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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
22-4518-01 Aries Electronics 22-4518-01 10.1627
RFQ
ECAD 1319 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame 22-4518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
65-PRS10008-12 Aries Electronics 65-PRS10008-12 73.6250
RFQ
ECAD 8656 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 65-PRS1 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
12-0511-10 Aries Electronics 12-0511-10 4.3900
RFQ
ECAD 135 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 105°C Through Hole SIP - 12-0511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 50.0µin (1.27µm) 12 (1 x 12) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
28-354000-10 Aries Electronics 28-354000-10 30.1064
RFQ
ECAD 7098 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active 105°C Surface Mount - 28-3540 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected Q272465 EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 28 Beryllium Copper 0.050" (1.27mm) Brass - -
28-350002-11-RC Aries Electronics 28-350002-11-RC 24.8600
RFQ
ECAD 1226 0.00000000 Aries Electronics Correct-A-Chip® 350000 Tube Active - Through Hole - 28-3500 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected A757 EAR99 8536.69.4040 14 - - 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) SOIC DIP, 0.3" (7.62mm) Row Spacing 28 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
40-6621-30 Aries Electronics 40-6621-30 21.0745
RFQ
ECAD 7128 0.00000000 Aries Electronics 6621 Bulk Active -55°C ~ 105°C Through Hole, Bottom Entry; Through Board DIP, 0.6" (15.24mm) Row Spacing Closed Frame 40-6621 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
68-505-110-P Aries Electronics 68-505-110-P -
RFQ
ECAD 8963 0.00000000 Aries Electronics Correct-A-Chip® 505 Bulk Discontinued at SIC - Through Hole - 68-505 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 72 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC PGA 68 - 0.050" (1.27mm) Brass 0.150" (3.81mm) FR4 Epoxy Glass
32-6513-11H Aries Electronics 32-6513-11H 10.2718
RFQ
ECAD 9271 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 32-6513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
14-8870-10 Aries Electronics 14-8870-10 -
RFQ
ECAD 7255 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 14-8870 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 25 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.140" (3.56mm) -
50-9503-21 Aries Electronics 50-9503-21 36.0617
RFQ
ECAD 7377 0.00000000 Aries Electronics 503 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Closed Frame 50-9503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 50 (2 x 25) Beryllium Copper 0.100" (2.54mm) Phosphor Bronze 0.360" (9.14mm) -
24-354000-20 Aries Electronics 24-354000-20 28.6007
RFQ
ECAD 2260 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 24-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 24 Beryllium Copper 0.050" (1.27mm) Brass - -
28-653000-11-RC Aries Electronics 28-653000-11-RC 42.5882
RFQ
ECAD 9198 0.00000000 Aries Electronics Correct-A-Chip® 653000 Bulk Active - Through Hole Socket Included 28-6530 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 17 1 A - UL94 V-0 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 28 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
28-450001-10 Aries Electronics 28-450001-10 30.3679
RFQ
ECAD 2470 0.00000000 Aries Electronics Correct-A-Chip® 450001 Bulk Active - Through Hole - 28-4500 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 - - 0.050" (1.27mm) - - - - SOJ DIP, 0.4" (10.16mm) Row Spacing 28 - 0.100" (2.54mm) - 0.125" (3.18mm) FR4 Epoxy Glass
18-35W000-10-P Aries Electronics 18-35W000-10-P -
RFQ
ECAD 6435 0.00000000 Aries Electronics Correct-A-Chip® 35W000 Bulk Discontinued at SIC - Through Hole - 18-35W0 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 144 - - 0.050" (1.27mm) - - Tin-Lead - SOIC-W DIP, 0.3" (7.62mm) Row Spacing 18 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
20-350001-10 Aries Electronics 20-350001-10 10.8535
RFQ
ECAD 6537 0.00000000 Aries Electronics Correct-A-Chip® 350000 Bulk Active - Through Hole - 20-3500 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected A325 EAR99 8536.69.4040 19 - - 0.050" (1.27mm) - - Tin 200.0µin (5.08µm) SOJ DIP, 0.3" (7.62mm) Row Spacing 20 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
