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Sockets for ICs, Transistors(23290)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Type | Features | Base Product Number | Termination | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Current Rating (Amps) | Housing Material | Material Flammability Rating | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Convert From (Adapter End) | Convert To (Adapter End) | Number of Pins | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Material - Post | Termination Post Length | Contact Resistance | Board Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
18-8700-610C | 11.6535 |  |
8600 | 0.00000000 | Aries Electronics | 8 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame, Elevated | 18-8700 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 18 (2 x 9) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | ||||||
|
514-87-068-10-001117 | 6.2791 | |
6156 | 0.00000000 | Preci-Dip | 514 | Bulk | Active | -55°C ~ 125°C | Surface Mount | PGA | Open Frame | 514-87 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 21 | 1 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | Flash | Tin | - | 68 (10 x 10) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.055" (1.40mm) | 10mOhm | ||||||
|
2A8-4204-00 | - | |
5899 | 0.00000000 | 3M | Textool™ | Box | Discontinued at SIC | - | - | - | - | 2A8 | - | - | Not Applicable | EAR99 | 8536.69.4040 | 5 | - | - | - | - | - | - | - | - | - | - | - | - | - | |||||||||
 |
714-43-242-31-018000 | 11.9600 | |
5478 | 0.00000000 | Mill-Max Manufacturing Corp. | 714 | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.1" (2.54mm) Row Spacing | Carrier, Closed Frame | 714-43 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | ED1307-42 | EAR99 | 8536.69.4040 | 1 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 30.0µin (0.76µm) | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | 0.170" (4.32mm) | - | |||||
|
20-7354-10 | 11.5988 | |
1817 | 0.00000000 | Aries Electronics | 700 Elevator Strip-Line™ | Bulk | Active | -55°C ~ 105°C | Through Hole | SIP | Elevated | 20-7354 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1.5 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 20 (1 x 20) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.150" (3.81mm) | - | ||||||
|
24-6571-10 | 13.5972 | |
5595 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 24-6571 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 12 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||
|
551-90-159-16-105004 | - | |
8163 | 0.00000000 | Mill-Max Manufacturing Corp. | 551 | Bulk | Active | - | Through Hole | PGA | - | 551-90 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Tin-Lead | 200.0µin (5.08µm) | 159 (16 x 16) | - | 0.100" (2.54mm) | Brass Alloy | 0.154" (3.91mm) | - | |||||||
|
511-93-169-13-000003 | - | |
2927 | 0.00000000 | Mill-Max Manufacturing Corp. | 511 | Bulk | Active | -55°C ~ 125°C | Through Hole | PGA | Closed Frame | 511-93 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 200.0µin (5.08µm) | 169 (13 x 13) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | 0.170" (4.32mm) | 10mOhm | ||||||
|
515-13-128-13-041001 | - | |
1899 | 0.00000000 | Mill-Max Manufacturing Corp. | 515 | Bulk | Active | -55°C ~ 125°C | Through Hole | PGA | Open Frame | 515-13 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 128 (13 x 13) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | 0.108" (2.74mm) | 10mOhm | ||||||
|
28-650000-10-P | - | |
4324 | 0.00000000 | Aries Electronics | Correct-A-Chip® 650000 | Bulk | Discontinued at SIC | - | Through Hole | - | 28-650 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 84 | - | - | 0.050" (1.27mm) | - | - | Tin-Lead | - | SOIC | DIP, 0.6" (15.24mm) Row Spacing | 28 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | ||||||
 |
614-43-318-31-012000 | 4.7700 | |
52 | 0.00000000 | Mill-Max Manufacturing Corp. | 614 | Tube | Active | -55°C ~ 125°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Carrier, Open Frame | 614-43 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 22 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 18 (2 x 9) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | 0.136" (3.45mm) | - | ||||||
|
06-0518-11 | 0.8363 | |
4304 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Through Hole | SIP | Open Frame | 06-0518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 6 (1 x 6) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||
|
14-3513-10 | 1.5928 | |
3033 | 0.00000000 | Aries Electronics | Lo-PRO®file, 513 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame | 14-3513 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 25 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||
|
515-93-144-12-000003 | - | |
4504 | 0.00000000 | Mill-Max Manufacturing Corp. | 515 | Bulk | Active | -55°C ~ 125°C | Through Hole | PGA | Closed Frame | 515-93 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 200.0µin (5.08µm) | 144 (12 x 12) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | 0.108" (2.74mm) | 10mOhm | ||||||
 |
116-87-314-41-008101 | 1.3168 | |
9711 | 0.00000000 | Preci-Dip | 116 | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Elevated, Open Frame | 116-87 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 30 | 1 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | Flash | Tin | - | 14 (2 x 7) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | 10mOhm | ||||||
 |
122-83-432-41-001101 | 3.9119 | |
1605 | 0.00000000 | Preci-Dip | 122 | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.4" (10.16mm) Row Spacing | Open Frame | 122-83 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 13 | 1 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | - | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.370" (9.40mm) | 10mOhm | ||||||
 |
ICF-308-T-O | 1.9100 | |
69 | 0.00000000 | Samtec Inc. | iCF | Tube | Active | -55°C ~ 125°C | Surface Mount | DIP, 0.3" (7.62mm) Row Spacing | Open Frame | ICF-308 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Affected | SAM9534 | EAR99 | 8536.69.4040 | 56 | Liquid Crystal Polymer (LCP) | - | 0.100" (2.54mm) | Tin | - | Tin | - | 8 (2 x 4) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | - | 10mOhm | ||||||
|
510-87-241-18-071101 | 7.9725 | |
8300 | 0.00000000 | Preci-Dip | 510 | Bulk | Active | -55°C ~ 125°C | Through Hole | PGA | Open Frame | 510-87 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 11 | 1 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | Flash | Tin | - | 241 (18 x 18) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | 10mOhm | ||||||
|
510-87-180-18-111101 | 5.9546 | |
8287 | 0.00000000 | Preci-Dip | 510 | Bulk | Active | -55°C ~ 125°C | Through Hole | PGA | Open Frame | 510-87 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 11 | 1 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | Flash | Tin | - | 180 (18 x 18) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | 10mOhm | ||||||
 |
2-640464-4 | - | |
3388 | 0.00000000 | TE Connectivity AMP Connectors | Diplomate DL | Tube | Obsolete | -55°C ~ 125°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame | 640464 | Solder | download | Not applicable | 1 (Unlimited) | Vendor Undefined | EAR99 | 8536.69.4040 | 2,100 | Thermoplastic, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 15.0µin (0.38µm) | 20 (2 x 10) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.128" (3.24mm) | 30mOhm | |||||||
|
523-93-121-15-061003 | - | |
5843 | 0.00000000 | Mill-Max Manufacturing Corp. | 523 | Bulk | Active | - | Through Hole | PGA | - | 523-93 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 200.0µin (5.08µm) | 121 (15 x 15) | - | 0.100" (2.54mm) | - | 0.510" (12.95mm) | - | |||||||
|
551-10-097-11-041004 | - | |
3832 | 0.00000000 | Mill-Max Manufacturing Corp. | 551 | Bulk | Active | - | Through Hole | PGA | Open Frame | 551-10 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 97 (11 x 11) | - | 0.100" (2.54mm) | Brass Alloy | 0.154" (3.91mm) | - | |||||||
|
515-93-209-17-081003 | - | |
6544 | 0.00000000 | Mill-Max Manufacturing Corp. | 515 | Bulk | Active | -55°C ~ 125°C | Through Hole | PGA | Open Frame | 515-93 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 200.0µin (5.08µm) | 209 (17 x 17) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | 0.108" (2.74mm) | 10mOhm | ||||||
 |
116-83-424-41-001101 | 3.7834 | |
3066 | 0.00000000 | Preci-Dip | 116 | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.4" (10.16mm) Row Spacing | Elevated, Open Frame | 116-83 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 17 | 1 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | - | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | 10mOhm | ||||||
|
146-93-320-41-012000 | 14.0245 | |
1973 | 0.00000000 | Mill-Max Manufacturing Corp. | 146 | Tube | Active | -55°C ~ 125°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Open Frame | 146-93 | Press-Fit | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 20 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 200.0µin (5.08µm) | 20 (2 x 10) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | 0.120" (3.05mm) | - | ||||||
 |
117-43-668-41-005000 | 11.5500 | |
198 | 0.00000000 | Mill-Max Manufacturing Corp. | 117 | Tube | Active | -55°C ~ 125°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 117-43 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 8 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | UL94 V-0 | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 68 (2 x 34) | Beryllium Copper | 0.070" (1.78mm) | Brass Alloy | 0.125" (3.18mm) | - | ||||||
|
44-3551-18 | 153.9971 | |
8998 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | -55°C ~ 250°C | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 44-3551 | Solder | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyetheretherketone (PEEK), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 44 (2 x 22) | Beryllium Nickel | 0.100" (2.54mm) | Beryllium Nickel | 0.110" (2.78mm) | - | ||||||
 |
116-87-210-41-004101 | 1.8016 | |
3503 | 0.00000000 | Preci-Dip | 116 | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.2" (5.08mm) Row Spacing | Elevated, Open Frame | 116-87 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 390 | 1 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | Flash | Tin | - | 10 (2 x 5) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | 10mOhm | ||||||
|
40-C300-21 | 31.0879 | |
5258 | 0.00000000 | Aries Electronics | EJECT-A-DIP™ | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 40-C300 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.040" (1.02mm) | - | ||||||
|
214-44-318-01-670799 | 3.8214 | |
8555 | 0.00000000 | Mill-Max Manufacturing Corp. | 214 | Tape & Reel (TR) | Active | -55°C ~ 125°C | Surface Mount | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame | 214-44 | Solder | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 54-214-44-318-01-670799TR | EAR99 | 8536.69.4040 | 750 | 3 A | Polyamide (PA46), Nylon 4/6 | UL94 V-0 | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | Tin | 200.0µin (5.08µm) | 18 (2 x 9) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | 0.056" (1.42mm) | - |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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