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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
84-PGM11010-41 Aries Electronics 84-PGM11010-41 27.2920
RFQ
ECAD 9584 0.00000000 Aries Electronics PGM Bulk Active -55°C ~ 125°C Through Hole PGA - 84-PGM1 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) - Beryllium Copper 0.100" (2.54mm) Brass 0.165" (4.19mm) -
84-PGM13053-10 Aries Electronics 84-PGM13053-10 14.1085
RFQ
ECAD 1387 0.00000000 Aries Electronics PGM Bulk Active -55°C ~ 105°C Through Hole PGA - 84-PGM1 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Brass 0.165" (4.19mm) -
85-PGM11007-11H Aries Electronics 85-PGM11007-11H 19.1436
RFQ
ECAD 8647 0.00000000 Aries Electronics PGM Bulk Active -55°C ~ 125°C Through Hole PGA - 85-PGM1 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) - Beryllium Copper 0.100" (2.54mm) Brass 0.165" (4.19mm) -
85-PGM11008-11 Aries Electronics 85-PGM11008-11 21.6142
RFQ
ECAD 1495 0.00000000 Aries Electronics PGM Bulk Active -55°C ~ 125°C Through Hole PGA - 85-PGM1 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) - Beryllium Copper 0.100" (2.54mm) Brass 0.165" (4.19mm) -
14-350000-10-HT Aries Electronics 14-350000-10-HT 16.8918
RFQ
ECAD 7294 0.00000000 Aries Electronics Correct-A-Chip® 350000 Bulk Active - Through Hole - 14-3500 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 28 - - 0.050" (1.27mm) Tin - Tin-Lead 200.0µin (5.08µm) SOIC DIP, 0.3" (7.62mm) Row Spacing 14 - 0.100" (2.54mm) Brass 0.125" (3.18mm) Polyimide (PI)
18-350000-10-HT Aries Electronics 18-350000-10-HT -
RFQ
ECAD 6888 0.00000000 Aries Electronics Correct-A-Chip® 350000 Bulk Active - Through Hole - 18-3500 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 21 - - 0.050" (1.27mm) Tin - Tin-Lead 200.0µin (5.08µm) SOIC DIP, 0.3" (7.62mm) Row Spacing 18 - 0.100" (2.54mm) Brass 0.125" (3.18mm) Polyimide (PI)
24-350000-10-HT Aries Electronics 24-350000-10-HT 15.1750
RFQ
ECAD 2454 0.00000000 Aries Electronics Correct-A-Chip® 350000 Bulk Active - Through Hole - 24-3500 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 - - 0.050" (1.27mm) Tin - Tin-Lead 200.0µin (5.08µm) SOIC DIP, 0.3" (7.62mm) Row Spacing 24 - 0.100" (2.54mm) Brass 0.125" (3.18mm) Polyimide (PI)
24-354000-10 Aries Electronics 24-354000-10 28.6007
RFQ
ECAD 1825 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 24-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 24 Beryllium Copper 0.050" (1.27mm) Brass - -
32-450001-10-P Aries Electronics 32-450001-10-P -
RFQ
ECAD 8300 0.00000000 Aries Electronics Correct-A-Chip® 450001 Bulk Discontinued at SIC - Through Hole - 32-4500 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 96 - - 0.050" (1.27mm) - - - - SOJ DIP, 0.4" (10.16mm) Row Spacing 32 - 0.100" (2.54mm) - 0.125" (3.18mm) FR4 Epoxy Glass
08-301296-10 Aries Electronics 08-301296-10 14.3910
RFQ
ECAD 6753 0.00000000 Aries Electronics Correct-A-Chip® 301296 Bulk Active - Through Hole - 08-3012 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC JEDEC 8 - - Brass 0.125" (3.18mm) FR4 Epoxy Glass
44-652000-10 Aries Electronics 44-652000-10 94.9160
RFQ
ECAD 1171 0.00000000 Aries Electronics Correct-A-Chip® 652000 Bulk Active - Through Hole - 44-6520 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 44 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
68-505-110-RC-P Aries Electronics 68-505-110-RC-P -
RFQ
ECAD 1062 0.00000000 Aries Electronics Correct-A-Chip® 505 Bulk Discontinued at SIC - Through Hole - 68-505 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 72 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC PGA 68 - 0.050" (1.27mm) Brass 0.150" (3.81mm) FR4 Epoxy Glass
44-505-110 Aries Electronics 44-505-110 13.1191
RFQ
ECAD 6092 0.00000000 Aries Electronics Correct-A-Chip® 505 Bulk Active - Through Hole - 44-505 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC PGA 44 - 0.050" (1.27mm) Brass 0.150" (3.81mm) FR4 Epoxy Glass
14-651000-10 Aries Electronics 14-651000-10 32.8877
RFQ
ECAD 3567 0.00000000 Aries Electronics Correct-A-Chip® 651000 Bulk Active - Through Hole - 14-6510 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - - 0.026" (0.65mm) - - Tin-Lead 200.0µin (5.08µm) SSOP DIP, 0.6" (15.24mm) Row Spacing 14 - 0.100" (2.54mm) Brass 0.145" (3.68mm) FR4 Epoxy Glass
16-651000-10 Aries Electronics 16-651000-10 32.8877
RFQ
