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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
40-6556-31 Aries Electronics 40-6556-31 27.7500
RFQ
ECAD 3786 0.00000000 Aries Electronics 6556 - Active 150°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 40-6556 Wire Wrap - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.423" (10.74mm) -
28-536-11 Aries Electronics 28-536-11 -
RFQ
ECAD 7710 0.00000000 Aries Electronics 536 - Obsolete - Through Hole PLCC, ZIF (ZIP) Open Frame - - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) Gold 12.0µin (0.30µm) - - 28 (4 x 7) - - - - -
169-PRS13001-12 Aries Electronics 169-PRS13001-12 94.5000
RFQ
ECAD 77 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 169-PRS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
225-PRS15001-12 Aries Electronics 225-PRS15001-12 104.9600
RFQ
ECAD 83 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 225-PRS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 225 (15 x 15) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
289-PRS17001-12 Aries Electronics 289-PRS17001-12 122.6100
RFQ
ECAD 48 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 289-PRS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
08-810-90 Aries Electronics 08-810-90 8.3200
RFQ
ECAD 4 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Vertical DIP, 0.3" (7.62mm) Row Spacing Closed Frame 08-810 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 8 (2 x 4) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
14-810-90T Aries Electronics 14-810-90T 7.7600
RFQ
ECAD 256 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Vertical DIP, 0.3" (7.62mm) Row Spacing Closed Frame 14-810 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
14-810-90C Aries Electronics 14-810-90C 11.4400
RFQ
ECAD 120 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Vertical DIP, 0.3" (7.62mm) Row Spacing Closed Frame 14-810 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
16-810-90C Aries Electronics 16-810-90C 12.6900
RFQ
ECAD 42 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Vertical DIP, 0.3" (7.62mm) Row Spacing Closed Frame 16-810 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
14-823-90 Aries Electronics 14-823-90 10.7100
RFQ
ECAD 313 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame 14-823 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 14 (2 x 7) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
40-6823-90 Aries Electronics 40-6823-90 22.0500
RFQ
ECAD 1703 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Horizontal DIP, 0.6" (15.24mm) Row Spacing Closed Frame 40-6823 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 40 (2 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
20-350001-10 Aries Electronics 20-350001-10 10.8535
RFQ
ECAD 6537 0.00000000 Aries Electronics Correct-A-Chip® 350000 Bulk Active - Through Hole - 20-3500 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected A325 EAR99 8536.69.4040 19 - - 0.050" (1.27mm) - - Tin 200.0µin (5.08µm) SOJ DIP, 0.3" (7.62mm) Row Spacing 20 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
52-536-11 Aries Electronics 52-536-11 -
RFQ
ECAD 9751 0.00000000 Aries Electronics 536 - Obsolete - Through Hole PLCC, ZIF (ZIP) Open Frame - - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) Gold 12.0µin (0.30µm) - - 52 (4 x 13) - - - - -
20-3540-10 Aries Electronics 20-3540-10 -
RFQ
ECAD 8027 0.00000000 Aries Electronics - - Obsolete - - - - - - RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - - - - - - - - - - - -
28-354000-10 Aries Electronics 28-354000-10 30.1064
RFQ
ECAD 7098 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active 105°C Surface Mount - 28-3540 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected Q272465 EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 28 Beryllium Copper 0.050" (1.27mm) Brass - -
24-6574-11 Aries Electronics 24-6574-11 20.3542
RFQ
ECAD 8007 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 24-6574 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
32-6574-10 Aries Electronics 32-6574-10 16.0810
RFQ
ECAD 1603 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 32-6574 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
32-6574-11 Aries Electronics 32-6574-11 24.6905
RFQ
ECAD 9354 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 32-6574 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
97-68340 Aries Electronics 97-68340 -
RFQ
ECAD 9175 0.00000000 Aries Electronics Correct-A-Chip® 97-68340 Bulk Active - Through Hole - 97-6834 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.026" (0.65mm) Tin - Tin 200.0µin (5.08µm) QFP PGA 144 Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
1110087 Aries Electronics 1110087 73.3850
RFQ
ECAD 2341 0.00000000 Aries Electronics Correct-A-Chip® 1110087 Bulk Active 105°C Through Hole - 1110087 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected Q717785 EAR99 8536.69.4040 1 - - 0.020" (0.50mm) Gold - Tin-Lead 200.0µin (5.08µm) VQFP PGA 144 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
44-305263-20 Aries Electronics 44-305263-20 -
RFQ
ECAD 8907 0.00000000 Aries Electronics Correct-A-Chip® 305263 Bulk Active - Through Hole - 44-3052 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.024" (0.60mm) - - Tin-Lead 200.0µin (5.08µm) QFP PLCC 44 - 0.050" (1.27mm) Brass 0.090" (2.29mm) FR4 Epoxy Glass
C8122-04 Aries Electronics C8122-04 -
RFQ
ECAD 9363 0.00000000 Aries Electronics Edge-Grip™, C81 Bulk Obsolete -55°C ~ 105°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Closed Frame Wire Wrap download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 22 (2 x 11) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.675" (17.15mm) -
C8128-04 Aries Electronics C8128-04 -
RFQ
ECAD 9018 0.00000000 Aries Electronics Edge-Grip™, C81 Bulk Obsolete -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame Wire Wrap download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.675" (17.15mm) -
C8140-04 Aries Electronics C8140-04 -
RFQ
ECAD 4493 0.00000000 Aries Electronics Edge-Grip™, C81 Bulk Obsolete -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame Wire Wrap download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.675" (17.15mm) -
C9116-00 Aries Electronics C9116-00 -
RFQ
ECAD 9485 0.00000000 Aries Electronics Edge-Grip™, C91 Bulk Obsolete -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame Wire Wrap download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 16 (2 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.675" (17.15mm) -
28-526-11 Aries Electronics 28-526-11 18.7600
RFQ
ECAD 10 0.00000000 Aries Electronics Lo-PRO®file, 526 Bulk Active -55°C ~ 125°C Through Hole DIP, ZIF (ZIP) Closed Frame 28-526 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.105" (2.67mm) -
08-354000-10 Aries Electronics 08-354000-10 21.7779
RFQ
ECAD 4558 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active 105°C Surface Mount - 08-3540 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected Q1424359 EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 200.0µin (5.08µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 8 Beryllium Copper 0.050" (1.27mm) Brass - -
28-6554-16 Aries Electronics 28-6554-16 52.7978
RFQ
ECAD 9560 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 28-6554 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected Q3458807 EAR99 8536.69.4040 9 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
24-6571-11 Aries Electronics 24-6571-11 20.3542
RFQ
ECAD 3022 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 24-6571 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected Q3680920A EAR99 8536.69.4040 12 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
66-PRS11054-12 Aries Electronics 66-PRS11054-12 73.8133
RFQ
ECAD 7806 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 66-PRS1 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse