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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Accessory Type Color For Use With/Related Products Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Body Material Body Finish Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
32-537-20 Aries Electronics 32-537-20 16.0152
RFQ
ECAD 7606 0.00000000 Aries Electronics 537 Bulk Active -65°C ~ 260°C - 32-537 Insert Plate Black PLCC Sockets download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8538.90.8180 1 UL94 V-0 Polyphenylene Sulfide (PPS), Glass Filled - 32
16-C280-10 Aries Electronics 16-C280-10 4.6500
RFQ
ECAD 264 0.00000000 Aries Electronics EJECT-A-DIP™ Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 16-C280 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
84-653000-10 Aries Electronics 84-653000-10 157.0867
RFQ
ECAD 2683 0.00000000 Aries Electronics Correct-A-Chip® 653000 Bulk Active - Through Hole Socket Included 84-6530 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - UL94 V-0 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 84 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
28-526-10 Aries Electronics 28-526-10 12.6400
RFQ
ECAD 987 0.00000000 Aries Electronics Lo-PRO®file, 526 Bulk Active -55°C ~ 105°C Through Hole DIP, ZIF (ZIP) Closed Frame 28-526 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 10.0µin (0.25µm) Tin 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.105" (2.67mm) -
24-3518-10 Aries Electronics 24-3518-10 2.2600
RFQ
ECAD 40 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 24-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
40-6518-10 Aries Electronics 40-6518-10 3.3800
RFQ
ECAD 456 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 40-6518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
48-6518-10 Aries Electronics 48-6518-10 4.3900
RFQ
ECAD 88 0.00000000 Aries Electronics 518 Tube Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 48-6518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
40-6513-10 Aries Electronics 40-6513-10 5.0470
RFQ
ECAD 1740 0.00000000 Aries Electronics 513 - Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 40-6513 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
16-820-90T Aries Electronics 16-820-90T 7.7719
RFQ
ECAD 7666 0.00000000 Aries Electronics Vertisockets™ 800 - Active 105°C Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame 16-820 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
14-C280-10 Aries Electronics 14-C280-10 3.4138
RFQ
ECAD 8801 0.00000000 Aries Electronics EJECT-A-DIP™ Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 14-C280 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
44-536-11 Aries Electronics 44-536-11 -
RFQ
ECAD 4445 0.00000000 Aries Electronics 536 - Obsolete - Through Hole PLCC, ZIF (ZIP) Open Frame - - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) Gold 12.0µin (0.30µm) - - 44 (4 x 11) - - - - -
13-0513-10 Aries Electronics 13-0513-10 1.6887
RFQ
ECAD 7587 0.00000000 Aries Electronics 0513 Bulk Active - Through Hole SIP - 13-0513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 13 (1 x 13) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
14-810-90 Aries Electronics 14-810-90 10.5200
RFQ
ECAD 890 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Vertical DIP, 0.3" (7.62mm) Row Spacing Closed Frame 14-810 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 14 (2 x 7) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
10-810-90C Aries Electronics 10-810-90C 11.2000
RFQ
ECAD 79 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Vertical DIP, 0.3" (7.62mm) Row Spacing Closed Frame 10-810 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
08-823-90 Aries Electronics 08-823-90 8.1900
RFQ
ECAD 38 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame 08-823 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 8 (2 x 4) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
C9314-02 Aries Electronics C9314-02 -
RFQ
ECAD 9073 0.00000000 Aries Electronics Lo-PRO®file, C93 Bulk Obsolete -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame Solder download RoHS non-compliant Not Applicable REACH Unaffected Q3250569 EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 14 (2 x 7) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.140" (3.56mm) 20mOhm
20-7490-10 Aries Electronics 20-7490-10 11.5988
RFQ
ECAD 5132 0.00000000 Aries Electronics 700 Elevator Strip-Line™ - Active -55°C ~ 105°C Through Hole SIP Elevated 20-7490 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 20 (1 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
28-653000-10 Aries Electronics 28-653000-10 42.7500
RFQ
ECAD 138 0.00000000 Aries Electronics Correct-A-Chip® 653000 Bulk Active - Through Hole Socket Included 28-6530 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 17 1 A - UL94 V-0 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 28 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
56-184M65 Aries Electronics 56-184M65 -
RFQ
ECAD 5031 0.00000000 Aries Electronics - Obsolete - - - - - Not applicable 1 (Unlimited) REACH Unaffected A162 EAR99 8536.69.4040 1 - - - - - - - QFP PGA 184 - - - - -
95-132I25 Aries Electronics 95-132I25 -
RFQ
ECAD 1879 0.00000000 Aries Electronics Correct-A-Chip® 95-132I25 Bulk Active - Through Hole - 95-132I Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.025" (0.64mm) Tin - Tin-Lead 200.0µin (5.08µm) QFP PGA 132 Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
40-6574-10 Aries Electronics 40-6574-10 20.3700
RFQ
ECAD 1 0.00000000 Aries Electronics 57 Tube Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 40-6574 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
40-6574-11 Aries Electronics 40-6574-11 29.1900
RFQ
ECAD 6482 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 40-6574 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
48-6574-11 Aries Electronics 48-6574-11 34.1150
RFQ
ECAD 8285 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 48-6574 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
08-6810-90C Aries Electronics 08-6810-90C 7.2923
RFQ
ECAD 8673 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Vertical DIP, 0.6" (15.24mm) Row Spacing Closed Frame 08-6810 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
16-354000-10 Aries Electronics 16-354000-10 23.3322
RFQ
ECAD 7528 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active 105°C Surface Mount - 16-3540 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 16 Beryllium Copper 0.050" (1.27mm) Brass - -
32-8800-610C Aries Electronics 32-8800-610C 15.1696
RFQ
ECAD 6491 0.00000000 Aries Electronics 8 - Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated 32-8800 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected Q555142 EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
11-0513-10 Aries Electronics 11-0513-10 1.4393
RFQ
ECAD 9505 0.00000000 Aries Electronics 0513 Bulk Active - Through Hole SIP - 11-0513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 11 (1 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
14-823-90C Aries Electronics 14-823-90C 7.7719
RFQ
ECAD 9038 0.00000000 Aries Electronics Vertisockets™ 800 - Active -55°C ~ 105°C Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame 14-823 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected Q1549738 EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
44-547-11E Aries Electronics 44-547-11E 219.3600
RFQ
ECAD 1 0.00000000 Aries Electronics 547 Bulk Active - Through Hole SOIC, ZIF (ZIP) Closed Frame 44-547 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 - Gold 20.0µin (0.51µm) Gold 20.0µin (0.51µm) 44 (2 x 22) Beryllium Copper 0.050" (1.27mm) Beryllium Copper 0.150" (3.81mm) -
16-354000-20 Aries Electronics 16-354000-20 23.3322
RFQ
ECAD 2998 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 16-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 16 Beryllium Copper 0.050" (1.27mm) Brass - -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse