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Sockets for ICs, Transistors(4545)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Type | Features | Base Product Number | Termination | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | ECCN | HTSUS | Standard Package | Current Rating (Amps) | Housing Material | Material Flammability Rating | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Convert From (Adapter End) | Convert To (Adapter End) | Number of Pins | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Material - Post | Termination Post Length | Contact Resistance | Board Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
44-3570-16 | 58.6350 |  |
2457 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 44-3570 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 44 (2 x 22) | Beryllium Nickel | 0.100" (2.54mm) | Beryllium Nickel | 0.110" (2.78mm) | - | |||||
|
11-0518-11H | 2.6058 | |
3807 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Through Hole | SIP | Open Frame | 11-0518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 11 (1 x 11) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | |||||
|
22-3503-20 | 9.2718 | |
1917 | 0.00000000 | Aries Electronics | 503 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame | 22-3503 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 22 (2 x 11) | Beryllium Copper | 0.100" (2.54mm) | Phosphor Bronze | 0.360" (9.14mm) | - | |||||
|
30-6503-31 | 20.9760 | |
1286 | 0.00000000 | Aries Electronics | 503 | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 30-6503 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 30 (2 x 15) | Beryllium Copper | 0.100" (2.54mm) | Phosphor Bronze | 0.500" (12.70mm) | - | |||||
|
18-3518-01 | 8.8275 | |
2717 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Open Frame | 18-3518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 18 (2 x 9) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | |||||
|
30-7375-10 | 15.3841 | |
6641 | 0.00000000 | Aries Electronics | 700 Elevator Strip-Line™ | Bulk | Active | -55°C ~ 105°C | Through Hole | SIP | Elevated | 30-7375 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1.5 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 30 (1 x 30) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.150" (3.81mm) | - | |||||
|
44-6551-18 | 153.9971 | |
7604 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | -55°C ~ 250°C | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 44-6551 | Solder | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyetheretherketone (PEEK), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 44 (2 x 22) | Beryllium Nickel | 0.100" (2.54mm) | Beryllium Nickel | 0.110" (2.78mm) | - | |||||
|
28-3508-31 | 29.0427 | |
3067 | 0.00000000 | Aries Electronics | 508 | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Open Frame | 28-3508 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.500" (12.70mm) | - | |||||
|
25-7390-10 | 13.2933 | |
5887 | 0.00000000 | Aries Electronics | 700 Elevator Strip-Line™ | Bulk | Active | -55°C ~ 105°C | Through Hole | SIP | Elevated | 25-7390 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1.5 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 25 (1 x 25) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.150" (3.81mm) | - | |||||
 |
48-6554-10 | 19.9900 | |
101 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 48-6554 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 6 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |||||
|
37-0511-11 | 24.5924 | |
3021 | 0.00000000 | Aries Electronics | 511 | Bulk | Active | -55°C ~ 125°C | Through Hole | SIP | - | 37-0511 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 37 (1 x 37) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.150" (3.81mm) | - | |||||
|
50-9518-10H | 11.3261 | |
8916 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Through Hole | DIP, 0.9" (22.86mm) Row Spacing | Open Frame | 50-9518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 50 (2 x 25) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | |||||
|
14-3508-201 | 8.1173 | |
2987 | 0.00000000 | Aries Electronics | 508 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Open Frame | 14-3508 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.360" (9.14mm) | - | |||||
|
06-3503-21 | 5.8337 | |
4552 | 0.00000000 | Aries Electronics | 503 | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame | 06-3503 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 6 (2 x 3) | Beryllium Copper | 0.100" (2.54mm) | Phosphor Bronze | 0.360" (9.14mm) | - | |||||
|
16-8510-310C | 10.0717 | |
9064 | 0.00000000 | Aries Electronics | 8 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame, Elevated | 16-8510 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | |||||
|
32-6574-16 | 40.1780 | |
6447 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 32-6574 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 10 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |||||
|
20-8375-310C | 12.7829 | |
4613 | 0.00000000 | Aries Electronics | 8 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame, Elevated | 20-8375 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 20 (2 x 10) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | |||||
|
18-8870-610C | 11.6535 | |
3283 | 0.00000000 | Aries Electronics | 8 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame, Elevated | 18-8870 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 18 (2 x 9) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | |||||
|
14-354000-10 | 22.5795 | |
5643 | 0.00000000 | Aries Electronics | Correct-A-Chip® 354000 | Bulk | Active | - | Surface Mount | - | 14-3540 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | DIP, 0.3" (7.62mm) Row Spacing | SOIC | 14 | Beryllium Copper | 0.050" (1.27mm) | Brass | - | - | ||||
|
20-7520-10 | 11.5988 | |
6551 | 0.00000000 | Aries Electronics | 700 Elevator Strip-Line™ | Bulk | Active | -55°C ~ 105°C | Through Hole | SIP | Elevated | 20-7520 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1.5 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 20 (1 x 20) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.150" (3.81mm) | - | |||||
|
30-6820-90C | 13.3282 | |
9475 | 0.00000000 | Aries Electronics | Vertisockets™ 800 | Bulk | Active | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 30-6820 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 30 (2 x 15) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | |||||
|
04-7445-10 | 5.1429 | |
4656 | 0.00000000 | Aries Electronics | 700 Elevator Strip-Line™ | Bulk | Active | -55°C ~ 105°C | Through Hole | SIP | Elevated | 04-7445 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 60 | 1.5 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 4 (1 x 4) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.150" (3.81mm) | - | |||||
|
05-0518-11 | 0.7272 | |
2519 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Through Hole | SIP | Open Frame | 05-0518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 5 (1 x 5) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | |||||
|
44-6575-11 | 32.6262 | |
1028 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 44-6575 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |||||
|
06-6513-11H | 2.6866 | |
4014 | 0.00000000 | Aries Electronics | Lo-PRO®file, 513 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 06-6513 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 6 (2 x 3) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | |||||
 |
16-35W000-11-RC | 22.1542 | |
2321 | 0.00000000 | Aries Electronics | Correct-A-Chip® 35W000 | Bulk | Active | - | Through Hole | - | 16-35W0 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | - | - | 0.050" (1.27mm) | - | - | Gold | 10.0µin (0.25µm) | SOIC-W | DIP, 0.3" (7.62mm) Row Spacing | 16 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | |||||
|
32-6508-201 | 13.5897 | |
4665 | 0.00000000 | Aries Electronics | 508 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 32-6508 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.360" (9.14mm) | - | |||||
|
32-6553-16 | 58.3775 | |
6418 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | -55°C ~ 250°C | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 32-6553 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 8 | 1 A | Polyetheretherketone (PEEK), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 32 (2 x 16) | Beryllium Nickel | 0.100" (2.54mm) | Beryllium Nickel | 0.110" (2.78mm) | - | |||||
|
145-PGM15023-10 | 18.2274 | |
1719 | 0.00000000 | Aries Electronics | PGM | Bulk | Active | -55°C ~ 105°C | Through Hole | PGA | - | 145-PGM | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.165" (4.19mm) | - | |||||
|
08-822-90C | 4.8551 | |
7337 | 0.00000000 | Aries Electronics | Vertisockets™ 800 | Bulk | Active | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame | 08-822 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 8 (2 x 4) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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