ECAD 3888 0.00000000 Aries Electronics Correct-A-Chip® 651000 Bulk Active - Through Hole - 16-6510 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - - 0.026" (0.65mm) - - Tin-Lead 200.0µin (5.08µm) SSOP DIP, 0.6" (15.24mm) Row Spacing 16 - 0.100" (2.54mm) Brass 0.145" (3.68mm) FR4 Epoxy Glass
18-666000-00 Aries Electronics 18-666000-00 14.0250
RFQ
ECAD 3991 0.00000000 Aries Electronics Correct-A-Chip® 666000 Bulk Active - Surface Mount - 18-6660 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC SOWIC 18 - 0.050" (1.27mm) Brass 0.080" (2.03mm) FR4 Epoxy Glass
20-666000-00 Aries Electronics 20-666000-00 14.2516
RFQ
ECAD 5236 0.00000000 Aries Electronics Correct-A-Chip® 666000 Bulk Active - Surface Mount - 20-6660 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC SOWIC 20 - 0.050" (1.27mm) Brass 0.080" (2.03mm) FR4 Epoxy Glass
24-666000-00 Aries Electronics 24-666000-00 14.7393
RFQ
ECAD 1396 0.00000000 Aries Electronics Correct-A-Chip® 666000 Bulk Active - Surface Mount - 24-6660 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC SOWIC 24 - 0.050" (1.27mm) Brass 0.080" (2.03mm) FR4 Epoxy Glass
10-665000-00 Aries Electronics 10-665000-00 -
RFQ
ECAD 6516 0.00000000 Aries Electronics Correct-A-Chip® 665000 Bulk Active - Surface Mount - 10-6650 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC-W SOIC 10 - 0.050" (1.27mm) Brass 0.031" (0.80mm) FR4 Epoxy Glass
14-665000-00 Aries Electronics 14-665000-00 17.2658
RFQ
ECAD 6108 0.00000000 Aries Electronics Correct-A-Chip® 665000 Bulk Active - Surface Mount - 14-6650 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC-W SOIC 14 - 0.050" (1.27mm) Brass 0.031" (0.80mm) FR4 Epoxy Glass
20-665000-00 Aries Electronics 20-665000-00 15.9368
RFQ
ECAD 4559 0.00000000 Aries Electronics Correct-A-Chip® 665000 Bulk Active - Surface Mount - 20-6650 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC-W SOIC 20 - 0.050" (1.27mm) Brass 0.031" (0.80mm) FR4 Epoxy Glass
22-665000-00 Aries Electronics 22-665000-00 16.0776
RFQ
ECAD 5393 0.00000000 Aries Electronics Correct-A-Chip® 665000 Bulk Active - Surface Mount - 22-6650 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC-W SOIC 22 - 0.050" (1.27mm) Brass 0.031" (0.80mm) FR4 Epoxy Glass
24-665000-00 Aries Electronics 24-665000-00 12.7684
RFQ
ECAD 4776 0.00000000 Aries Electronics Correct-A-Chip® 665000 Bulk Active - Surface Mount - 24-6650 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 240 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC-W SOIC 24 - 0.050" (1.27mm) Brass 0.031" (0.80mm) FR4 Epoxy Glass
1109800-14 Aries Electronics 1109800-14 -
RFQ
ECAD 9844 0.00000000 Aries Electronics Correct-A-Chip® 1109800 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Programmable 1109800 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
28-555000-00 Aries Electronics 28-555000-00 24.8541
RFQ
ECAD 4388 0.00000000 Aries Electronics Correct-A-Chip® 555000 Bulk Active - Surface Mount - 28-5550 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.026" (0.65mm) - - Tin-Lead 200.0µin (5.08µm) SSOP SOWIC 28 - 0.050" (1.27mm) Brass - FR4 Epoxy Glass
14-354W00-20 Aries Electronics 14-354W00-20 -
RFQ
ECAD 9212 0.00000000 Aries Electronics Correct-A-Chip® 354W00 Bulk Active 105°C Through Hole - 14-354W Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) DIP, 0.3" (7.62mm) Row Spacing SOWIC 14 Beryllium Copper 0.050" (1.27mm) Brass -
16-354W00-20 Aries Electronics 16-354W00-20 -
RFQ
ECAD 9451 0.00000000 Aries Electronics Correct-A-Chip® 354W00 Bulk Active 105°C Through Hole - 16-354W Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) DIP, 0.3" (7.62mm) Row Spacing SOWIC 16 Beryllium Copper 0.050" (1.27mm) Brass -
20-354W00-20 Aries Electronics 20-354W00-20 -
RFQ
ECAD 9494 0.00000000 Aries Electronics Correct-A-Chip® 354W00 Bulk Active 105°C Through Hole - 20-354W Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) DIP, 0.3" (7.62mm) Row Spacing SOWIC 20 Beryllium Copper 0.050" (1.27mm) Brass -
24-354W00-20 Aries Electronics 24-354W00-20 -
RFQ
ECAD 9822 0.00000000 Aries Electronics Correct-A-Chip® 354W00 Bulk Active 105°C Through Hole - 24-354W Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) DIP, 0.3" (7.62mm) Row Spacing SOWIC 24 Beryllium Copper 0.050" (1.27mm) Brass -
24-35W000-11-RC Aries Electronics 24-35W000-11-RC 21.8075
RFQ
ECAD 5094 0.00000000 Aries Electronics Correct-A-Chip® 35W000 Bulk Active - Through Hole - 24-35W0 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 - - 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) SOIC-W DIP, 0.3" (7.62mm) Row Spacing 24 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse