Tel: +86-0755-83501315
Email: sales@sic-components.com
Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Type | Features | Base Product Number | Termination | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | ECCN | HTSUS | Standard Package | Current Rating (Amps) | Housing Material | Material Flammability Rating | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Material - Post | Termination Post Length | Contact Resistance |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
32-3554-18 | 118.0613 | 3827 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | -55°C ~ 250°C | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 32-3554 | Solder | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 8 | 1 A | Polyetheretherketone (PEEK), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 32 (2 x 16) | Beryllium Nickel | 0.100" (2.54mm) | Beryllium Nickel | 0.110" (2.78mm) | - | |||
36-6554-18 | 124.8943 | 8988 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | -55°C ~ 250°C | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 36-6554 | Solder | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyetheretherketone (PEEK), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 36 (2 x 18) | Beryllium Nickel | 0.100" (2.54mm) | Beryllium Nickel | 0.110" (2.78mm) | - | |||
42-3553-18 | 147.1471 | 9880 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | -55°C ~ 250°C | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 42-3553 | Solder | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyetheretherketone (PEEK), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Nickel | 0.100" (2.54mm) | Beryllium Nickel | 0.110" (2.78mm) | - | |||
44-3551-18 | 153.9971 | 8998 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | -55°C ~ 250°C | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 44-3551 | Solder | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyetheretherketone (PEEK), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 44 (2 x 22) | Beryllium Nickel | 0.100" (2.54mm) | Beryllium Nickel | 0.110" (2.78mm) | - | |||
44-3552-18 | 153.9971 | 8843 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | -55°C ~ 250°C | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 44-3552 | Solder | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyetheretherketone (PEEK), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 44 (2 x 22) | Beryllium Nickel | 0.100" (2.54mm) | Beryllium Nickel | 0.110" (2.78mm) | - | |||
44-6552-18 | 153.9971 | 4681 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | -55°C ~ 250°C | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 44-6552 | Solder | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyetheretherketone (PEEK), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 44 (2 x 22) | Beryllium Nickel | 0.100" (2.54mm) | Beryllium Nickel | 0.110" (2.78mm) | - | |||
36-3554-18 | 124.8943 | 7952 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | -55°C ~ 250°C | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 36-3554 | Solder | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyetheretherketone (PEEK), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 36 (2 x 18) | Beryllium Nickel | 0.100" (2.54mm) | Beryllium Nickel | 0.110" (2.78mm) | - | |||
44-6554-18 | 153.9971 | 2904 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | -55°C ~ 250°C | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 44-6554 | Solder | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyetheretherketone (PEEK), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 44 (2 x 22) | Beryllium Nickel | 0.100" (2.54mm) | Beryllium Nickel | 0.110" (2.78mm) | - | |||
48-3552-18 | 169.3817 | 7541 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | -55°C ~ 250°C | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 48-3552 | Solder | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 6 | 1 A | Polyetheretherketone (PEEK), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 48 (2 x 24) | Beryllium Nickel | 0.100" (2.54mm) | Beryllium Nickel | 0.110" (2.78mm) | - | |||
48-6552-18 | 169.3817 | 2263 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | -55°C ~ 250°C | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 48-6552 | Solder | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 6 | 1 A | Polyetheretherketone (PEEK), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 48 (2 x 24) | Beryllium Nickel | 0.100" (2.54mm) | Beryllium Nickel | 0.110" (2.78mm) | - | |||
48-6553-18 | 169.3817 | 2758 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | -55°C ~ 250°C | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 48-6553 | Solder | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 6 | 1 A | Polyetheretherketone (PEEK), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 48 (2 x 24) | Beryllium Nickel | 0.100" (2.54mm) | Beryllium Nickel | 0.110" (2.78mm) | - | |||
28-6556-40 | 37.7800 | 4427 | 0.00000000 | Aries Electronics | 6556 | Bulk | Active | - | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 28-6556 | Solder Cup | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.180" (4.57mm) | - | |||
32-6556-41 | 47.9733 | 8513 | 0.00000000 | Aries Electronics | 6556 | Bulk | Active | - | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 32-6556 | Solder Cup | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.180" (4.57mm) | - | |||
36-6556-30 | 15.9939 | 5597 | 0.00000000 | Aries Electronics | 6556 | Bulk | Active | - | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 36-6556 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.423" (10.74mm) | - | |||
42-6556-31 | 29.0913 | 6219 | 0.00000000 | Aries Electronics | 6556 | Bulk | Active | - | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 42-6556 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.423" (10.74mm) | - | |||
42-6556-40 | 58.9963 | 4058 | 0.00000000 | Aries Electronics | 6556 | Bulk | Active | - | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 42-6556 | Solder Cup | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.180" (4.57mm) | - | |||
44-6556-30 | 16.2812 | 5344 | 0.00000000 | Aries Electronics | 6556 | Bulk | Active | - | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 44-6556 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.423" (10.74mm) | - | |||
48-6556-41 | 68.4400 | 5730 | 0.00000000 | Aries Electronics | 6556 | Bulk | Active | - | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 48-6556 | Solder Cup | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.180" (4.57mm) | - | |||
28-6556-30 | 13.7463 | 6669 | 0.00000000 | Aries Electronics | 6556 | Bulk | Active | - | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 28-6556 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.423" (10.74mm) | - | |||
32-6556-20 | 15.0531 | 4496 | 0.00000000 | Aries Electronics | 6556 | Bulk | Active | - | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 32-6556 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.283" (7.19mm) | - | |||
32-6556-31 | 23.0706 | 2723 | 0.00000000 | Aries Electronics | 6556 | Bulk | Active | - | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 32-6556 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.423" (10.74mm) | - | |||
36-6556-10 | 13.5025 | 2667 | 0.00000000 | Aries Electronics | 6556 | Bulk | Active | - | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 36-6556 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.130" (3.30mm) | - | |||
36-6556-11 | 17.2658 | 1828 | 0.00000000 | Aries Electronics | 6556 | Bulk | Active | - | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 36-6556 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.130" (3.30mm) | - | |||
36-6556-20 | 15.9939 | 4475 | 0.00000000 | Aries Electronics | 6556 | Bulk | Active | - | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 36-6556 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.283" (7.19mm) | - | |||
36-6556-21 | 25.7538 | 4302 | 0.00000000 | Aries Electronics | 6556 | Bulk | Active | - | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 36-6556 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.283" (7.19mm) | - | |||
42-6556-10 | 13.7866 | 5054 | 0.00000000 | Aries Electronics | 6556 | Bulk | Active | - | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 42-6556 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.130" (3.30mm) | - | |||
42-6556-21 | 29.0913 | 7282 | 0.00000000 | Aries Electronics | 6556 | Bulk | Active | - | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 42-6556 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.283" (7.19mm) | - | |||
44-6556-10 | 13.1191 | 4366 | 0.00000000 | Aries Electronics | 6556 | Bulk | Active | - | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 44-6556 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.130" (3.30mm) | - | |||
44-6556-11 | 18.1783 | 4738 | 0.00000000 | Aries Electronics | 6556 | Bulk | Active | - | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 44-6556 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.130" (3.30mm) | - | |||
48-6556-10 | 13.4852 | 8454 | 0.00000000 | Aries Electronics | 6556 | Bulk | Active | - | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 48-6556 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.130" (3.30mm) | - |
Daily average RFQ Volume
Standard Product Unit
Worldwide Manufacturers
In-stock Warehouse