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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Accessory Type Color For Use With/Related Products Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Body Material Body Finish Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
36-0518-10T Aries Electronics 36-0518-10T 3.6158
RFQ
ECAD 7631 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 36-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 36 (1 x 36) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
16-6513-11 Aries Electronics 16-6513-11 3.5148
RFQ
ECAD 2311 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 16-6513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
18-0511-11 Aries Electronics 18-0511-11 16.5167
RFQ
ECAD 4316 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 125°C Through Hole SIP - 18-0511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 18 (1 x 18) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
16-3518-00 Aries Electronics 16-3518-00 1.8559
RFQ
ECAD 2649 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 16-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 23 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
14-1508-21 Aries Electronics 14-1508-21 10.1444
RFQ
ECAD 6009 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Closed Frame 14-1508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
1106396-40 Aries Electronics 1106396-40 15.8196
RFQ
ECAD 9396 0.00000000 Aries Electronics Correct-A-Chip® 1106396 Bulk Active - Through Hole - 1106396 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) DIP, 0.3" (7.62mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 40 Beryllium Copper 0.100" (2.54mm) Brass 0.130" (3.30mm) -
28-6554-18 Aries Electronics 28-6554-18 145.9444
RFQ
ECAD 7028 0.00000000 Aries Electronics 55 Bulk Active -55°C ~ 250°C Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 28-6554 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 9 1 A Polyetheretherketone (PEEK), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 28 (2 x 14) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
12-8355-310C Aries Electronics 12-8355-310C 8.4437
RFQ
ECAD 7568 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 12-8355 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 12 (2 x 6) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
48-6501-30 Aries Electronics 48-6501-30 11.1807
RFQ
ECAD 5464 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 48-6501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 48 (2 x 24) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.690" (17.52mm) -
LP300 RED Aries Electronics LP300 RED -
RFQ
ECAD 7053 0.00000000 Aries Electronics LP300 Bulk Active -55°C ~ 125°C - LP300 Shorting Plug Black 0.3" DIP Sockets - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 UL94 V-0 Polyamide (PA46), Nylon 4/6 -
1110087 Aries Electronics 1110087 73.3850
RFQ
ECAD 2341 0.00000000 Aries Electronics Correct-A-Chip® 1110087 Bulk Active 105°C Through Hole - 1110087 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected Q717785 EAR99 8536.69.4040 1 - - 0.020" (0.50mm) Gold - Tin-Lead 200.0µin (5.08µm) VQFP PGA 144 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
145-PGM15023-10 Aries Electronics 145-PGM15023-10 18.2274
RFQ
ECAD 1719 0.00000000 Aries Electronics PGM Bulk Active -55°C ~ 105°C Through Hole PGA - 145-PGM Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Brass 0.165" (4.19mm) -
32-C300-21 Aries Electronics 32-C300-21 25.6881
RFQ
ECAD 2990 0.00000000 Aries Electronics EJECT-A-DIP™ Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 32-C300 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.040" (1.02mm) -
13-7XXXX-10 Aries Electronics 13-7XXXX-10 -
RFQ
ECAD 9261 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 13-7XXX Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 13 (1 x 13) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
48-6554-10 Aries Electronics 48-6554-10 19.9900
RFQ
ECAD 101 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 48-6554 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 6 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
68-505-110-P Aries Electronics 68-505-110-P -
RFQ
ECAD 8963 0.00000000 Aries Electronics Correct-A-Chip® 505 Bulk Discontinued at SIC - Through Hole - 68-505 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 72 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC PGA 68 - 0.050" (1.27mm) Brass 0.150" (3.81mm) FR4 Epoxy Glass
29-0511-11 Aries Electronics 29-0511-11 21.6795
RFQ
ECAD 4236 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 125°C Through Hole SIP - 29-0511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 29 (1 x 29) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
29-0508-21 Aries Electronics 29-0508-21 18.6527
RFQ
ECAD 4129 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole SIP - 29-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 29 (1 x 29) Beryllium Copper - Brass 0.360" (9.14mm) -
04-1508-30 Aries Electronics 04-1508-30 1.5352
RFQ
ECAD 1890 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Closed Frame 04-1508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 4 (2 x 2) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
24-650000-11-RC Aries Electronics 24-650000-11-RC 38.1890
RFQ
ECAD 9571 0.00000000 Aries Electronics Correct-A-Chip® 650000 Tube Active - Through Hole - 24-650 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected A754 EAR99 8536.69.4040 20 - - 0.050" (1.27mm) Gold - Gold 10.0µin (0.25µm) SOIC DIP, 0.6" (15.24mm) Row Spacing 24 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
28-3574-10 Aries Electronics 28-3574-10 14.2691
RFQ
ECAD 1037 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 28-3574 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
38-6823-90T Aries Electronics 38-6823-90T 18.2109
RFQ
ECAD 9814 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Horizontal DIP, 0.6" (15.24mm) Row Spacing Closed Frame 38-6823 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 38 (2 x 19) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
24-3551-16 Aries Electronics 24-3551-16 44.6840
RFQ
ECAD 9039 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 24-3551 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
169-PGM13001-10 Aries Electronics 169-PGM13001-10 18.2082
RFQ
ECAD 7739 0.00000000 Aries Electronics PGM Bulk Active - Through Hole PGA - 169-PGM Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected Q12522165 EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
36-6574-18 Aries Electronics 36-6574-18 149.3800
RFQ
ECAD 1210 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 36-6574 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
32-C182-11 Aries Electronics 32-C182-11 9.4031
RFQ
ECAD 4917 0.00000000 Aries Electronics EJECT-A-DIP™ Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 32-C182 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
40-6575-18 Aries Electronics 40-6575-18 167.7686
RFQ
ECAD 9340 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 40-6575 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
08-7470-10 Aries Electronics 08-7470-10 6.4479
RFQ
ECAD 4926 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 08-7470 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 30 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 8 (1 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
18-3518-101 Aries Electronics 18-3518-101 3.9592
RFQ
ECAD 8451 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 18-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
20-3501-20 Aries Electronics 20-3501-20 6.4235
RFQ
ECAD 4448 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 20-3501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 20 (2 x 10) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.690" (17.52mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse