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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
08-354000-11-RC Aries Electronics 08-354000-11-RC 21.7779
RFQ
ECAD 5881 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 08-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 8 Beryllium Copper 0.050" (1.27mm) Brass 0.030" (0.76mm) -
08-354000-21-RC Aries Electronics 08-354000-21-RC 21.7779
RFQ
ECAD 3780 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 08-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 8 Beryllium Copper 0.050" (1.27mm) Brass 0.089" (2.28mm) -
14-354000-11-RC Aries Electronics 14-354000-11-RC 22.5795
RFQ
ECAD 9042 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 14-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 14 Beryllium Copper 0.050" (1.27mm) Brass 0.030" (0.76mm) -
18-354000-11-RC Aries Electronics 18-354000-11-RC -
RFQ
ECAD 7778 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 18-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 18 Beryllium Copper 0.050" (1.27mm) Brass 0.030" (0.76mm) -
24-354000-11-RC Aries Electronics 24-354000-11-RC 28.6007
RFQ
ECAD 7014 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 24-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 24 Beryllium Copper 0.050" (1.27mm) Brass 0.030" (0.76mm) -
28-354000-11-RC Aries Electronics 28-354000-11-RC 30.1064
RFQ
ECAD 1406 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 28-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 - Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 28 Beryllium Copper 0.100" (2.54mm) Brass 0.030" (0.76mm) -
68-652000-11-RC Aries Electronics 68-652000-11-RC 62.0700
RFQ
ECAD 9670 0.00000000 Aries Electronics Correct-A-Chip® 652000 Bulk Active - Through Hole - 68-6520 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - - 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 68 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
68-653000-11-RC Aries Electronics 68-653000-11-RC 64.4900
RFQ
ECAD 9499 0.00000000 Aries Electronics Correct-A-Chip® 653000 Bulk Active - Through Hole Socket Included 68-6530 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - UL94 V-0 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 68 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
24-351000-11-RC Aries Electronics 24-351000-11-RC 22.6997
RFQ
ECAD 6958 0.00000000 Aries Electronics Correct-A-Chip® 351000 Bulk Active - Through Hole - 24-3510 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 - - 0.026" (0.65mm) Gold - Gold 10.0µin (0.25µm) SSOP DIP, 0.3" (7.62mm) Row Spacing 24 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
16-307349-11-RC Aries Electronics 16-307349-11-RC -
RFQ
ECAD 7760 0.00000000 Aries Electronics Correct-A-Chip® 307349 Bulk Active - Through Hole - 16-3073 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) Gold - Gold 10.0µin (0.25µm) PLCC DIP, 0.3" (7.62mm) Row Spacing 16 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
1109681-308 Aries Electronics 1109681-308 -
RFQ
ECAD 3405 0.00000000 Aries Electronics - Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Spacer 1109681 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 8 (2 x 4) Brass 0.100" (2.54mm) Brass 0.125" (3.18mm) -
1109681-318 Aries Electronics 1109681-318 -
RFQ
ECAD 4018 0.00000000 Aries Electronics - Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Spacer 1109681 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 28 (2 x 14) Brass 0.100" (2.54mm) Brass 0.125" (3.18mm) -
1109681-324 Aries Electronics 1109681-324 -
RFQ
ECAD 7608 0.00000000 Aries Electronics - Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Spacer 1109681 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 24 (2 x 12) Brass 0.100" (2.54mm) Brass 0.125" (3.18mm) -
1109681-624 Aries Electronics 1109681-624 -
RFQ
ECAD 6976 0.00000000 Aries Electronics - Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Spacer 1109681 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 24 (2 x 12) Brass 0.100" (2.54mm) Brass 0.125" (3.18mm) -
1109681-632 Aries Electronics 1109681-632 -
RFQ
ECAD 9261 0.00000000 Aries Electronics - Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Spacer 1109681 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 32 (2 x 16) Brass 0.100" (2.54mm) Brass 0.125" (3.18mm) -
181-PGM18041-10 Aries Electronics 181-PGM18041-10 -
RFQ
ECAD 3315 0.00000000 Aries Electronics PGM Bulk Obsolete -55°C ~ 105°C Through Hole PGA - Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Brass 0.165" (4.19mm) -
121-PRS13106-12 Aries Electronics 121-PRS13106-12 83.4633
RFQ
ECAD 5193 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 121-PRS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
32-3574-11 Aries Electronics 32-3574-11 24.4610
RFQ
ECAD 4199 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 32-3574 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
84-PRS11032-12 Aries Electronics 84-PRS11032-12 76.9217
RFQ
ECAD 2873 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 84-PRS1 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
181-PLS18041-12 Aries Electronics 181-PLS18041-12 114.4550
RFQ
ECAD 9995 0.00000000 Aries Electronics PLS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 181-PLS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
24-3573-11 Aries Electronics 24-3573-11 20.3542
RFQ
ECAD 8142 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 24-3573 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
145-PRS15024-12 Aries Electronics 145-PRS15024-12 94.3140
RFQ
ECAD 3384 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 145-PRS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
36-3574-16 Aries Electronics 36-3574-16 48.8311
RFQ
ECAD 6558 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 36-3574 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
16-8300-310C Aries Electronics 16-8300-310C 10.0717
RFQ
ECAD 7104 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 16-8300 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
40-6573-10 Aries Electronics 40-6573-10 17.0639
RFQ
ECAD 6504 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 40-6573 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
22-4501-20 Aries Electronics 22-4501-20 -
RFQ
ECAD 6808 0.00000000 Aries Electronics 501 Bulk Obsolete -55°C ~ 105°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Closed Frame Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 22 (2 x 11) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.410" (10.41mm) -
40-3573-16 Aries Electronics 40-3573-16 47.0314
RFQ
ECAD 8125 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 40-3573 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
32-6570-10 Aries Electronics 32-6570-10 16.0809
RFQ
ECAD 3279 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 32-6570 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
40-6570-11 Aries Electronics 40-6570-11 29.1900
RFQ
ECAD 4355 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 40-6570 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
48-6575-10 Aries Electronics 48-6575-10 20.9433
RFQ
ECAD 4355 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 48-6575 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 6 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse