Mill-Max Manufacturing Corp. 522-93-052-09-045001 -
RFQ
ECAD 8550 0.00000000 Mill-Max Manufacturing Corp. 522 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 522-93 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 52 (9 x 9) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) 10mOhm
614-93-169-13-000012 Mill-Max Manufacturing Corp. 614-93-169-13-000012 -
RFQ
ECAD 8104 0.00000000 Mill-Max Manufacturing Corp. 614 Bulk Active -55°C ~ 125°C Through Hole PGA Carrier, Open Frame 614-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 169 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.136" (3.45mm) 10mOhm
D73064-42 Harwin Inc. D73064-42 -
RFQ
ECAD 9182 0.00000000 Harwin Inc. D73064 Tube Obsolete -55°C ~ 125°C Through Hole DIP, Staggered Open Frame Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold - Tin 196.9µin (5.00µm) 64 (2 x 32) Beryllium Copper 0.100" (2.54mm) Brass 0.126" (3.20mm) 10mOhm
18-354000-21-RC Aries Electronics 18-354000-21-RC -
RFQ
ECAD 8925 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 18-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 18 Beryllium Copper 0.050" (1.27mm) Brass 0.089" (2.28mm) -
127-43-428-41-002000 Mill-Max Manufacturing Corp. 127-43-428-41-002000 15.1697
RFQ
ECAD 7345 0.00000000 Mill-Max Manufacturing Corp. 127 Tube Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame 127-43 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 20 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.070" (1.78mm) Brass Alloy 0.370" (9.40mm) 10mOhm
515-13-177-15-061001 Mill-Max Manufacturing Corp. 515-13-177-15-061001 -
RFQ
ECAD 4838 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 177 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
558-10-360M19-001101 Preci-Dip 558-10-360M19-001101 50.0346
RFQ
ECAD 7509 0.00000000 Preci-Dip 558 Bulk Active -55°C ~ 125°C Through Hole PGA Closed Frame 558-10 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 21 1 A FR4 Epoxy Glass UL94 V-0 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 360 (19 x 19) Beryllium Copper 0.050" (1.27mm) Brass 0.111" (2.83mm) 10mOhm
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse