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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
08-301296-10 Aries Electronics 08-301296-10 14.3910
RFQ
ECAD 6753 0.00000000 Aries Electronics Correct-A-Chip® 301296 Bulk Active - Through Hole - 08-3012 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC JEDEC 8 - - Brass 0.125" (3.18mm) FR4 Epoxy Glass
LCQT-QFP0.8-32 Aries Electronics LCQT-QFP0.8-32 10.6353
RFQ
ECAD 6452 0.00000000 Aries Electronics Correct-A-Chip® Tube Active -55°C ~ 125°C Through Hole - LCQT-QF Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected A866AR EAR99 8536.69.4040 15 Polyester UL94 V-0 0.031" (0.80mm) - - Gold Flash Multiple Packages QFP 32 - 0.100" (2.54mm) Brass 0.236" (6.00mm) FR4 Epoxy Glass
1111163 Aries Electronics 1111163 -
RFQ
ECAD 5673 0.00000000 Aries Electronics Correct-A-Chip® 1111163 Bulk Active - - - 1111163 - download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 - Gold 10.0µin (0.25µm) - - Socket, 0.6" (15.24mm) Row Spacing PLCC 40 Brass - - - FR4 Epoxy Glass
28-354000-11-RC Aries Electronics 28-354000-11-RC 30.1064
RFQ
ECAD 1406 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 28-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 - Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 28 Beryllium Copper 0.100" (2.54mm) Brass 0.030" (0.76mm) -
28-354000-20 Aries Electronics 28-354000-20 30.1064
RFQ
ECAD 4831 0.00000000 Aries Electronics Correct-A-Chip® 354000 Tube Active - Surface Mount - 28-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected 28-354000-20-NDR EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 - Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 28 Beryllium Copper 0.100" (2.54mm) Brass - -
10-7410-10 Aries Electronics 10-7410-10 9.1628
RFQ
ECAD 3287 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 10-7410 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 10 (1 x 10) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
08-71000-10 Aries Electronics 08-71000-10 6.4479
RFQ
ECAD 9069 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 08-7100 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 30 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 8 (1 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
28-450001-11-RC Aries Electronics 28-450001-11-RC 85.2557
RFQ
ECAD 7874 0.00000000 Aries Electronics Correct-A-Chip® 450001 Bulk Active - Through Hole - 28-4500 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 - - 0.050" (1.27mm) Gold - Gold 10.0µin (0.25µm) SOJ DIP, 0.4" (10.16mm) Row Spacing 28 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
24-0513-11 Aries Electronics 24-0513-11 5.3732
RFQ
ECAD 5159 0.00000000 Aries Electronics 0513 Bulk Active - Through Hole SIP - 24-0513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 24 (1 x 24) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
32-450001-10-P Aries Electronics 32-450001-10-P -
RFQ
ECAD 8300 0.00000000 Aries Electronics Correct-A-Chip® 450001 Bulk Discontinued at SIC - Through Hole - 32-4500 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 96 - - 0.050" (1.27mm) - - - - SOJ DIP, 0.4" (10.16mm) Row Spacing 32 - 0.100" (2.54mm) - 0.125" (3.18mm) FR4 Epoxy Glass
19-0503-20 Aries Electronics 19-0503-20 9.2689
RFQ
ECAD 5682 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 19-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 19 (1 x 19) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
16-3508-211 Aries Electronics 16-3508-211 14.8963
RFQ
ECAD 2481 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 16-3508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
08-8690-310C Aries Electronics 08-8690-310C 6.4842
RFQ
ECAD 4993 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 08-8690 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
28-526-10 Aries Electronics 28-526-10 12.6400
RFQ
ECAD 987 0.00000000 Aries Electronics Lo-PRO®file, 526 Bulk Active -55°C ~ 105°C Through Hole DIP, ZIF (ZIP) Closed Frame 28-526 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 10.0µin (0.25µm) Tin 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.105" (2.67mm) -
28-0518-11H Aries Electronics 28-0518-11H 6.8317
RFQ
ECAD 5869 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 28-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 28 (1 x 28) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
24-3518-111 Aries Electronics 24-3518-111 6.7872
RFQ
ECAD 9146 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 24-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
24-6503-20 Aries Electronics 24-6503-20 9.6900
RFQ
ECAD 4770 0.00000000 Aries Electronics 503 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 24-650 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Phosphor Bronze 0.360" (9.14mm) -
64-304121-00 Aries Electronics 64-304121-00 -
RFQ
ECAD 5790 0.00000000 Aries Electronics - Obsolete - Through Hole - Solder download RoHS non-compliant Not Applicable REACH Unaffected Q4124130 EAR99 8536.69.4040 1 - - 0.031" (0.80mm) - - Tin-Lead 200.0µin (5.08µm) TQFP QFP 64 - 0.031" (0.80mm) Brass 0.090" (2.29mm) FR4 Epoxy Glass
14-3508-311 Aries Electronics 14-3508-311 13.3282
RFQ
ECAD 3303 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 14-3508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
24-6518-10T Aries Electronics 24-6518-10T 1.5352
RFQ
ECAD 5541 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 24-6518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 20 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
08-8480-310C Aries Electronics 08-8480-310C 6.4842
RFQ
ECAD 1589 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 08-8480 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
29-0501-20 Aries Electronics 29-0501-20 14.3387
RFQ
ECAD 4620 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 105°C Through Hole SIP - 29-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 29 (1 x 29) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.420" (10.67mm) -
192-PGM17025-11 Aries Electronics 192-PGM17025-11 44.9200
RFQ
ECAD 2335 0.00000000 Aries Electronics PGM Bulk Active -55°C ~ 125°C Through Hole PGA - 192-PGM Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) - Beryllium Copper 0.100" (2.54mm) Brass 0.165" (4.19mm) -
05-7650-10 Aries Electronics 05-7650-10 8.0407
RFQ
ECAD 4703 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 05-7650 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 5 (1 x 5) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
08-0501-30 Aries Electronics 08-0501-30 4.8480
RFQ
ECAD 3605 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 105°C Through Hole SIP - 08-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 30 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 8 (1 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.690" (17.52mm) -
32-0508-20 Aries Electronics 32-0508-20 12.4608
RFQ
ECAD 3755 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole SIP - 32-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 32 (1 x 32) Beryllium Copper - Brass 0.360" (9.14mm) -
38-0511-10 Aries Electronics 38-0511-10 8.3285
RFQ
ECAD 5659 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 105°C Through Hole SIP - 38-0511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 50.0µin (1.27µm) 38 (1 x 38) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
16-81250-10 Aries Electronics 16-81250-10 -
RFQ
ECAD 7471 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 16-8125 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 20 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.140" (3.56mm) -
10-1518-00 Aries Electronics 10-1518-00 1.7271
RFQ
ECAD 8215 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.2" (5.08mm) Row Spacing Open Frame 10-1518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
175-PGM16003-11 Aries Electronics 175-PGM16003-11 83.0818
RFQ
ECAD 2892 0.00000000 Aries Electronics PGM Bulk Active -55°C ~ 125°C Through Hole PGA - 175-PGM Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) - Beryllium Copper 0.100" (2.54mm) Brass 0.165" (4.19mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse