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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
256-PRS16001-12 Aries Electronics 256-PRS16001-12 116.8425
RFQ
ECAD 6103 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 256-PRS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
24-6575-10 Aries Electronics 24-6575-10 13.5972
RFQ
ECAD 7524 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 24-6575 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
10-7450-10 Aries Electronics 10-7450-10 9.1628
RFQ
ECAD 7881 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 10-7450 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 10 (1 x 10) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
14-8590-310C Aries Electronics 14-8590-310C 9.4798
RFQ
ECAD 1779 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 14-8590 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
44-6570-11 Aries Electronics 44-6570-11 32.6262
RFQ
ECAD 1021 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 44-6570 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
10-2511-10 Aries Electronics 10-2511-10 1.9089
RFQ
ECAD 2577 0.00000000 Aries Electronics 511 - Active -55°C ~ 105°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Closed Frame 10-2511 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 10 (2 x 5) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
16-7415-10 Aries Electronics 16-7415-10 11.3444
RFQ
ECAD 2656 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 16-7415 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 16 (1 x 16) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
84-505-110-P Aries Electronics 84-505-110-P -
RFQ
ECAD 3212 0.00000000 Aries Electronics Correct-A-Chip® 505 Bulk Discontinued at SIC - Through Hole - 84-505 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 56 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC PGA 84 - 0.050" (1.27mm) Brass 0.150" (3.81mm) FR4 Epoxy Glass
28-3574-11 Aries Electronics 28-3574-11 22.0723
RFQ
ECAD 4605 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 28-3574 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
44-305263-20 Aries Electronics 44-305263-20 -
RFQ
ECAD 8907 0.00000000 Aries Electronics Correct-A-Chip® 305263 Bulk Active - Through Hole - 44-3052 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.024" (0.60mm) - - Tin-Lead 200.0µin (5.08µm) QFP PLCC 44 - 0.050" (1.27mm) Brass 0.090" (2.29mm) FR4 Epoxy Glass
26-0508-31 Aries Electronics 26-0508-31 16.0308
RFQ
ECAD 8890 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole SIP - 26-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 26 (1 x 26) Beryllium Copper - Brass 0.500" (12.70mm) -
20-7770-10 Aries Electronics 20-7770-10 11.5988
RFQ
ECAD 3187 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 20-7770 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 20 (1 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
100-PRS17048-12 Aries Electronics 100-PRS17048-12 92.7000
RFQ
ECAD 7335 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 100-PRS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
28-354000-21-RC Aries Electronics 28-354000-21-RC 30.1064
RFQ
ECAD 5204 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 28-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 - Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 28 Beryllium Copper 0.100" (2.54mm) Brass 0.089" (2.28mm) -
36-6575-16 Aries Electronics 36-6575-16 48.8311
RFQ
ECAD 1833 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 36-6575 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
36-651000-10 Aries Electronics 36-651000-10 32.1346
RFQ
ECAD 2557 0.00000000 Aries Electronics Correct-A-Chip® 651000 Bulk Active 105°C Through Hole - 36-6510 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.026" (0.65mm) Tin - Tin-Lead 200.0µin (5.08µm) SSOP DIP, 0.6" (15.24mm) Row Spacing 36 Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
225-PRS15001-12 Aries Electronics 225-PRS15001-12 104.9600
RFQ
ECAD 83 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 225-PRS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 225 (15 x 15) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
07-0518-11 Aries Electronics 07-0518-11 0.9368
RFQ
ECAD 8080 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 07-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 7 (1 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
36-6556-11 Aries Electronics 36-6556-11 17.2658
RFQ
ECAD 1828 0.00000000 Aries Electronics 6556 Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 36-6556 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Brass 0.130" (3.30mm) -
36-6574-18 Aries Electronics 36-6574-18 149.3800
RFQ
ECAD 1210 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 36-6574 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
16-6501-20 Aries Electronics 16-6501-20 6.3519
RFQ
ECAD 7039 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 16-650 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 22 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.410" (10.41mm) -
35-0518-10H Aries Electronics 35-0518-10H 3.8380
RFQ
ECAD 4908 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 35-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 35 (1 x 35) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
24-1508-21 Aries Electronics 24-1508-21 16.4819
RFQ
ECAD 1512 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Closed Frame 24-1508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
77-PGM10015-11 Aries Electronics 77-PGM10015-11 20.3543
RFQ
ECAD 8200 0.00000000 Aries Electronics PGM Bulk Active -55°C ~ 125°C Through Hole PGA - 77-PGM1 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) - Beryllium Copper 0.100" (2.54mm) Brass 0.165" (4.19mm) -
10-2822-90 Aries Electronics 10-2822-90 9.4800
RFQ
ECAD 4861 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Horizontal DIP, 0.2" (5.08mm) Row Spacing Closed Frame 10-2822 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 10 (2 x 5) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
14-3513-00 Aries Electronics 14-3513-00 2.6866
RFQ
ECAD 7164 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 14-3513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 25 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
25-7500-10 Aries Electronics 25-7500-10 13.2933
RFQ
ECAD 2172 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 25-7500 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 25 (1 x 25) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
22-7XXXX-10 Aries Electronics 22-7XXXX-10 -
RFQ
ECAD 1745 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 22-7XXX Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 22 (1 x 22) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
18-823-90 Aries Electronics 18-823-90 15.0879
RFQ
ECAD 8981 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active -55°C ~ 105°C Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame 18-823 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 18 (2 x 9) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
20-81000-610C Aries Electronics 20-81000-610C 13.0668
RFQ
ECAD 2182 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated 20-8100 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
  • Daily average RFQ Volume

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    Daily average RFQ Volume

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    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

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    Worldwide Manufacturers

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    15,000 m2

    In-stock Warehouse