14-8875-310C Aries Electronics 14-8875-310C 9.4798
RFQ
ECAD 2668 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 14-8875 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
14-0501-21 Aries Electronics 14-0501-21 11.1444
RFQ
ECAD 9630 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 125°C Through Hole SIP - 14-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 14 (1 x 14) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.420" (10.67mm) -
16-35W000-11-RC Aries Electronics 16-35W000-11-RC 22.1542
RFQ
ECAD 2321 0.00000000 Aries Electronics Correct-A-Chip® 35W000 Bulk Active - Through Hole - 16-35W0 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) SOIC-W DIP, 0.3" (7.62mm) Row Spacing 16 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
84-652000-10 Aries Electronics 84-652000-10 136.7750
RFQ
ECAD 1239 0.00000000 Aries Electronics Correct-A-Chip® 652000 Bulk Active - Through Hole - 84-6520 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 84 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
44-6556-11 Aries Electronics 44-6556-11 18.1783
RFQ
ECAD 4738 0.00000000 Aries Electronics 6556 Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 44-6556 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) Brass 0.130" (3.30mm) -
03-0503-20 Aries Electronics 03-0503-20 1.4201
RFQ
ECAD 7763 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 03-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 3 (1 x 3) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
28-0511-10 Aries Electronics 28-0511-10 7.6760
RFQ
ECAD 9308 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 105°C Through Hole SIP - 28-0511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 50.0µin (1.27µm) 28 (1 x 28) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
48-655000-10 Aries Electronics 48-655000-10 -
RFQ
ECAD 2346 0.00000000 Aries Electronics Correct-A-Chip® 655000 Bulk Obsolete - Through Hole - Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.020" (0.50mm) Silver - Tin-Lead 200.0µin (5.08µm) TSOP DIP, 0.6" (15.24mm) Row Spacing 48 Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
03-0508-31 Aries Electronics 03-0508-31 2.2422
RFQ
ECAD 2487 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole SIP - 03-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 3 (1 x 3) Beryllium Copper - Brass 0.500" (12.70mm) -
32-652000-10-P Aries Electronics 32-652000-10-P -
RFQ
ECAD 9015 0.00000000 Aries Electronics Correct-A-Chip® 652000 Bulk Discontinued at SIC - Through Hole - 32-6520 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 1 A - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 32 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
1109252 Aries Electronics 1109252 -
RFQ
ECAD 9936 0.00000000 Aries Electronics Correct-A-Chip® 1109252 Bulk Active - Through Hole - 1109252 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - - - - Tin-Lead - PLCC DIP, 0.6" (15.24mm) Row Spacing 28 - 0.070" (1.78mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
1107254-18 Aries Electronics 1107254-18 9.7264
RFQ
ECAD 1441 0.00000000 Aries Electronics Correct-A-Chip® 1107254 Bulk Active - Through Hole - 1107254 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing 18 Beryllium Copper 0.100" (2.54mm) Brass 0.130" (3.30mm) -
08-665000-00 Aries Electronics 08-665000-00 16.7954
RFQ
ECAD 3246 0.00000000 Aries Electronics Correct-A-Chip® 665000 Bulk Active - Surface Mount - 08-6650 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC-W SOIC 8 - 0.050" (1.27mm) Brass 0.031" (0.80mm) FR4 Epoxy Glass
08-7980-10 Aries Electronics 08-7980-10 6.4479
RFQ
ECAD 4648 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 08-7980 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 30 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 8 (1 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
18-351000-11-RC Aries Electronics 18-351000-11-RC 23.7248
RFQ
ECAD 9526 0.00000000 Aries Electronics Correct-A-Chip® 351000 Tube Active - Through Hole - 18-3510 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected A749 EAR99 8536.69.4040 21 - - 0.026" (0.65mm) Gold - Gold 10.0µin (0.25µm) SSOP DIP, 0.3" (7.62mm) Row Spacing 18 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse